Renesas 71V65703S80BGG8
- Part No.:
- 71V65703S80BGG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65703S80BGG8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S80BGG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs for high-speed memory interfacing in networking and telecom data path buffers.
For engineers reviewing the 71V65703S80BGG8 datasheet, 71V65703S80BGG8 pinout, 71V65703S80BGG8 application, or 71V65703S80BGG8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), asynchronous OE and ZZ sleep enable, and JEDEC-standard 119-ball BGA (BGG) packaging with industrial temperature range (–40°C to +85°C).
Technical Context
The 71V65703S80BGG8 implements a synchronous, clocked architecture with registered address/control inputs and flow-through data outputs-no output register-enabling deterministic timing. Its on-chip burst counter advances on ADV/LD = HIGH, supporting 4-word bursts with LBO-selectable linear or interleaved addressing sequences.
It features three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, single R/W control, and internally synchronized OE elimination-removing external OE timing constraints. Power management includes asynchronous ZZ sleep mode (data retention guaranteed) and synchronous CEN suspension.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9.4 Mbit); supports 512K × 18 via pin-compatible variant |
| Clock Frequency | 100 MHz (tCYC = 10 ns); enables 100 MT/s sustained throughput |
| Access Time | 7.5 ns clock-to-data (tCD); defines minimum latency from CLK edge to valid Q output |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus overhead per data transfer |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupled power domains prevent noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for base station, router, and industrial control environments |
| Package | 119-ball fine-pitch BGA (BGG119); JEDEC MO-207AC, 12 mm × 12 mm footprint |
Pinout & Package
71V65703S80BGG8 is packaged in a 119-ball fine-pitch BGA (BGG119), JEDEC MO-207AC compliant, with 12 mm × 12 mm body size and 0.8 mm ball pitch. Pinout conforms to BG119 configuration for 256K × 36 organization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK with ADV/LD low and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false deselects device in one cycle |
| R/W | Read/Write Control | Single synchronous signal determining cycle type; sampled at load cycle to define burst direction |
| ADV/LD | Advance Burst / Load Address | High = increment internal burst counter; Low = load new external address into register |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); no runtime change allowed |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge |
| OE | Asynchronous Output Enable | Active-low; tri-states outputs immediately-no clock dependency; may be tied low permanently |
| ZZ | Asynchronous Sleep Mode | Active-high; gates internal CLK, reduces ICC to ≤10 µA while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through data path; inputs registered, outputs unregistered (no output register delay) |
| VDD, VDDQ, VSS | Power/Ground | VDD (core), VDDQ (I/O), and VSS (common ground) require separate decoupling; VDDQ must track VDD within ±0.1 V |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive read/write operations-enables back-to-back transfers without bus idle time |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential accesses; LBO pin selects linear or interleaved sequence |
| Individual Byte Write (BW1–BW4) | Enables partial-word writes without read-modify-write; supports 9-bit granularity for protocol-aligned data updates |
| Internally Synchronized OE | Removes need for precise OE timing control-outputs remain stable across clock edges when OE is asserted |
| Asynchronous Sleep (ZZ) | Reduces standby current to ≤10 µA while preserving data; no clock or command sequence required to enter/exit |
| Three Chip Enables | Supports seamless depth expansion across multiple devices without external logic; one-cycle deselect guarantees clean bus release |
Applications
| Packet Buffering in Switch ASICs | Line Card Data Path Memory |
|---|---|
|
Use Scenario: High-throughput packet buffering in Layer 2/3 switching ASICs requiring low-latency, burst-capable memory for ingress/egress queues. IC Role / Device Role / Timing Role: Primary data buffer SRAM interfaced directly to switch fabric controller; provides 100 MT/s sustained bandwidth with deterministic 7.5 ns tCD. Use Value: ZBT™ eliminates turnaround gaps between packet header reads and payload writes-increasing effective buffer utilization by up to 20% vs. standard sync SRAM. |
Use Scenario: Real-time packet classification and forwarding memory on telecom line cards handling OC-48/STM-16 interfaces. IC Role / Device Role / Timing Role: Dual-port-accessible buffer supporting parallel lookup and update operations; burst mode accelerates table walk sequences. Use Value: 4-word burst + linear addressing reduces address bus toggling by 3×, lowering EMI and PCB routing complexity in dense line card layouts. |
| Baseband Processing in 4G LTE eNodeB | Industrial PLC Motion Control Buffer |
|
Use Scenario: Shared memory between DSP cores and FPGA-based channel encoders/decoders in LTE baseband units. IC Role / Device Role / Timing Role: Coherent data exchange buffer with byte-write capability for partial symbol updates and burst reads for FFT windowing. Use Value: BW1–BW4 enables precise 9-bit symbol alignment without full-word overwrites-reducing unnecessary memory traffic and power consumption. |
Use Scenario: Deterministic motion profile storage and real-time interpolation buffer in servo drive controllers. IC Role / Device Role / Timing Role: Low-jitter, industrial-temperature SRAM providing jitter-free position/velocity data to PWM generation logic. Use Value: –40°C to +85°C rating and ZZ sleep mode ensure reliable operation in uncooled cabinet environments while minimizing standby power. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100AXC | 100 MHz, 256K × 36, but uses QDR-II interface with separate read/write ports and no ZBT™ architecture | Requires dual-port controller logic; lacks burst counter and zero-turnaround behavior | Choose for higher aggregate bandwidth in split-read/write systems; avoid if ZBT™ timing simplification is required |
| AS7C3256A-10JIN | 10 ns access, 256K × 36, but asynchronous interface-no clock, no burst, no flow-through outputs | Needs external address latch and timing control; incompatible with synchronous bus protocols | Only suitable for legacy designs with no clock domain constraints; not drop-in compatible |
Compared with CY7C1362BV33-100AXC and AS7C3256A-10JIN, the 71V65703S80BGG8 uniquely delivers zero bus turnaround, integrated burst sequencing, and flow-through outputs-reducing controller complexity and improving real-time determinism in high-speed packet and control applications.
