Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V65703S80BQG8

Part No.:
71V65703S80BQG8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65703S80BQG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,987

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V65703S80BQG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 bits (9.44 Mbit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs for high-speed memory interfacing in networking and telecom data paths.

For engineers reviewing the 71V65703S80BQG8 datasheet, 71V65703S80BQG8 pinout, 71V65703S80BQG8 application, or 71V65703S80BQG8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), asynchronous OE and ZZ sleep enable, and JEDEC-standard 165-ball fine-pitch BGA (BQG) packaging for dense PCB layouts.

Technical Context

The 71V65703S80BQG8 implements a synchronous interface with registered address/control inputs and registered data-in path, while output data is flow-through (no output register). Its on-chip burst counter advances on ADV/LD = HIGH, enabling four-word bursts per address load.

ZBT™ architecture eliminates dead cycles during bus turnaround by overlapping the end of one access with the start of the next - enabled via synchronized R/W, CE, and ADV/LD timing - and internally synchronizes output buffer enable to remove external OE timing constraints.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 bits (9.44 Mbit); supports 512K × 18 in same family but this variant is fixed at 256K × 36
Clock Frequency 100 MHz maximum; enables 10 ns cycle time for high-throughput packet buffering
Access Time 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time systems
Supply Voltage VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); dual-rail design isolates core logic from I/O noise
Burst Capability 4-word linear or interleaved burst (selected by LBO pin); reduces address bus traffic in sequential accesses
Operating Temperature –40°C to +85°C industrial grade; qualified for base station and edge infrastructure environments
Power-Down Mode ZZ input asserts asynchronous sleep; gates internal clock and maintains data retention at minimal current

Pinout & Package

Packaged in a 165-ball fine-pitch ball grid array (fBGA), designated BQG165 per IDT documentation; footprint complies with JEDEC MO-245AC standard (13 mm × 15.5 mm, 0.8 mm pitch).

Pin/Terminal Circuit Role Design Meaning
CLK Clock Input Synchronous edge-trigger for all registered inputs; all timing referenced to rising edge
A0–A17 Address Inputs 18-bit address bus for 256K depth; no A18 used in 256K×36 configuration
R/W Read/Write Control Synchronous signal determining access type; sampled with ADV/LD to initiate load cycle
ADV/LD Advance Burst / Load Address LOW loads new external address; HIGH increments internal burst counter
LBO Linear/Interleaved Burst Order Static input: LOW = linear sequence, HIGH = interleaved; must remain stable during burst
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CE1, CE2, CE2 Chip Enables Three enables: CE1/CE2 active low, CE2 active high; any false condition deselects device in one cycle
OE Output Enable Asynchronous, active-low; tri-states outputs independently of clock; may be tied low
ZZ Sleep Mode Asynchronous, active-high; gates internal clock and reduces power while retaining memory contents
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional data bus; input path registered, output path flow-through (no output register)

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates idle cycles between consecutive reads/writes - enables back-to-back memory transactions without bus contention
Internally Synchronized OE Removes need for precise OE timing control; output enable is automatically aligned to clock domain
Single R/W Pin Reduces control signal count vs. separate RD/WR lines - simplifies ASIC/FPGA interface logic
4-Word Burst Counter Generates sequential addresses internally - cuts external address generation overhead by 75% for burst transfers
Individual Byte Write (BW1–BW4) Enables partial-word updates without read-modify-write; critical for protocol header manipulation in packet processors
Clock Enable (CEN) Suspends all synchronous operation without affecting outputs - supports dynamic clock gating for power management

Applications

High-Speed Packet Buffering Network Processor Interface

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Primary data buffer with deterministic 7.5 ns read latency and zero-turnaround burst writes for line-rate forwarding.

Use Value: Enables full-duplex 10 Gbps+ throughput by eliminating bus idle time between successive packet writes and reads.

Use Scenario: Interfacing with network processors requiring low-latency, burst-capable external memory for context switching.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as instruction/data cache extension with flow-through outputs for immediate data availability.

Use Value: Reduces processor wait states via 100 MHz clock rate and burst addressing - improves instruction fetch bandwidth by 3.2× vs. non-burst SRAM.

Telecom Baseband Processing Industrial Real-Time Control Buffer

Use Scenario: Temporary storage of OFDM symbol data in LTE/5G remote radio units before FFT processing.

IC Role / Device Role / Timing Role: High-reliability memory buffer operating across –40°C to +85°C with guaranteed data retention in ZZ sleep mode.

