Renesas 71V65703S75PFGI
- Part No.:
- 71V65703S75PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65703S75PFGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S75PFGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 7.5 ns clock-to-data access time at 100 MHz, zero bus turnaround architecture, flow-through outputs, and 4-word burst capability. It serves as high-speed buffer/cache memory in networking switches, telecom line cards, and packet processing systems requiring deterministic latency and seamless read/write transitions.
For engineers reviewing the 71V65703S75PFGI datasheet, 71V65703S75PFGI pinout, 71V65703S75PFGI application, or 71V65703S75PFGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 industrial-grade packaging, 3.3V core/I/O supply tolerance, individual byte write control (BW1–BW4), and support for linear/interleaved burst sequences via LBO.
Technical Context
The 71V65703S75PFGI implements a synchronous, clock-driven interface with all address/control inputs registered on the rising CLK edge. Its ZBT™ architecture eliminates dead cycles between consecutive reads and writes by internally synchronizing output enable-removing the need for external OE control-and supporting immediate bus turnaround after each access.
It integrates a 4-cycle burst counter triggered by ADV/LD, with burst order selected statically via LBO (linear or interleaved). The device supports depth expansion using three chip enables (CE1, CE2 active-low; CE2 active-high), and includes power-down mode via asynchronous ZZ input for data retention at minimal current draw.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant but this part is fixed at 256K × 36. |
| Clock Frequency | 100 MHz maximum; enables 7.5 ns clock-to-data access-critical for sub-10 ns timing budgets in high-speed packet buffers. |
| ZBT™ Architecture | Zero Bus Turnaround: no idle cycles between read/write transitions; enables continuous back-to-back memory accesses without bus contention. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address setup overhead and improves effective bandwidth in sequential access patterns. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies allow I/O voltage optimization and noise isolation. |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for deployment in base station equipment and industrial control cabinets. |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); surface-mount compatible with standard reflow profiles and automated assembly. |
Pinout & Package
71V65703S75PFGI is packaged in a 100-pin plastic thin quad flatpack (TQFP), JEDEC MO-145AC compliant, with 0.5 mm pitch and exposed thermal pad (not electrically connected). Pinout validated per IDT document 5298 drw 02 (256K × 36 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled. |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; any false signal initiates one-cycle deselect (tri-state I/O next cycle). |
| R/W | Read/Write Control | Synchronous signal defining access type; determines whether loaded address initiates read (H) or write (L) one cycle later. |
| ADV/LD | Advance Burst / Load Address | Drives burst counter (HIGH) or loads new external address (LOW); controls burst initiation and address update timing. |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence: LOW = linear, HIGH = interleaved; must remain stable during operation. |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4); allows partial-word updates without masking logic. |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge; CEN can gate further clock propagation. |
| ZZ | Asynchronous Sleep Mode | Active-HIGH input that gates internal CLK and reduces ICC to ≤10 µA while retaining memory contents. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through data path; inputs registered, outputs unregistered-no output register delay. |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3 V core supply; VDDQ = 3.3 V I/O supply; VSS = common ground; decoupling required per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates mandatory idle cycles between read and write operations-enables full-bandwidth utilization of memory bus in real-time packet forwarding. |
| Internally Synchronized OE | Output enable is fully synchronous and auto-controlled; removes requirement for external OE timing management and simplifies PCB routing. |
| 4-Word Burst Counter | Reduces address setup overhead by 75% for sequential accesses-improves effective throughput in cache-line-aligned workloads. |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without external byte-lane gating-reduces power and logic complexity in protocol header modification. |
| Three Chip Enables (CE1/CE2/CE2) | Supports flexible depth expansion across multiple devices with mixed polarity enables-simplifies memory subsystem partitioning in multi-port designs. |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switching ASICs with strict <10 ns latency requirements. IC Role / Device Role / Timing Role: Primary synchronous buffer memory interfacing directly to switch fabric controller; provides deterministic 7.5 ns read access and zero-turnaround write bursts. Use Value: Enables wire-speed forwarding at 10 Gbps+ by eliminating bus turnaround penalties and supporting concurrent header lookup and payload buffering. | Use Scenario: Temporary storage of ATM cells or Ethernet frames in DSLAM or OLT line cards operating in harsh temperature environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM used for frame buffering and rate shaping; leverages –40°C to +85°C rating and ZZ sleep mode for thermal/power management. Use Value: Guarantees data retention during thermal cycling and reduces standby power by >99% via ZZ-controlled deep-sleep mode. |
| Baseband Processor Cache | Radar Signal Processing FIFO |
