Renesas 71V65703S75BQ8
- Part No.:
- 71V65703S75BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S75BQ8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S75BQ8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K x 36 (9,437,184-bit), featuring zero bus turnaround, 100 MHz operation (7.5 ns clock-to-data access), flow-through outputs, and 4-word burst capability with linear or interleaved sequencing. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA co-processor interfaces requiring deterministic latency and no dead cycles between read/write transitions.
For engineers reviewing the 71V65703S75BQ8 datasheet, 71V65703S75BQ8 pinout, 71V65703S75BQ8 application, or 71V65703S75BQ8 equivalent, key selection criteria include its ZBT architecture for bus efficiency, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and synchronous control with single R/W pin and internal burst counter - critical for real-time data buffering in high-throughput switching systems.
Technical Context
The 71V65703S75BQ8 implements a synchronous dual-edge-triggered interface with all address/control inputs registered on the rising CLK edge, while data outputs are flow-through (no output register). Its ZBT architecture eliminates bus turnaround delay by enabling immediate read-after-write or write-after-read transitions without idle cycles.
It integrates a programmable burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved 4-word sequences. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion and includes asynchronous OE and ZZ pins for output control and sleep mode entry, respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9.4 Mbit); supports high-bandwidth parallel data paths in networking ASICs. |
| Max Clock Frequency | 100 MHz; enables 10 ns cycle time for sustained burst transfers in real-time packet buffering. |
| Clock-to-Data Access | 7.5 ns; guarantees deterministic read latency for time-critical control-plane applications. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); ensures compatibility with 3.3V logic families and low-noise I/O switching. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in uncontrolled ambient environments like base station cabinets. |
| Burst Mode | 4-word linear/interleaved burst via ADV/LD and LBO; reduces address bus overhead and improves throughput in sequential access patterns. |
| Zero Bus Turnaround | ZBT™ architecture eliminates dead cycles between read/write transitions; essential for full-duplex memory arbitration in switch fabric controllers. |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, compatible with standard surface-mount assembly processes and thermal management for industrial-grade reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge synchronous reference for all registered inputs; timing anchor for 100 MHz operation. |
| A0–A17 | Address inputs | 18-bit address bus for 256K-depth addressing; synchronous sampling with ADV/LD determines load vs. increment behavior. |
| R/W | Read/Write control | Single synchronous signal defining cycle type; sampled at rising CLK edge to initiate read or write one cycle later. |
| ADV/LD | Advance burst / Load address | Synchronous control: LOW loads new external address; HIGH advances internal burst counter - enables seamless burst sequencing. |
| LBO | Linear/Interleaved burst order | Static input selecting burst pattern; critical for matching memory controller expectations in cache or FIFO implementations. |
| BW1–BW4 | Byte write enables | Four independent active-low signals controlling 9-bit byte writes; allows partial-word updates without disturbing adjacent data. |
| CE1, CE2, CE2 | Chip enables | Three enables (CE1/CE2 active-low, CE2 active-high) support flexible depth expansion and hierarchical memory mapping. |
| OE | Output enable | Asynchronous control; tri-states I/Os independently of clock - simplifies bus sharing and hot-swap designs. |
| ZZ | Sleep mode | Asynchronous entry into low-power state; gates internal clock and maintains data retention - reduces system standby power. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional flow-through data path; no output register enables minimal read latency but requires precise timing closure. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes - enables 100% bus utilization in burst-intensive packet buffering. |
| Internally synchronized OE | Removes need for external OE timing control; OE can be tied low for simplified PCB layout and reduced signal routing complexity. |
| 4-word burst counter | Reduces address bus activity by 75% during sequential accesses - lowers EMI and improves bandwidth efficiency in backplane interfaces. |
| Individual byte write (BW1–BW4) | Enables granular 9-bit updates without read-modify-write; preserves integrity of adjacent bytes in multi-threaded control register banks. |
| Power-down via ZZ pin | Reduces active current to <100 µA while retaining memory contents - supports energy-efficient idle states in telecom line cards. |
Applications
| Network Packet Buffering | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches before classification and forwarding decisions. IC Role / Device Role / Timing Role: High-speed synchronous SRAM acting as low-latency first-level buffer with deterministic 7.5 ns read access and zero-turnaround write-read transitions. Use Value: Enables line-rate packet processing at 10 Gbps+ by eliminating bus idle cycles and supporting burst-aligned header extraction. |
Use Scenario: Providing shared scratchpad memory between multiple FPGA soft-core processors executing parallel protocol stack tasks. IC Role / Device Role / Timing Role: 36-bit-wide ZBT SRAM serving as coherent, low-jitter memory resource with synchronous burst reads/writes aligned to FPGA clock domain. Use Value: Sustains >800 MB/s effective bandwidth under mixed read/write loads, preventing pipeline stalls in multi-core embedded Linux subsystems. |
| Telecom Line Card FIFO | DSP-Based Signal Processing Buffer |
|
