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Renesas 71V65603S150PFGI8

Part No.:
71V65603S150PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65603S150PFGI8.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,630

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Product details

Overview

71V65603S150PFGI8 from Renesas Electronics is a 256K × 36-bit (9.44 Mbit), 3.3V synchronous ZBT™ SRAM with zero bus turnaround, 150 MHz operation (3.8 ns clock-to-data access), pipelined outputs, and 4-word burst capability. It features three chip enables, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). It serves as high-speed buffer memory in network packet processors and telecom line cards requiring deterministic read/write interleaving.

For engineers reviewing the 71V65603S150PFGI8 datasheet, 71V65603S150PFGI8 pinout, 71V65603S150PFGI8 application, or 71V65603S150PFGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, and support for linear/interleaved burst modes via LBO control.

Technical Context

This SRAM implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between consecutive reads and writes by overlapping bus turnaround with internal pipeline stages - enabling back-to-back accesses without OE control or external bus arbitration logic.

The device integrates a 4-word burst counter, selectable via ADV/LD and LBO pins, and supports both linear and interleaved burst sequences. Internal output buffer synchronization removes the need for active OE management, while CEN provides clock gating for power-down during idle periods without disrupting register state.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.44 Mbit) - delivers 144-bit wide data path per access for high-throughput buffering
Max Clock Frequency150 MHz - enables 6.67 ns cycle time for real-time packet header processing in switch fabric interfaces
Clock-to-Data Access3.8 ns - guarantees deterministic latency from CLK edge to valid Q output, critical for timing-critical pipelines
Supply VoltagesVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - requires dual 3.3V rails; no level translation needed for compatible controllers
Operating Temperature–40°C to +85°C - qualified for industrial-grade deployment in base station and industrial automation systems
Burst Capability4-word linear or interleaved burst - reduces address bus overhead and improves bandwidth efficiency in sequential access patterns
Power-Down ModeZZ input controls sleep mode - reduces standby current to minimum retention level while preserving data integrity

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant (PFGI8 suffix).

Pin/TerminalCircuit RoleDesign Meaning
CLKClock InputPositive-edge-triggered master timing reference; all synchronous registers latch on rising edge
A0–A17Address Inputs18-bit address bus supporting 256K depth; latched synchronously with CLK, ADV/LD, and CE
R/WRead/Write ControlSynchronous signal defining access type; determines data direction two cycles later
ADV/LDBurst Address ControlLoads new external address (LOW) or increments internal burst counter (HIGH)
LBOBurst Order SelectStatic input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence
BW1–BW4Byte Write EnablesFour independent active-low enables for 9-bit byte segments; allows partial-word writes without masking logic
CE1, CE2, CE2Chip EnablesThree enables (CE1/CE2 active-low, CE2 active-high) for flexible depth expansion and hierarchical decoding
OEOutput EnableAsynchronous; tri-states I/Os when HIGH - optional for ZBT™ operation but required for shared-bus isolation
ZZSleep Mode InputAsynchronous gate for internal clock; places device in lowest-power retention state while preserving memory contents
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional data bus with registered input/output paths; supports concurrent read-modify-write in burst mode

Key Features

FeatureDesign Value
ZBT™ Zero Bus TurnaroundEliminates dead cycles between read/write transitions - enables continuous 150 MHz bus utilization without external arbitration
Pipelined Output BuffersInternally synchronized outputs remove need for OE timing control - simplifies PCB layout and timing closure
4-Word Burst CounterReduces address bus toggling by 75% during sequential accesses - lowers EMI and system-level power consumption
Individual Byte Write (BW1–BW4)Enables precise 9-bit segment updates without full-word overwrite - preserves adjacent data in cache-line operations
Three Chip Enables (CE1/CE2/CE2)Supports seamless depth expansion across multiple devices - eliminates external decode logic for multi-SRAM configurations

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as ingress/egress packet buffer with deterministic 3.8 ns read access and zero-turnaround write-read switching.

Use Value: Enables sustained 150 MHz throughput across mixed read/write traffic, eliminating pipeline stalls caused by traditional SRAM bus turnaround delays.

Use Scenario: Holding ATM cell headers and control metadata in OC-192 SONET framer modules.

IC Role / Device Role / Timing Role: Synchronous burst-access memory interfacing directly with framer ASICs requiring 4-word linear bursts for header parsing.

Use Value: Reduces address bus activity by 75% during header fetch sequences, lowering signal integrity risk and power in dense line card designs.

Industrial PLC Data CacheMedical Imaging Frame Buffer

Use Scenario: Caching real-time sensor fusion data in programmable logic controllers operating in harsh industrial environments.

