Renesas 71V65703S80BGG
- Part No.:
- 71V65703S80BGG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65703S80BGG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S80BGG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 bits (9.44 Mbit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer or cache memory in network packet processors, telecom line cards, and FPGA-based data path acceleration.
For engineers reviewing the 71V65703S80BGG datasheet, 71V65703S80BGG pinout, 71V65703S80BGG application, or 71V65703S80BGG equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), asynchronous OE and ZZ sleep enable, and JEDEC-standard 119-ball BGA (BGG) packaging for high-density routing.
Technical Context
The 71V65703S80BGG implements a synchronous interface with registered address/control inputs and a flow-through output path-no output register-enabling deterministic timing. Its on-chip burst counter advances on ADV/LD = HIGH, with LBO selecting linear or interleaved sequences, and supports 4-word bursts per address load.
Three chip enables (CE1, CE2 active-low; CE2 active-high) allow flexible depth expansion, while CEN suspends all synchronous operation without affecting output state. The device uses separate VDD (3.3V core) and VDDQ (3.3V I/O) supplies, and enters low-power sleep mode when ZZ = HIGH, retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9.44 Mbit); supports 512K × 18 via pin-compatible variant |
| Clock Frequency | 100 MHz maximum - enables 10 ns cycle time for high-throughput buffering |
| Access Time | 7.5 ns clock-to-data - guarantees deterministic read latency for real-time systems |
| ZBT™ Architecture | Zero Bus Turnaround - eliminates dead cycles between consecutive read/write operations |
| Burst Capability | 4-word burst (linear or interleaved) - reduces address bus traffic and improves bandwidth efficiency |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - decoupled rails minimize noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade) - qualified for base station and industrial control environments |
Pinout & Package
Packaged in a JEDEC-standard 119-ball fine-pitch ball grid array (BGG119), the 71V65703S80BGG features 119 I/O balls arranged in a 13×13 array with corner balls omitted; pin pitch is 0.8 mm. Thermal pad (ball R7) is connected to VSS for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Synchronous edge-trigger for all registered inputs; all timing referenced to rising edge |
| A0–A17 | Address inputs | 18-bit address bus for 256K-depth addressing; latched on rising CLK with ADV/LD = LOW |
| R/W | Read/Write control | Synchronous signal defining cycle type; determines data direction one cycle later |
| ADV/LD | Advance burst / Load address | HIGH increments internal burst counter; LOW loads new external address into register |
| LBO | Linear/Interleaved burst order | Static input: LOW = linear sequence, HIGH = interleaved - sets burst address pattern |
| BW1–BW4 | Byte write enables | Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) for multi-device depth expansion |
| OE | Output enable | Asynchronous, active-low - tri-states outputs independently of clock for bus sharing |
| ZZ | Sleep mode input | Asynchronous, active-high - gates internal clock and reduces power while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus; input path registered, output path flow-through (no latch) |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between read/write transitions - increases effective bus utilization by up to 30% in mixed-access patterns |
| Internally synchronized OE | Removes need for external OE timing control - simplifies system-level timing closure and reduces PCB routing complexity |
| Single R/W pin | Reduces control bus width versus separate RD/WR signals - saves FPGA I/O pins and simplifies address decode logic |
| Individual byte write (BW1–BW4) | Enables partial-word writes without read-modify-write - critical for protocol header updates and packet editing applications |
| Flow-through outputs | Delivers data one clock cycle after access with no output register delay - ensures minimal latency in pipeline-critical paths |
| Three chip enables | Supports seamless depth expansion across multiple devices without external logic - simplifies memory subsystem scaling |
Applications
| Network Packet Buffering | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet switch ASICs. IC Role / Device Role / Timing Role: High-speed dual-port buffer with zero-turnaround burst reads/writes to sustain line-rate throughput. Use Value: 7.5 ns access and 4-word burst reduce memory stall cycles, enabling full wire-speed forwarding without microarchitectural bubbles. |
Use Scenario: Acting as low-latency instruction/data cache for soft-core processors embedded in Xilinx UltraScale+ FPGAs. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic read/write timing aligned to FPGA clock domain. Use Value: Flow-through outputs and registered inputs eliminate setup/hold violations at 100 MHz, simplifying timing closure in FPGA-SRAM interfaces. |
| Telecom Line Card Buffer | Industrial Real-Time Controller Memory |
|
Use Scenario: Buffering TDM voice frames and control messages in carrier-grade SDH/SONET add-drop multiplexers. IC Role / Device Role / Timing Role: Industrial-temperature SRAM with ZZ sleep mode for power-gated standby during idle periods. Use Value: –40°C to +85°C rating and guaranteed data retention in sleep mode ensure reliability in uncontrolled cabinet environments. |
Use Scenario: Storing motion control trajectory tables and I/O status snapshots in CNC machine controllers. IC Role / Device Role / Timing Role: Deterministic-access memory interfaced to ARM Cortex-R5 real-time cores via parallel bus. Use Value: Single R/W pin and byte-write enables simplify firmware-driven memory management for safety-critical motion profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-100AXC | 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks | Requires differential clock routing and dual-port arbitration logic - not drop-in compatible | Select only if system requires true simultaneous read/write capability and can accommodate QDR-II interface complexity |
| AS7C3256B-10JIN | 256K × 36, 10 ns access, asynchronous interface with no burst or ZBT features | Lacks burst counter, ADV/LD, LBO, and zero-turnaround - limits bandwidth in high-frequency streaming | Choose for cost-sensitive legacy designs where synchronous timing and burst efficiency are not required |
Compared with CY7C1371BV33-100AXC and AS7C3256B-10JIN, the 71V65703S80BGG uniquely delivers ZBT™ zero-turnaround operation and flow-through outputs within a standard single-ended synchronous interface - optimizing both bandwidth and design simplicity for burst-oriented data pipelines.