Use Scenario: Implementing elastic store FIFOs in SONET/SDH framer ICs to absorb jitter and phase misalignment between line and system clocks. IC Role / Device Role / Timing Role: Flow-through output SRAM configured as dual-port FIFO with separate read/write address counters and burst-mode fill/drain. Use Value: Delivers sub-10 ns read-to-write turnaround and guaranteed data retention across –40°C to +85°C - meeting GR-1089-CORE immunity requirements. |
Use Scenario: Holding intermediate FFT coefficients and filter taps in real-time radar signal processors operating at 125 MSPS sample rates. IC Role / Device Role / Timing Role: Synchronous SRAM with CEN-controlled clock gating used as ping-pong buffer memory synchronized to DSP's DMA engine. Use Value: Supports 4-word burst transfers matching DSP's native word width, reducing DMA overhead by 60% versus discrete 16-bit SRAMs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-100AXC | 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks - higher bandwidth but more complex timing. | Best suited for applications requiring concurrent read/write (e.g., dual-ported cache), not ZBT-style single-port zero-turnaround. | Select only if system design already uses QDR-II infrastructure and requires simultaneous access; not drop-in compatible due to pinout and control logic differences. |
| AS7C3256A-10JCN | 256K × 36, 10 ns access, asynchronous interface - lacks burst counter, ZBT, and synchronous clocking. | Applicable where deterministic latency is less critical and simpler control logic is preferred (e.g., legacy microcontroller peripherals). | Choose only for cost-sensitive, non-real-time applications; requires redesign of timing control and address generation logic. |
Compared with CY7C1371BV33-100AXC and AS7C3256A-10JCN, the 71V65703S75BQ8 uniquely delivers zero bus turnaround within a synchronous single-port architecture - making it optimal for burst-oriented, latency-constrained buffering where QDR complexity or async timing uncertainty is unacceptable.
Availability
71V65703S75BQ8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, telecom line card FIFOs, and DSP-based signal processing buffers requiring stable component supply across extended product lifecycles.
Supply support for 71V65703S75BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V65703S75BQ8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory interfacing in high-speed packet-switching, baseband processing, and real-time control applications demanding deterministic timing and burst efficiency.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V65703S75BQ8?
The 71V65703S75BQ8 operates at up to 100 MHz with a guaranteed clock-to-data access time of 7.5 ns. This specification is validated across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The 71V65703S75BQ8 achieves this performance using a high-speed CMOS process and flow-through output architecture, making it suitable for applications requiring strict timing predictability such as telecom framer buffers and network processor caches.
Does the 71V65703S75BQ8 support burst mode, and how is it configured?
Yes, the 71V65703S75BQ8 supports 4-word burst mode via its internal synchronous burst counter. Burst sequencing is selected using the LBO pin (LOW = linear, HIGH = interleaved), and address advancement is controlled by the ADV/LD signal: sampled LOW at the rising CLK edge loads a new external address, while sampled HIGH increments the internal counter. This configuration enables efficient sequential access without repeated address bus updates - a key advantage in packet header processing and DMA-driven data movement.
What package type and pin count does the 71V65703S75BQ8 use?
The 71V65703S75BQ8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), measuring 14 mm × 20 mm. This package is explicitly confirmed in the datasheet's pin configuration diagrams (PKG100) and supports standard reflow soldering profiles. The "BQ8" suffix in the part number denotes the TQFP-100 variant with industrial temperature grading, distinguishing it from BGA variants (e.g., BG119 or BQ165) used in the same family.
How does the ZBTTM architecture of the 71V65703S75BQ8 improve system performance?
The ZBTTM (Zero Bus Turnaround) architecture in the 71V65703S75BQ8 eliminates idle cycles when transitioning between read and write operations - unlike conventional SRAMs that require bus release/reacquisition. This enables immediate back-to-back read-after-write or write-after-read sequences, achieving 100% bus utilization in burst-intensive applications. In practice, this reduces average memory transaction latency by up to 30% in packet buffering scenarios and simplifies memory controller design by removing turnaround state machines.
Can the 71V65703S75BQ8 operate in low-power mode, and how is it activated?
Yes, the 71V65703S75BQ8 supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and core circuitry enters a low-current state while maintaining full data retention - typical standby current drops below 100 µA. This feature is especially valuable in telecom line cards and portable test equipment where intermittent operation or thermal management requires dynamic power scaling without data loss.
71V65703S75BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S75BQ8 FAQ
1.How can I place an order for 71V65703S75BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S75BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S75BQ8 reliable?
The price and inventory of 71V65703S75BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S75BQ8 is usually 5 days.
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6.How does Aetrix verify that 71V65703S75BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S75BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S75BQ8 meets industry standards.
7.What is the process for return or replacement of 71V65703S75BQ8?
All 71V65703S75BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S75BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S75BQ8 part is unused and in its original packaging.
Return procedure for 71V65703S75BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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