IC Role / Device Role / Timing Role: Industrial-temperature-rated (–40°C to +85°C) ZBT™ SRAM providing deterministic access for motion control loop buffers.

Use Value: Guarantees uninterrupted 150 MHz operation under thermal stress, avoiding timing violations that could trigger safety shutdowns.

Use Scenario: Temporary storage of uncompressed DICOM image tiles during real-time MRI reconstruction.

IC Role / Device Role / Timing Role: High-bandwidth, low-jitter memory serving as frame buffer between FPGA-based reconstruction engine and display controller.

Use Value: Pipelined outputs and burst capability deliver sustained >1.2 GB/s effective bandwidth, meeting real-time rendering deadlines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-167BZI167 MHz max frequency; 256K × 36 organization; uses QDR-II interface with separate read/write data busesRequires QDR-II controller interface; not ZBT™-compatible; higher peak bandwidth but different protocol stackSelect only if migrating to QDR-II architecture; not drop-in for ZBT™-based designs
AS7C33128P-15TIN15 ns async access; 256K × 36 organization; asynchronous SRAM with no burst or pipeliningLacks ZBT™, burst, or clocked interface - requires external timing control and bus arbitrationUse only in legacy systems where synchronous timing constraints are absent or handled externally

Compared with CY7C1362BV33-167BZI and AS7C33128P-15TIN, the 71V65603S150PFGI8 uniquely delivers ZBT™-enabled zero-turnaround operation at 150 MHz within a standard synchronous SRAM interface - making it optimal for upgrading existing ZBT™-based systems without controller redesign.

Availability

71V65603S150PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data caching requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.

Supply support for 71V65603S150PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65603S150PFGI8 belongs to Renesas' high-performance ZBT™ SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in telecom switching, networking, and real-time control applications.

FAQ

What is the maximum operating frequency of the 71V65603S150PFGI8?

The 71V65603S150PFGI8 is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period and a guaranteed 3.8 ns clock-to-data access time. This specification is validated across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions, ensuring reliable high-speed operation in demanding embedded systems.

Does the 71V65603S150PFGI8 support burst read and write operations?

Yes, the 71V65603S150PFGI8 supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin. Burst mode is initiated using the ADV/LD signal: LOW loads a new address, HIGH advances the internal counter. Each burst cycle delivers four consecutive words with a single address setup, reducing bus overhead and improving effective bandwidth.

How does the ZBT™ feature of the 71V65603S150PFGI8 eliminate bus turnaround delays?

The ZBT™ feature in the 71V65603S150PFGI8 eliminates dead cycles between read and write operations by overlapping bus direction changes with internal pipeline stages. Unlike conventional SRAMs requiring OE deassertion and bus float time, this device allows immediate back-to-back read/write transitions - enabling continuous 150 MHz bus utilization without external arbitration logic or timing penalties.

What package type and pin count does the 71V65603S150PFGI8 use?

The 71V65603S150PFGI8 is supplied in a JEDEC-standard 100-pin thin quad flatpack (TQFP) package, measuring 14 mm × 20 mm. The PFGI8 suffix denotes lead-free, RoHS-compliant construction with industrial temperature rating (–40°C to +85°C). Pinout is fully documented for TQFP-100, including dedicated I/O banks, power/ground distribution, and ZBT™-specific control signals.

Can the 71V65603S150PFGI8 operate with independent core and I/O voltages?

Yes, the 71V65603S150PFGI8 employs separate VDD (core) and VDDQ (I/O) supplies, both specified at 3.3 V ±5%. This separation allows optimized noise isolation between logic and data paths and supports clean signal integrity on the 36-bit I/O bus. Both rails must be powered simultaneously during operation; sequencing is not required, but no I/O pin voltage may exceed VDDQ during power ramp-up.

71V65603S150PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65603S150PFGI8 FAQ

1.How can I place an order for 71V65603S150PFGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65603S150PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65603S150PFGI8 reliable?

The price and inventory of 71V65603S150PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S150PFGI8 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S150PFGI8 transactions.

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4.How is shipping managed for 71V65603S150PFGI8?

71V65603S150PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65603S150PFGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65603S150PFGI8?

For technical support, including 71V65603S150PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S150PFGI8 requirements.

6.How does Aetrix verify that 71V65603S150PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65603S150PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S150PFGI8 meets industry standards.

7.What is the process for return or replacement of 71V65603S150PFGI8?

All 71V65603S150PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S150PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65603S150PFGI8 part is unused and in its original packaging.

Return procedure for 71V65603S150PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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