Renesas 71V65603S150BQI8
- Part No.:
- 71V65603S150BQI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S150BQI8.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,772
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Product details
Overview
71V65603S150BQI8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs - deployed in high-throughput packet buffering, network switch fabric control tables, and real-time DSP data caching.
For engineers reviewing the 71V65603S150BQI8 datasheet, 71V65603S150BQI8 pinout, 71V65603S150BQI8 application, or 71V65603S150BQI8 equivalent, key selection criteria include burst-mode timing compliance, industrial-temperature support (–40°C to +85°C), TQFP-100 package compatibility, and ZBT™-specific read/write interleaving behavior without dead cycles.
Technical Context
This SRAM implements a fully synchronous, positive-edge-triggered interface with registered address, control, and I/O paths. Its ZBT™ architecture eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions using internal burst counters and ADV/LD-controlled address sequencing.
The device supports 4-word linear or interleaved bursts via LBO pin configuration, individual byte write enables (BW1–BW4), and asynchronous sleep mode (ZZ) for power gating. All synchronous inputs - including R/W, CEN, CE1/CE2/CE2, and ADV/LD - are sampled on the rising CLK edge with setup/hold timing referenced to that edge.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); fixed configuration for this part number - not field-configurable |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained burst transfers |
| Access Time | 3.8 ns clock-to-data (tCD); defines minimum latency from CLK edge to valid output data |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails reduce noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for extended thermal cycling in telecom infrastructure |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency |
| Power-Down Mode | Asynchronous ZZ input gates internal clock; retains data while reducing active current to standby level |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant. Pinout validated per IDT71V65603 PKG100 drawing (Rev. 6.42).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Primary timing reference; all synchronous registers triggered on rising edge |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction two cycles later |
| ADV/LD | Burst Address Control | LOW loads external address; HIGH advances internal burst counter - critical for burst sequencing |
| LBO | Burst Order Select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word sequence |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for 9-bit bytes; allows partial-word writes without masking logic |
| CE1, CE2, CE2 | Chip Enables | Three-input enable scheme (CE1=L, CE2=L, CE2=H required); supports depth expansion with no glue logic |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered input/output paths ensure timing closure at 150 MHz |
| ZZ | Sleep Mode Input | Asynchronous low-power entry; gates CLK internally while preserving memory contents |
| OE | Output Enable | Asynchronous; tri-states outputs immediately - optional for ZBT™ operation due to pipelined output buffer |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead cycles between read/write transitions - enables continuous 150 MHz bus utilization in switch fabric buffers |
| Pipelined Output Buffer | Internally synchronized OE replacement - removes need for external OE timing control in high-speed systems |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write | Enables precise 9-bit updates without full-word overwrite - critical for protocol header modification in networking ASICs |
| Three Chip Enables | Allows seamless depth expansion across multiple devices using standard CE logic - no address decoding overhead |
Applications
| Network Packet Buffering | Telecom Switch Fabric Control Tables |
|---|---|
Use Scenario: Storing ingress/egress packet descriptors and metadata in Layer 2/3 switches operating at 10 Gbps+ line rates. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM serving as descriptor cache with deterministic 3.8 ns read access and zero-turnaround burst writes. Use Value: Enables full-line-rate forwarding by eliminating bus idle cycles during descriptor updates and lookups. | Use Scenario: Holding forwarding table entries, VLAN mappings, and QoS policy rules in carrier-grade Ethernet switches. IC Role / Device Role / Timing Role: Synchronous SRAM providing concurrent read/write access to control plane data with 150 MHz throughput. Use Value: Supports real-time rule updates without stalling traffic flow - critical for dynamic service provisioning. |
| DSP Data Caching | Industrial Real-Time Control Memory |
Use Scenario: Acting as fast-access scratchpad for FFT coefficients, filter taps, and intermediate results in multi-core DSP subsystems. IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to DSP EMIF with pipelined outputs aligned to processor clock domain. Use Value: Delivers 4× data per address cycle, reducing external memory bandwidth demand by 75% versus non-burst operation. | Use Scenario: Storing motion control trajectory points, PID loop history, and sensor fusion buffers in CNC controllers and robotics drives. IC Role / Device Role / Timing Role: Industrial-temperature SRAM (–40°C to +85°C) with ZZ sleep mode for energy-efficient periodic sampling. Use Value: Guarantees data retention during microsecond-scale sleep intervals while meeting EN 61000-6-2 EMC immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV18-167BZC | 512K × 18-bit organization; 167 MHz max frequency; different burst addressing (no ADV/LD pin) | Higher density but narrower data bus; requires external multiplexing for 36-bit interfaces | Select only if system uses 18-bit data path and prioritizes higher density over ZBT™-style zero-turnaround behavior |
| AS7C3256B-15JIN | Commercial-grade (0°C to +70°C); no ZZ sleep mode; asynchronous OE required; 15 ns access (slower than 3.8 ns) | Not suitable for industrial environments or low-power sleep modes; lacks burst counter and pipelined outputs | Consider only for cost-sensitive, non-real-time applications where 150 MHz timing and ZBT™ features are unnecessary |
Compared with CY7C1362BV18-167BZC and AS7C3256B-15JIN, the 71V65603S150BQI8 uniquely delivers 256K × 36-bit width with true ZBT™ zero-turnaround, industrial temperature rating, and integrated burst counter - making it irreplaceable in telecom packet buffers requiring deterministic 3.8 ns access and 4-word burst efficiency.
Availability
71V65603S150BQI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric control tables, and industrial real-time control memory requiring stable component supply, long-term lifecycle assurance, and industrial-temperature qualification.
Supply support for 71V65603S150BQI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65603S150BQI8 belongs to Renesas' legacy ZBT™ SRAM product line, engineered specifically for high-speed, low-latency data buffering in networking and telecom infrastructure where bus turnaround overhead must be eliminated.
FAQ
What is the memory organization of the 71V65603S150BQI8?
The 71V65603S150BQI8 is a fixed 256K × 36-bit synchronous SRAM (9,437,184 bits total). It does not support reconfiguration to 512K × 18-bit - that variant is implemented in the pin-compatible 71V65803. This organization provides 36-bit wide data paths ideal for network descriptor storage and DSP coefficient alignment.
Does the 71V65603S150BQI8 support burst read and write operations?
Yes, the 71V65603S150BQI8 supports 4-word synchronous bursts in both linear and interleaved sequences, controlled by the LBO pin. Burst initiation requires ADV/LD = HIGH after initial address load, and each burst word appears two clock cycles after the corresponding ADV/LD assertion - a core feature of its ZBT™ architecture.
What is the function of the ADV/LD pin on the 71V65603S150BQI8?
The ADV/LD pin on the 71V65603S150BQI8 serves dual functions: when sampled LOW at the rising CLK edge, it loads a new external address; when sampled HIGH, it advances the internal burst counter. This pin is essential for managing burst sequences and cannot be tied off - its state directly determines whether the device performs a new address load or continues a burst.
Is the 71V65603S150BQI8 compatible with industrial temperature requirements?
Yes, the 71V65603S150BQI8 is rated for industrial temperature operation from –40°C to +85°C, as confirmed in the "Recommended Operating Temperature and Supply Voltage" table. This makes it suitable for deployment in base stations, industrial PLCs, and outdoor networking equipment where ambient conditions exceed commercial-grade limits.
How does the ZBTTM feature improve system performance in the 71V65603S150BQI8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S150BQI8 eliminates idle cycles between consecutive read and write operations. Unlike conventional SRAMs requiring bus release/reacquisition, the 71V65603S150BQI8 permits immediate back-to-back accesses - delivering sustained 150 MHz throughput in packet buffering and switch fabric applications where latency predictability is critical.
71V65603S150BQI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S150BQI8 FAQ
1.How can I place an order for 71V65603S150BQI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S150BQI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V65603S150BQI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S150BQI8 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S150BQI8?
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6.How does Aetrix verify that 71V65603S150BQI8 is sourced from the original manufacturer or authorized distributors?
All 71V65603S150BQI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S150BQI8 meets industry standards.
7.What is the process for return or replacement of 71V65603S150BQI8?
All 71V65603S150BQI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S150BQI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S150BQI8 part is unused and in its original packaging.
Return procedure for 71V65603S150BQI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S150BQI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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