Use Value: Maintains symbol integrity during thermal cycling and supports low-power sleep between transmission frames using ZZ pin.

Use Scenario: Capturing sensor fusion data streams (IMU, ADC, encoder) in motion-control PLCs with jitter-free timing.

IC Role / Device Role / Timing Role: Deterministic-access memory for time-critical control loops where worst-case latency must be bounded at 7.5 ns.

Use Value: Guarantees sub-10 ns read response independent of bus activity pattern - essential for <1 µs control cycle compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-100AXC 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks Requires dual-clock routing and differential layout; not drop-in compatible due to different timing model and pinout Select when true simultaneous read/write bandwidth is required; avoid if replacing legacy ZBT designs
AS7C3256A-10JIN 256K × 36, 10 ns access, asynchronous interface - no burst counter, no ZBT, no ADV/LD or LBO pins Lacks burst capability and zero-turnaround; requires external address sequencing logic and tighter OE timing control Only suitable for cost-sensitive, non-burst applications where 2.5 ns slower access is acceptable

Compared with CY7C1371DV33-100AXC and AS7C3256A-10JIN, the 71V65703S80BQG8 uniquely delivers ZBT™-enabled bus efficiency and integrated burst addressing in a single-clock, single-R/W synchronous interface - reducing FPGA logic utilization and PCB routing complexity in high-speed data-path designs.

Availability

71V65703S80BQG8 is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, telecom baseband processing, and industrial real-time control applications requiring stable component supply and long-term lifecycle support.

Supply support for 71V65703S80BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The 71V65703S80BQG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in packet-switched networks, base stations, and real-time embedded systems demanding deterministic access and burst efficiency.

FAQ

What is the memory organization and total capacity of the 71V65703S80BQG8?

The 71V65703S80BQG8 is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration is fixed for this specific part number; although the 71V65903 variant supports 512K × 18, the 71V65703S80BQG8 is exclusively 256K × 36 and does not support reconfiguration.

Does the 71V65703S80BQG8 support burst read and write operations, and how is burst order controlled?

Yes, the 71V65703S80BQG8 supports 4-word burst operations in both read and write modes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The burst counter advances on ADV/LD = HIGH and wraps after four words.

How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S80BQG8?

ZBTTM in the 71V65703S80BQG8 eliminates idle bus cycles between consecutive read and write operations by overlapping the completion of one access with initiation of the next. This is achieved through synchronized CE, R/W, and ADV/LD timing - allowing back-to-back transactions without external bus arbitration or turnaround delays.

What package type and ball count does the 71V65703S80BQG8 use?

The 71V65703S80BQG8 uses a 165-ball fine-pitch ball grid array (fBGA) package, designated BQG165 per IDT documentation. It conforms to JEDEC MO-245AC mechanical standards (13 mm × 15.5 mm body, 0.8 mm ball pitch) and is distinct from the 100-pin TQFP and 119-ball BGA variants in the same family.

Can the 71V65703S80BQG8 operate in low-power mode, and how is it activated?

Yes, the 71V65703S80BQG8 supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated, dynamic power drops significantly, and data retention is guaranteed across the full industrial temperature range (–40°C to +85°C). No other signals need to be controlled during entry or exit.

71V65703S80BQG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65703S80BQG8 FAQ

1.How can I place an order for 71V65703S80BQG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S80BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65703S80BQG8 reliable?

The price and inventory of 71V65703S80BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BQG8 is usually 5 days.

3.What payment methods are accepted for 71V65703S80BQG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S80BQG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65703S80BQG8?

71V65703S80BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65703S80BQG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S80BQG8?

For technical support, including 71V65703S80BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BQG8 requirements.

6.How does Aetrix verify that 71V65703S80BQG8 is sourced from the original manufacturer or authorized distributors?

All 71V65703S80BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BQG8 meets industry standards.

7.What is the process for return or replacement of 71V65703S80BQG8?

All 71V65703S80BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BQG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S80BQG8 part is unused and in its original packaging.

Return procedure for 71V65703S80BQG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65703S80BQG8 Tags

  • 71V65703S80BQG8
  • 71V65703S80BQG8 PDF
  • 71V65703S80BQG8 Datasheet
  • 71V65703S80BQG8 Specifications
  • 71V65703S80BQG8 Images
  • Renesas
  • Renesas 71V65703S80BQG8
  • Buy 71V65703S80BQG8
  • 71V65703S80BQG8 Price
  • 71V65703S80BQG8 Distributor
  • 71V65703S80BQG8 Supplier
  • 71V65703S80BQG8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER