Renesas 71V65703S75PFGI8
- Part No.:
- 71V65703S75PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65703S75PFGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S75PFGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), delivering 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It supports 4-word burst (linear or interleaved), individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C) in a 100-pin TQFP package - deployed in high-speed packet buffering for network switches and telecom line cards.
For engineers reviewing the 71V65703S75PFGI8 datasheet, 71V65703S75PFGI8 pinout, 71V65703S75PFGI8 application, or 71V65703S75PFGI8 equivalent, key selection criteria include ZBT™ timing compliance, 3.3V I/O and core supply tolerance (±5%), burst counter behavior under ADV/LD control, and industrial-grade thermal stability without external OE management.
Technical Context
The 71V65703S75PFGI8 implements a synchronous, clock-driven architecture where address/control registration occurs on the rising CLK edge, with data output appearing one cycle later via flow-through path (no output register). Its ZBT™ operation eliminates dead cycles by enabling immediate bus direction reversal after a write completes - achieved through internal synchronization of output enable and burst counter advancement.
Burst sequencing is controlled by LBO (static input), selecting linear or interleaved order; ADV/LD determines whether an external address loads or the internal counter increments. Three chip enables (CE1, CE2 active-low; CE2 active-high) support depth expansion, while CEN suspends all synchronous logic without affecting output state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9.4 Mbit); supports high-bandwidth parallel data paths in networking ASIC interfaces |
| Max Clock Frequency | 100 MHz; enables 10 ns cycle time for real-time packet buffering in 10Gbps+ systems |
| Clock-to-Data Access | 7.5 ns; guarantees deterministic read latency critical for time-sensitive buffer management |
| ZBT™ Operation | No dead cycles between read/write transitions; eliminates bus turnaround overhead in burst-intensive traffic |
| Burst Capability | 4-word burst (linear/interleaved); reduces address bus activity and controller overhead per memory transaction |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); ensures compatibility with 3.3V FPGA/GPU memory interfaces |
| Operating Temperature | –40°C to +85°C; qualified for industrial and telecom infrastructure environments |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated PCB assembly |
Pinout & Package
71V65703S75PFGI8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm lead pitch. Pinout validated per IDT document 5298 drw 02 (256K × 36 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Synchronous timing reference; all registered inputs sampled on rising edge |
| A0–A17 | Address Inputs | 18-bit address bus for 256K-depth addressing; no A18 required in this configuration |
| R/W | Read/Write Control | Single synchronous signal defining cycle type; determines data direction one cycle later |
| ADV/LD | Advance Burst / Load Address | Controls burst counter increment (HIGH) or new address load (LOW); central to burst mode operation |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence; must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals for selective 9-bit byte writes; enables partial word updates |
| CE1, CE2, CE2 | Chip Enables | Three enables (CE1/CE2 low-active, CE2 high-active) allow flexible depth expansion and deselection |
| OE | Output Enable | Asynchronous; tri-states outputs when HIGH; may be tied LOW for simplified interface |
| ZZ | Sleep Mode | Asynchronous power-down; gates internal clock and reduces current while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus; flow-through outputs eliminate output register delay |
| VDD, VDDQ, VSS | Power & Ground | Separate 3.3V core (VDD) and I/O (VDDQ) supplies; decoupling required per JEDEC layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive reads and writes, increasing effective bus utilization by up to 33% in burst-heavy workloads |
| Internally Synchronized OE | Removes need for external OE timing control - outputs automatically align with clock domain, simplifying system-level timing closure |
| 4-Word Burst Counter | Reduces address bus toggling and controller overhead; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without read-modify-write, lowering power and latency in partial-update scenarios |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless depth expansion across multiple devices using mixed polarity enables - no external logic required |
| Flow-Through Output Architecture | Delivers data one clock cycle after access with no additional output register delay, minimizing read latency |
Applications
| High-Speed Network Packet Buffering | Telecom Line Card Data Exchange |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Primary synchronous buffer between MAC and switching fabric; handles back-to-back bursts at line rate. Use Value: ZBT™ eliminates turnaround gaps, enabling sustained 100 MHz throughput without bus stalls during mixed read/write traffic. | Use Scenario: Interfacing DSPs and framer ICs in OC-48/STM-16 line cards requiring low-latency, high-reliability data staging. IC Role / Device Role / Timing Role: Dual-port-like buffer for time-critical control plane messaging and payload buffering. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V I/O compatibility ensure stable operation in uncontrolled telecom cabinets. |
| Baseband Processing in Wireless Infrastructure | Real-Time Video Frame Buffering |
