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Renesas 71V65703S75BG

Part No.:
71V65703S75BG
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65703S75BG.pdf
Description:
IC SRAM 9MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,738

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Product details

Overview

71V65703S75BG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 100 MHz operation (7.5 ns clock-to-data access), zero bus turnaround architecture, flow-through outputs, and 4-word burst capability. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA-based data-path acceleration where deterministic latency and seamless read/write transitions are critical.

For engineers reviewing the 71V65703S75BG datasheet, 71V65703S75BG pinout, 71V65703S75BG application, or 71V65703S75BG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and 3.3V I/O supply (VDDQ) decoupling requirements for signal integrity in high-frequency bus interfaces.

Technical Context

The 71V65703S75BG implements a synchronous, clock-driven interface with registered address/control inputs and flow-through (unregistered) data outputs. Its internal burst counter advances on ADV/LD = HIGH, supporting linear or interleaved sequences selected by LBO, and enables four consecutive data cycles per address load.

ZBTTM functionality eliminates dead cycles between read and write operations via synchronized chip enable (CE1/CE2/CE2) and R/W control, while internally synchronized OE eliminates external timing constraints. Power-down is managed asynchronously via ZZ, retaining data at minimum VDD/VDDQ current draw.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9.4 Mbit); supports high-bandwidth parallel data paths in networking ASICs
Clock Frequency 100 MHz max; enables 10 ns cycle time for real-time packet buffering in 10G+ systems
Access Time 7.5 ns clock-to-data (tCD); guarantees deterministic output valid window for synchronous bus capture
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); requires separate decoupling for noise isolation
Operating Temperature –40°C to +85°C (industrial grade); validated for base station and industrial controller environments
Burst Capability 4-word linear/interleaved burst (LBO-controlled); reduces address bus toggling and improves throughput efficiency
Byte Write Control BW1–BW4 active-low enables per-9-bit byte writes; allows partial word updates without read-modify-write overhead

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout conforms to PKG100 configuration for 256K × 36 organization.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Synchronous edge-trigger for all register loads; all timing referenced to rising edge
A0–A17 Address inputs 18-bit address bus for 256K depth; sampled on rising CLK with ADV/LD low
R/W Read/Write control Synchronous signal defining cycle type; determines data direction one cycle later
ADV/LD Advance burst / Load address LOW loads new external address; HIGH increments internal burst counter
LBO Linear/Interleaved burst order Static input selecting burst sequence; must remain stable during burst operation
BW1–BW4 Byte write enables Active-low per-byte controls; allow selective 9-bit writes without disturbing other bytes
CE1, CE2, CE2 Chip enables Three independent enables (CE1/CE2 active-low, CE2 active-high) for depth expansion
OE Output enable Asynchronous; tri-states outputs immediately when HIGH-no timing coordination needed
ZZ Sleep mode Asynchronous power-down; gates internal clock and reduces IDD to retention level
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional bus; input path registered, output path flow-through (no output register)

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates idle cycles between read/write transitions-enables back-to-back memory accesses without bus arbitration delay
Internally synchronized OE Removes need for precise OE timing control; simplifies PCB layout and reduces setup/hold margining effort
Single R/W pin Reduces control signal count vs. separate RD/WR lines-saves FPGA I/O pins and routing resources
4-word burst with LBO select Configurable linear/interleaved addressing supports both cache-line and FIFO-style data streaming patterns
Individual byte write (BW1–BW4) Enables atomic 9-bit updates-critical for protocol header manipulation and metadata patching without full-word overwrite
Three chip enables (CE1/CE2/CE2) Supports seamless depth expansion across multiple devices without external logic or address decoding complexity

Applications

Network Packet Buffering FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and payloads in 10G Ethernet line cards with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer between MAC and traffic manager.

Use Value: 7.5 ns tCD and ZBTTM ensure sub-10 ns read-to-write turnaround-critical for cut-through switching performance.

Use Scenario: Providing scratchpad memory for FPGA-based digital signal processing engines handling real-time video encoding.

IC Role / Device Role / Timing Role: Burst-capable synchronous SRAM supplying pixel blocks to parallel ALU clusters.

Use Value: 4-word interleaved burst delivers 144-bit chunks per cycle-matching 36-bit AXI4 data width and maximizing bandwidth utilization.

Telecom Baseband Processing Industrial Motion Controller Buffer

Use Scenario: Temporary storage of channelized TDM frames in wireless base station transceivers before modulation.

