Renesas 71V65703S80BQ
- Part No.:
- 71V65703S80BQ
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S80BQ.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,978
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Product details
Overview
71V65703S80BQ from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 100 MHz clock frequency, 7.5 ns clock-to-data access time, zero bus turnaround architecture, and flow-through outputs. It serves as high-speed buffer memory in network packet processors and telecom line cards requiring rapid read/write alternation without dead cycles.
For engineers reviewing the 71V65703S80BQ datasheet, 71V65703S80BQ pinout, 71V65703S80BQ application, or 71V65703S80BQ equivalent, key selection criteria include ZBT burst timing compliance, 3.3V I/O supply (VDDQ) tolerance, industrial temperature support (–40°C to +85°C), TQFP-100 package footprint, and byte-write enable (BW1–BW4) control for partial-word writes.
Technical Context
The 71V65703S80BQ implements a synchronous, clock-driven interface where address/control signals are registered on the rising CLK edge, and data transfers occur one cycle later. Its internal burst counter supports 4-word interleaved or linear sequences controlled by the static LBO pin.
ZBT operation eliminates bus turnaround latency: a write cycle can be immediately followed by a read (or vice versa) without tri-state delay, enabled by internally synchronized output buffer control and single R/W pin logic. Chip select uses three independent enables (CE1, CE2, CE2) with one-cycle deselect and guaranteed high-impedance output after deactivation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports depth expansion via CE pins |
| Clock Frequency | 100 MHz - enables 10 ns cycle time for high-throughput buffering |
| Access Time | 7.5 ns clock-to-data - defines minimum latency from CLK rise to valid Q output |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus traffic per data block |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems |
| Power Management | ZZ input enables sleep mode with full data retention - cuts dynamic power during idle |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Synchronous timing reference; all register updates occur on rising edge |
| R/W | Read/Write Control | Single pin determines cycle direction; no separate RD/WR signals needed |
| ADV/LD | Address Load / Burst Advance | Low = load new external address; High = increment internal burst counter |
| LBO | Burst Order Select | Static input: Low = linear sequence, High = interleaved sequence |
| BW1–BW4 | Byte Write Enables | Active-low controls for four 9-bit bytes; enables partial-word writes without masking |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables (CE2 active-high); any false signal initiates one-cycle deselect |
| OE | Output Enable | Asynchronous; ties low for continuous read access - eliminates OE timing constraints |
| ZZ | Sleep Mode Input | Asynchronous high activates low-power retention mode; CLK gated internally |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through interface; no output register - Q appears one CLK after R/W=H |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead cycles between read/write transitions - critical for pipeline efficiency in packet forwarding engines |
| Internally Synchronized OE | Removes need for precise OE timing control; simplifies PCB layout and timing closure |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst - lowers system-level EMI and routing congestion |
| Individual Byte Write (BW1–BW4) | Enables selective 9-bit writes without read-modify-write - preserves integrity of adjacent data bytes |
| Three Independent Chip Enables | Supports seamless depth expansion across multiple devices without external logic |
Applications
| Telecom Line Cards | Network Packet Processors |
|---|---|
Use Scenario: Buffering variable-length ATM or IP packets in OC-48/STM-16 interfaces. IC Role / Device Role / Timing Role: High-speed first-in-first-out (FIFO) memory with zero-turnaround burst reads/writes. Use Value: Sustains 100 MHz throughput with deterministic 7.5 ns access, enabling line-rate packet inspection. | Use Scenario: Storing header lookup tables and temporary packet metadata in multi-gigabit switches. IC Role / Device Role / Timing Role: Low-latency scratchpad SRAM accessed by parallel search engines and ingress/egress pipelines. Use Value: 4-word burst mode delivers 144-bit wide data blocks per cycle, matching parallel bus widths. |
| Industrial PLC Backplanes | Medical Imaging Data Buffers |
