Renesas 71V65603S150PFGI
- Part No.:
- 71V65603S150PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65603S150PFGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S150PFGI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature (–40°C to +85°C) in a 100-pin TQFP package. Used in high-speed packet buffering for network switches and telecom line cards.
For engineers reviewing the 71V65603S150PFGI datasheet, 71V65603S150PFGI pinout, 71V65603S150PFGI application, or 71V65603S150PFGI equivalent, key selection criteria include ZBT™ timing compliance, 3.3V I/O and core supply tolerance, burst counter behavior under ADV/LD control, and byte-write enable (BW1–BW4) support for partial writes without bus contention.
Technical Context
The 71V65603S150PFGI implements a fully synchronous, clock-edge-triggered interface with address/control/data registers sampled on the rising CLK edge. Its ZBT™ architecture eliminates dead cycles between read/write transitions via internal burst counter coordination and pipelined output registers.
It features three chip enables (CE1, CE2, CE2) with two-cycle deselect timing, asynchronous OE and ZZ inputs, static LBO configuration for burst order, and individual byte write enables (BW1–BW4) that allow selective 9-bit word updates within the 36-bit data bus - all synchronized to CLK and controlled by R/W and ADV/LD state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports depth expansion via CE pins |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained burst throughput |
| Clock-to-Data Access | 3.8 ns typical; defines minimum latency from CLK edge to valid Q output |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails reduce noise coupling |
| Operating Temperature | –40°C to +85°C industrial grade; validated for embedded telecom infrastructure |
| Burst Capability | 4-word linear or interleaved burst; initiated by ADV/LD high, sequenced by LBO pin |
| Byte Write Control | BW1–BW4 enable independent 9-bit writes; avoids full-word overwrite in cache coherency logic |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per PKG100 configuration for 256K × 36 mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK when ADV/LD low and CEN low |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle direction; determines read vs. write two cycles later |
| ADV/LD | Burst Counter Control | Loads new external address (low) or advances internal burst counter (high) |
| BW1–BW4 | Byte Write Enables | Active-low 9-bit write masks; each controls one 9-bit segment of 36-bit I/O bus |
| CE1, CE2, CE2 | Chip Enables | Three-input decode: CE1=L, CE2=L, CE2=H selects device; any violation initiates two-cycle deselect |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered input/output paths ensure timing closure |
| ZZ | Sleep Mode Input | Asynchronous gate for CLK; reduces power to retention level while preserving data |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between consecutive reads/writes - critical for back-to-back packet processing |
| Pipelined Outputs | Output register decouples data validity from address setup; enables stable timing at 150 MHz |
| Internally Synchronized OE | OE is asynchronous but internally synchronized to CLK; removes need for external OE timing control |
| Single R/W Pin | Reduces control bus complexity versus separate RD/WR signals - simplifies FPGA interface logic |
| Individual Byte Write | Four independent 9-bit write enables allow granular memory updates without disturbing adjacent bytes |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in multi-gigabit switch ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly to MAC-layer controllers via synchronous burst protocol. Use Value: 3.8 ns clock-to-data access and zero bus turnaround enable back-to-back frame writes/reads without pipeline stalls. | Use Scenario: Holding real-time voice sample buffers and signaling tables in carrier-grade TDM-over-IP gateways. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing deterministic 150 MHz burst access for DSP co-processors and framer ICs. Use Value: –40°C to +85°C rating and 3.3V I/O compatibility ensure reliability in uncontrolled telco cabinet environments. |
| Baseband Processing Cache | Radar Signal Processing FIFO |
Use Scenario: Serving as L2 cache for LTE/5G baseband processors handling channel estimation and modulation/demodulation. IC Role / Device Role / Timing Role: Pipelined ZBT SRAM delivering burst-aligned data to multi-core DSP clusters with minimal wait states. Use Value: 4-word burst capability with programmable linear/interleaved order matches FFT and convolution memory access patterns. | Use Scenario: Implementing high-speed acquisition FIFOs in phased-array radar receivers requiring sub-10 ns timing resolution. IC Role / Device Role / Timing Role: Synchronous SRAM acting as first-stage data capture buffer between ADCs and FPGA-based beamforming engines. Use Value: Asynchronous ZZ sleep mode and low-power retention support duty-cycled radar pulse operation without data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV18 | 512K × 18 organization, same 150 MHz speed, but no ZBT™ architecture - uses conventional burst with turnaround penalty | Requires additional bus arbitration logic to avoid dead cycles in mixed read/write streams | Select only if memory density > 9.44 Mbit is required and ZBT™ timing is not critical |
| AS7C33128PFSIG | 32M × 32-bit QDR II+ SRAM, 300 MHz interface, differential clocks - higher bandwidth but incompatible pinout and protocol | Designed for graphics and AI accelerators; lacks ADV/LD burst control and byte-write granularity | Choose only for new designs targeting >2× bandwidth and willing to redesign PCB and firmware |
Compared with CY7C1362BV18 and AS7C33128PFSIG, the 71V65603S150PFGI uniquely delivers zero bus turnaround at 150 MHz in a 100-pin TQFP, enabling deterministic latency in telecom buffering where mixed read/write bursts dominate - a capability neither alternative provides without architectural trade-offs.