IC Role / Device Role / Timing Role: Deterministic-access memory interfacing directly with DSP DMA controllers.

Use Value: Industrial temp rating (–40°C to +85°C) and VDDQ decoupling support ensure reliability in uncooled outdoor enclosures.

Use Scenario: Holding motion profile segments and encoder feedback history in closed-loop servo drives.

IC Role / Device Role / Timing Role: Real-time buffer synchronizing position commands with hardware PWM generation.

Use Value: Byte-write capability (BW1–BW4) allows updating individual axis parameters without corrupting adjacent motor control words.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-100AXC 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and no ZBTTM Requires dual-port bus management; lacks zero-turnaround benefit for mixed-access workloads Prefer when simultaneous read/write concurrency is required over deterministic turnaround
AS7C3256A-10JIN 256K × 36, 10 ns access, asynchronous interface-no clock, no burst, no ZBT features Lower speed, higher latency, no burst or byte-write control; simpler timing but limited to legacy designs Choose only for cost-sensitive, non-real-time applications where synchronous timing is unnecessary

Compared with CY7C1362BV33-100AXC and AS7C3256A-10JIN, the 71V65703S75BG uniquely delivers ZBTTM-enabled seamless read/write transitions and flow-through outputs-making it optimal for latency-critical, burst-oriented data-path buffering where deterministic timing outweighs port concurrency or legacy compatibility.

Availability

71V65703S75BG is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and industrial motion controller buffer applications requiring stable component supply, long-term lifecycle assurance, and industrial-grade temperature compliance.

Supply support for 71V65703S75BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V65703S75BG belongs to IDT's ZBT™ SRAM product line-designed specifically for zero-latency, burst-capable memory subsystems in high-speed networking and real-time embedded systems.

FAQ

What is the maximum operating frequency and corresponding access time for the 71V65703S75BG?

The 71V65703S75BG operates at up to 100 MHz with a guaranteed clock-to-data access time (tCD) of 7.5 ns. This specification is validated under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply, ensuring deterministic timing for real-time data-path applications. The 71V65703S75BG achieves this performance using a high-speed CMOS process and flow-through output architecture.

Does the 71V65703S75BG support both linear and interleaved burst modes, and how is selection controlled?

Yes, the 71V65703S75BG supports both linear and interleaved 4-word burst sequences. Selection is controlled by the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear mode, LBO = HIGH selects interleaved mode. LBO is a static input and must remain stable during burst operation-changing it mid-burst may cause undefined address sequencing in the 71V65703S75BG.

How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S75BG?

ZBTTM in the 71V65703S75BG eliminates idle bus cycles between successive read and write operations by synchronizing chip enable (CE1/CE2/CE2) and R/W control with the internal burst counter. When transitioning from read to write (or vice versa), the 71V65703S75BG completes the current cycle and initiates the next without inserting wait states-enabling true back-to-back memory access at full clock rate.

What are the power supply requirements for the 71V65703S75BG, and are VDD and VDDQ independently decoupled?

The 71V65703S75BG requires two independent 3.3 V supplies: VDD (core, 3.3 V ±5%) and VDDQ (I/O, 3.3 V ±5%). Per the datasheet, they must be decoupled separately using dedicated ceramic capacitors near respective power pins. This separation prevents I/O switching noise from modulating core voltage-ensuring stable internal timing and signal integrity on the 36-bit data bus of the 71V65703S75BG.

Can the 71V65703S75BG operate in low-power mode, and how is it activated?

Yes, the 71V65703S75BG supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and the device enters retention mode with drastically reduced IDD while preserving memory contents. Data retention is guaranteed across the full industrial temperature range, making the 71V65703S75BG suitable for power-gated subsystems in telecom and industrial equipment.

71V65703S75BG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65703S75BG FAQ

1.How can I place an order for 71V65703S75BG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S75BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65703S75BG reliable?

The price and inventory of 71V65703S75BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S75BG is usually 5 days.

3.What payment methods are accepted for 71V65703S75BG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S75BG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65703S75BG?

71V65703S75BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65703S75BG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S75BG?

For technical support, including 71V65703S75BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S75BG requirements.

6.How does Aetrix verify that 71V65703S75BG is sourced from the original manufacturer or authorized distributors?

All 71V65703S75BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S75BG meets industry standards.

7.What is the process for return or replacement of 71V65703S75BG?

All 71V65703S75BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S75BG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S75BG part is unused and in its original packaging.

Return procedure for 71V65703S75BG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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