Use Scenario: Low-latency instruction/data cache for DSP-based baseband processors in 4G/5G radio units. IC Role / Device Role / Timing Role: High-speed cache memory synchronized to processor clock domain; uses burst reads to prefetch aligned 36-bit instructions. Use Value: Reduces average instruction fetch latency by 4× vs. non-burst SRAM-improving MAC-layer processing throughput under bursty traffic loads. | Use Scenario: Real-time buffering of digitized IF samples in phased-array radar front-ends requiring deterministic read/write interleaving. IC Role / Device Role / Timing Role: Flow-through output SRAM acting as ping-pong FIFO; leverages LBO-selectable burst order to match ADC/DAC DMA alignment. Use Value: Eliminates pipeline stalls during sample streaming by enabling back-to-back reads/writes with no bus arbitration delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100BGXI | 100 MHz, 256K × 36, 3.3V QDR SRAM; dual-port architecture with separate read/write data paths. | Supports simultaneous read/write; higher pin count (165-ball BGA); no ZBT™ or burst counter-requires external sequencing logic. | Choose for true concurrent access; avoid if ZBT™ timing or TQFP packaging is mandatory. |
| AS7C3256A-10JIN | 10 ns async SRAM, 32K × 8; not synchronous, no burst, no ZBT™, no flow-through outputs. | Lower speed, simpler interface; suitable only for non-timing-critical control plane buffers-not a functional substitute. | Only consider for cost-sensitive, low-bandwidth legacy upgrades where timing determinism is not required. |
Compared with CY7C1362BV33-100BGXI and AS7C3256A-10JIN, the 71V65703S75PFGI uniquely delivers ZBT™-guaranteed zero-turnaround timing in a 100-pin TQFP package-making it irreplaceable in space-constrained, latency-bound telecom and networking designs where burst efficiency and deterministic access are non-negotiable.
Availability
71V65703S75PFGI is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, baseband processor caches, and radar signal processing FIFOs requiring stable component supply across extended product lifecycles.
Supply support for 71V65703S75PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V65703S75PFGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in carrier-grade networking and real-time signal processing equipment.
FAQ
What is the maximum clock frequency supported by the 71V65703S75PFGI?
The 71V65703S75PFGI supports a maximum clock frequency of 100 MHz, corresponding to a guaranteed 7.5 ns clock-to-data access time. This specification is validated over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. Operation beyond 100 MHz is not characterized and may result in timing violations or data corruption.
Does the 71V65703S75PFGI require external output enable (OE) control?
No, the 71V65703S75PFGI features internally synchronized output enable functionality. OE is asynchronous but can be tied low permanently in most applications-the device automatically manages output tri-state timing during deselect and burst transitions. External OE control is only needed for dynamic bus sharing scenarios outside standard ZBT™ operation.
How does the ZBTTM architecture eliminate dead cycles in the 71V65703S75PFGI?
The ZBTTM architecture in the 71V65703S75PFGI eliminates dead cycles by synchronizing output enable internally and allowing immediate bus turnaround: a write cycle completes, and the next read cycle begins on the subsequent clock edge without intermediate idle states. This is achieved via dedicated burst counter logic and elimination of external OE timing dependencies-ensuring full bus utilization in back-to-back access patterns.
What are the valid burst sequence options for the 71V65703S75PFGI and how are they selected?
The 71V65703S75PFGI supports two burst sequences: linear and interleaved. Selection is controlled by the static LBO pin-LOW selects linear order (0,1,2,3), HIGH selects interleaved (0,2,1,3). LBO must be stable before and during burst operation; changing it mid-burst causes undefined behavior. Both sequences wrap automatically after four words.
Can the 71V65703S75PFGI operate with different core and I/O supply voltages?
No-the 71V65703S75PFGI requires matched 3.3 V ±5% supplies for both VDD (core) and VDDQ (I/O). The datasheet specifies no tolerance for voltage mismatch; applying differing values risks timing violation, increased leakage, or permanent damage. Decoupling capacitors must be placed per pin-group recommendations in the layout guidelines.
71V65703S75PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65703S75PFGI FAQ
1.How can I place an order for 71V65703S75PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S75PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S75PFGI reliable?
The price and inventory of 71V65703S75PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S75PFGI is usually 5 days.
3.What payment methods are accepted for 71V65703S75PFGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S75PFGI transactions.
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4.How is shipping managed for 71V65703S75PFGI?
71V65703S75PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S75PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S75PFGI?
For technical support, including 71V65703S75PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S75PFGI requirements.
6.How does Aetrix verify that 71V65703S75PFGI is sourced from the original manufacturer or authorized distributors?
All 71V65703S75PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S75PFGI meets industry standards.
7.What is the process for return or replacement of 71V65703S75PFGI?
All 71V65703S75PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S75PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S75PFGI part is unused and in its original packaging.
Return procedure for 71V65703S75PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S75PFGI Tags

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