Availability
71V65603S150PFGI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and radar signal processing FIFO applications requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for 71V65603S150PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65603S150PFGI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed networking and telecom infrastructure where deterministic burst access, zero bus turnaround, and industrial reliability are mandatory.
FAQ
What is the memory organization and total capacity of the 71V65603S150PFGI?
The 71V65603S150PFGI is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration supports 36-bit wide data transfers and is optimized for systems requiring high-throughput burst access, such as packet-switching fabric buffers. The part does not support 512K × 18 mode - that is exclusive to the 71V65803 variant.
Does the 71V65603S150PFGI support both linear and interleaved burst sequences?
Yes, the 71V65603S150PFGI supports both linear and interleaved 4-word burst sequences, selected by the static LBO (Linear Burst Order) pin: LBO = LOW enables linear order, LBO = HIGH enables interleaved order. This flexibility allows alignment with specific memory access patterns in DSP or networking applications without firmware modification.
How does the ZBTTM feature eliminate dead cycles in the 71V65603S150PFGI?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S150PFGI eliminates dead cycles by synchronizing read and write operations through an internal burst counter and pipelined output registers. When transitioning between read and write bursts, the device uses ADV/LD and R/W states to coordinate bus direction without inserting idle cycles - verified in timing diagrams showing continuous data flow across n+2 to n+5 cycles.
What are the voltage requirements for VDD and VDDQ on the 71V65603S150PFGI?
The 71V65603S150PFGI requires VDD = 3.3 V ±5% (3.135 V to 3.465 V) for core logic and VDDQ = 3.3 V ±5% for I/O drivers. These rails may be supplied independently to minimize switching noise coupling. The absolute maximum terminal voltage is +4.6 V, but operation outside the recommended range risks timing violations or data corruption.
Can the 71V65603S150PFGI operate in low-power mode, and how is it controlled?
Yes, the 71V65603S150PFGI supports low-power sleep mode via the asynchronous ZZ input. When ZZ is driven HIGH, the internal clock is gated and the device enters its lowest power state while retaining memory contents. Data retention is guaranteed across the full industrial temperature range (–40°C to +85°C), making it suitable for duty-cycled radar or battery-backed systems.
71V65603S150PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65603S150PFGI FAQ
1.How can I place an order for 71V65603S150PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S150PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S150PFGI reliable?
The price and inventory of 71V65603S150PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S150PFGI is usually 5 days.
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Once your 71V65603S150PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S150PFGI?
For technical support, including 71V65603S150PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S150PFGI requirements.
6.How does Aetrix verify that 71V65603S150PFGI is sourced from the original manufacturer or authorized distributors?
All 71V65603S150PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S150PFGI meets industry standards.
7.What is the process for return or replacement of 71V65603S150PFGI?
All 71V65603S150PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S150PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S150PFGI part is unused and in its original packaging.
Return procedure for 71V65603S150PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S150PFGI Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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