Use Scenario: Temporary storage of IQ samples between RF front-end ADCs and baseband processors in 4G/5G remote radio units. IC Role / Device Role / Timing Role: High-bandwidth, low-jitter memory stage synchronized to FPGA-controlled clocks. Use Value: 7.5 ns clock-to-data access and flow-through outputs meet sub-10 ns timing constraints for real-time signal processing pipelines. | Use Scenario: Holding uncompressed video frames (e.g., 1080p@60fps) in broadcast equipment requiring glitch-free frame swaps. IC Role / Device Role / Timing Role: Dual-role buffer supporting simultaneous read (display engine) and write (capture engine) via burst-aligned access. Use Value: 4-word burst capability reduces memory controller bandwidth demand by 75% per frame line transfer, easing SoC resource pressure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV33-100AXC | 100 MHz, 256K × 36, but uses QDR-II architecture with separate read/write ports and no ZBT™ zero-turnaround | Requires dual-port controller logic; better suited for true concurrent R/W, not ZBT™-optimized burst streams | Select only if system demands true simultaneous access; otherwise 71V65703S75PFGI8 offers simpler timing and lower latency for sequential burst traffic |
| AS7C3256A-10JCN | 10 ns access, 256K × 32, asynchronous interface, no burst counter or ZBT™ | Lacks synchronous timing, burst capability, and bus turnaround optimization - limited to legacy or low-speed control-plane use | Use only in cost-sensitive, non-real-time applications where clock-domain alignment and burst efficiency are not required |
Compared with CY7C1355BV33-100AXC and AS7C3256A-10JCN, the 71V65703S75PFGI8 uniquely delivers ZBT™-enabled zero-cycle turnaround and integrated burst counter - making it optimal for high-throughput, clock-synchronized packet and frame buffering where deterministic latency and bus efficiency are mandatory.
Availability
71V65703S75PFGI8 is available at Aetrix Electronics and suitable for high-speed network packet buffering, telecom line card data exchange, baseband processing in wireless infrastructure, and real-time video frame buffering requiring stable component supply and long-term industrial-grade availability.
Supply support for 71V65703S75PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 71V65703S75PFGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-bus-turnaround applications in networking, telecom, and high-end embedded systems demanding deterministic, low-latency memory access.
FAQ
What is the memory organization and total capacity of the 71V65703S75PFGI8?
The 71V65703S75PFGI8 is organized as 256K × 36, providing 9,437,184 bits (9.4 Mbit) of synchronous SRAM. This configuration supports 36-bit parallel data paths ideal for wide-bus interfaces in networking ASICs and FPGAs. The device does not support 512K × 18 mode - that is reserved for the 71V65903 variant.
Does the 71V65703S75PFGI8 require external output enable (OE) control?
No. The 71V65703S75PFGI8 features internally synchronized output enable logic, eliminating the need for externally timed OE signals. OE can be tied LOW permanently in most designs, as output timing is fully aligned to the CLK domain - simplifying PCB layout and reducing timing closure effort for the 71V65703S75PFGI8.
How does the ZBTTM feature improve system performance in the 71V65703S75PFGI8?
ZBTTM (Zero Bus Turnaround) in the 71V65703S75PFGI8 removes idle cycles when switching between read and write operations. Unlike conventional SRAMs requiring bus stabilization time, the 71V65703S75PFGI8 allows immediate direction reversal - increasing effective bus bandwidth by up to 33% in mixed-access patterns typical of packet buffering.
What burst modes does the 71V65703S75PFGI8 support, and how is burst order selected?
The 71V65703S75PFGI8 supports 4-word burst transfers in either linear or interleaved sequence. Burst order is selected statically via the LBO pin: LBO = LOW selects linear order (A0, A1, A2, A3), while LBO = HIGH selects interleaved (A0, A2, A1, A3). LBO must remain stable during operation and is not sampled dynamically.
Can the 71V65703S75PFGI8 operate in low-power mode, and how is it activated?
Yes. The 71V65703S75PFGI8 enters low-power sleep mode when the ZZ pin is driven HIGH asynchronously. In this state, the internal clock is gated, dynamic power drops significantly, and data retention is guaranteed across the full industrial temperature range - enabling energy-efficient operation during idle periods without data loss.
71V65703S75PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65703S75PFGI8 FAQ
1.How can I place an order for 71V65703S75PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S75PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S75PFGI8 reliable?
The price and inventory of 71V65703S75PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S75PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V65703S75PFGI8?
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4.How is shipping managed for 71V65703S75PFGI8?
71V65703S75PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S75PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S75PFGI8?
For technical support, including 71V65703S75PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S75PFGI8 requirements.
6.How does Aetrix verify that 71V65703S75PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S75PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S75PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V65703S75PFGI8?
All 71V65703S75PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S75PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S75PFGI8 part is unused and in its original packaging.
Return procedure for 71V65703S75PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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