Use Scenario: Real-time I/O data exchange between motion controllers and fieldbus masters (e.g., Profibus DP). IC Role / Device Role / Timing Role: Deterministic dual-port buffer supporting simultaneous host CPU and peripheral DMA access. Use Value: Industrial temp range (–40°C to +85°C) and ZZ sleep mode ensure reliability in uncooled enclosures. | Use Scenario: Temporary storage of raw sensor frames (e.g., ultrasound echo data) before FPGA-based beamforming. IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfacing directly to ADC/DAC controllers via 36-bit bus. Use Value: Flow-through outputs eliminate output register delay - critical for sub-10 ns timing budgets in real-time imaging paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100AXC | 100 MHz, 256K × 36, but uses QDR-II architecture with separate read/write clocks and no ZBT mode | Requires dual-clock domain design and lacks zero-turnaround capability | Choose only if system already uses QDR-II protocol and needs higher sustained bandwidth over burst-limited ZBT |
| AS7C3256A-10JIN | 10 ns access, 32K × 36, asynchronous interface - no clock, no burst, no ZBT | Lower density, no burst or flow-through; suitable only for simple glue logic or legacy designs | Select when cost sensitivity outweighs performance needs and clock tree simplification is not required |
Compared with CY7C1362BV33-100AXC and AS7C3256A-10JIN, the 71V65703S80BQ uniquely delivers ZBT timing with single-clock simplicity and industrial temperature support - making it optimal for deterministic, low-latency buffering where bus turnaround overhead must be eliminated.
Availability
71V65703S80BQ is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 71V65703S80BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V65703S80BQ belongs to IDT's ZBT SRAM product line, engineered specifically for applications demanding zero bus turnaround, deterministic burst access, and robust industrial temperature operation in high-speed data path buffering.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V65703S80BQ?
The 71V65703S80BQ operates at up to 100 MHz with a guaranteed clock-to-data access time of 7.5 ns. This specification is measured under standard conditions: VDD = VDDQ = 3.3 V ±5%, TA = –40°C to +85°C, and load capacitance per I/O ≤ 30 pF. The 7.5 ns parameter defines the delay from CLK rising edge to valid data appearing on the I/O bus during a read cycle.
Does the 71V65703S80BQ support both linear and interleaved burst modes, and how is the mode selected?
Yes, the 71V65703S80BQ supports both linear and interleaved 4-word burst sequences. The mode is selected by the static LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear order (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The LBO state must be stable before device initialization and must not change during operation.
How does the ZBTTM feature eliminate dead cycles between read and write operations in the 71V65703S80BQ?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65703S80BQ removes bus idle time by allowing immediate transition between read and write cycles. It achieves this through internally synchronized output buffer control and elimination of external OE timing constraints. When R/W toggles, the device manages bus direction and tri-state timing internally - ensuring the data bus remains active with no gap, unlike conventional SRAMs requiring explicit OE deassertion/reassertion.
What are the voltage requirements for VDD and VDDQ on the 71V65703S80BQ, and are they required to track?
The 71V65703S80BQ requires VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. While both supplies share the same nominal value and tolerance, they are electrically separate and may be supplied from independent regulators. Tracking is not required, but each must remain within its specified range during operation to guarantee timing and signal integrity.
Can the 71V65703S80BQ operate in low-power mode, and how is it activated?
Yes, the 71V65703S80BQ supports low-power sleep mode activated by driving the ZZ pin HIGH. In this mode, the internal clock is gated, dynamic power drops significantly, and data retention is guaranteed across the full industrial temperature range (–40°C to +85°C). The device exits sleep mode synchronously on the next rising CLK edge after ZZ returns LOW, with no reset or initialization sequence required.
71V65703S80BQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S80BQ FAQ
1.How can I place an order for 71V65703S80BQ through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80BQ reliable?
The price and inventory of 71V65703S80BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BQ is usually 5 days.
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71V65703S80BQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S80BQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80BQ?
For technical support, including 71V65703S80BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BQ requirements.
6.How does Aetrix verify that 71V65703S80BQ is sourced from the original manufacturer or authorized distributors?
All 71V65703S80BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BQ meets industry standards.
7.What is the process for return or replacement of 71V65703S80BQ?
All 71V65703S80BQ units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80BQ part is unused and in its original packaging.
Return procedure for 71V65703S80BQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S80BQ Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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