Availability
71V65703S80BGG8 is available at Aetrix Electronics and suitable for packet buffering, telecom line card memory, baseband processing, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.
Supply support for 71V65703S80BGG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V65703S80BGG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-bandwidth data path buffering in networking switches, routers, and wireless base stations where deterministic timing and bus efficiency are critical.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V65703S80BGG8?
The 71V65703S80BGG8 operates at a maximum clock frequency of 100 MHz, with a guaranteed clock-to-data access time (tCD) of 7.5 ns. This specification ensures deterministic output validity relative to the rising CLK edge under industrial temperature and voltage conditions (–40°C to +85°C, VDD/VDDQ = 3.3 V ±5%). The 71V65703S80BGG8 achieves this performance using a flow-through output architecture with no output register delay.
Does the 71V65703S80BGG8 support both linear and interleaved burst modes, and how is the selection made?
Yes, the 71V65703S80BGG8 supports both linear and interleaved 4-word burst sequences. Selection is controlled by the static LBO (Linear/Interleaved Burst Order) pin: LBO = LOW configures linear order (A0, A0+1, A0+2, A0+3), while LBO = HIGH configures interleaved order (A0, A0+2, A0+1, A0+3). LBO must be held stable during operation-dynamic switching is not permitted-and is typically set at power-up via board-level biasing.
How does the ZBT™ (Zero Bus Turnaround) feature function in the 71V65703S80BGG8?
The ZBT™ feature in the 71V65703S80BGG8 eliminates dead cycles between consecutive read and write operations by allowing immediate bus direction reversal without wait states. This is achieved through internal synchronization of OE and precise timing control of the data bus tri-state behavior-ensuring that the bus transitions cleanly between read and write phases in a single clock cycle, significantly improving effective bandwidth in burst-intensive applications.
What are the power management capabilities of the 71V65703S80BGG8, and how is sleep mode activated?
The 71V65703S80BGG8 supports two power management modes: synchronous suspension via CEN (Clock Enable) and asynchronous deep-sleep via ZZ. Asserting ZZ HIGH gates the internal clock and reduces ICC to ≤10 µA while guaranteeing data retention. No clock or command sequence is needed-activation is immediate and independent of CLK state. CEN HIGH suspends all synchronous operation but maintains higher current draw than ZZ mode.
Is the 71V65703S80BGG8 pin-compatible with other members of the 71V65xx family, such as the 71V65903?
No, the 71V65703S80BGG8 is not fully pin-compatible with the 71V65903. While both share the same BGG119 package and core signal set, the 71V65903 is organized as 512K × 18 and uses different address pin assignments (A0–A18 vs. A0–A17) and I/O pin mapping (18-bit data + 2 parity bits vs. 36-bit data + 4 parity bits). Board-level redesign is required for substitution-only functional equivalence exists within the family, not mechanical or electrical pin-for-pin compatibility.
71V65703S80BGG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65703S80BGG8 FAQ
1.How can I place an order for 71V65703S80BGG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80BGG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80BGG8 reliable?
The price and inventory of 71V65703S80BGG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BGG8 is usually 5 days.
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Once your 71V65703S80BGG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80BGG8?
For technical support, including 71V65703S80BGG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BGG8 requirements.
6.How does Aetrix verify that 71V65703S80BGG8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S80BGG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BGG8 meets industry standards.
7.What is the process for return or replacement of 71V65703S80BGG8?
All 71V65703S80BGG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BGG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80BGG8 part is unused and in its original packaging.
Return procedure for 71V65703S80BGG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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