Availability
71V65703S80BGG is available at Aetrix Electronics and suitable for network infrastructure, industrial automation, and FPGA-accelerated computing applications requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.
Supply support for 71V65703S80BGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V65703S80BGG belongs to IDT's ZBT™ SRAM product line, designed specifically for high-bandwidth, low-latency buffering in packet-switched networks, telecom infrastructure, and real-time embedded systems demanding deterministic access timing.
FAQ
What is the memory organization and total capacity of the 71V65703S80BGG?
The 71V65703S80BGG is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration supports 36-bit wide data transfers and is optimized for applications requiring high-throughput parallel memory access, such as network packet buffering and FPGA co-processing. The device also shares pin compatibility with the 512K × 18 variant (71V65903) for design flexibility.
Does the 71V65703S80BGG support burst read and write operations, and how is burst order controlled?
Yes, the 71V65703S80BGG supports 4-word burst operations in both read and write modes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The burst counter advances on ADV/LD = HIGH, and the initial address is loaded when ADV/LD = LOW - all synchronized to the CLK rising edge.
How does the ZBTTM (Zero Bus Turnaround) feature improve system performance in the 71V65703S80BGG?
ZBTTM eliminates idle bus cycles between consecutive read and write operations - for example, a read followed immediately by a write requires no turnaround delay. In the 71V65703S80BGG, this is achieved through internal synchronization of OE and control logic, allowing back-to-back accesses at full 100 MHz frequency. This directly increases effective memory bandwidth in mixed-access workloads common in packet processing and real-time control.
What are the power supply requirements and sleep capabilities of the 71V65703S80BGG?
The 71V65703S80BGG requires two 3.3 V supplies: VDD (core, ±5%) and VDDQ (I/O, ±5%). It supports low-power operation via the asynchronous ZZ pin: asserting ZZ = HIGH gates the internal clock and reduces active current while guaranteeing data retention. This sleep mode is essential for power-constrained telecom and industrial applications where periodic idle periods occur.
Can the 71V65703S80BGG be used with a 100 MHz system clock, and what is its guaranteed access timing?
Yes, the 71V65703S80BGG is fully rated for 100 MHz operation, with a guaranteed maximum clock-to-data access time of 7.5 ns. This specification ensures deterministic read latency under worst-case industrial temperature (–40°C to +85°C) and voltage (3.135 V to 3.465 V) conditions. The timing is measured from CLK rising edge to valid data on I/O pins, supporting tight timing budgets in high-speed digital systems.
71V65703S80BGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65703S80BGG FAQ
1.How can I place an order for 71V65703S80BGG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80BGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80BGG reliable?
The price and inventory of 71V65703S80BGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BGG is usually 5 days.
3.What payment methods are accepted for 71V65703S80BGG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S80BGG transactions.
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4.How is shipping managed for 71V65703S80BGG?
71V65703S80BGG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S80BGG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80BGG?
For technical support, including 71V65703S80BGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BGG requirements.
6.How does Aetrix verify that 71V65703S80BGG is sourced from the original manufacturer or authorized distributors?
All 71V65703S80BGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BGG meets industry standards.
7.What is the process for return or replacement of 71V65703S80BGG?
All 71V65703S80BGG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80BGG part is unused and in its original packaging.
Return procedure for 71V65703S80BGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S80BGG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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