Renesas 71V65703S80BQG8
- Part No.:
- 71V65703S80BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S80BQG8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S80BQG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 bits (9.44 Mbit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs for high-speed memory interfacing in networking and telecom data paths.
For engineers reviewing the 71V65703S80BQG8 datasheet, 71V65703S80BQG8 pinout, 71V65703S80BQG8 application, or 71V65703S80BQG8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), asynchronous OE and ZZ sleep enable, and JEDEC-standard 165-ball fine-pitch BGA (BQG) packaging for dense PCB layouts.
Technical Context
The 71V65703S80BQG8 implements a synchronous interface with registered address/control inputs and registered data-in path, while output data is flow-through (no output register). Its on-chip burst counter advances on ADV/LD = HIGH, enabling four-word bursts per address load.
ZBT™ architecture eliminates dead cycles during bus turnaround by overlapping the end of one access with the start of the next - enabled via synchronized R/W, CE, and ADV/LD timing - and internally synchronizes output buffer enable to remove external OE timing constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9.44 Mbit); supports 512K × 18 in same family but this variant is fixed at 256K × 36 |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time for high-throughput packet buffering |
| Access Time | 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time systems |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); dual-rail design isolates core logic from I/O noise |
| Burst Capability | 4-word linear or interleaved burst (selected by LBO pin); reduces address bus traffic in sequential accesses |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for base station and edge infrastructure environments |
| Power-Down Mode | ZZ input asserts asynchronous sleep; gates internal clock and maintains data retention at minimal current |
Pinout & Package
Packaged in a 165-ball fine-pitch ball grid array (fBGA), designated BQG165 per IDT documentation; footprint complies with JEDEC MO-245AC standard (13 mm × 15.5 mm, 0.8 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Synchronous edge-trigger for all registered inputs; all timing referenced to rising edge |
| A0–A17 | Address Inputs | 18-bit address bus for 256K depth; no A18 used in 256K×36 configuration |
| R/W | Read/Write Control | Synchronous signal determining access type; sampled with ADV/LD to initiate load cycle |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH increments internal burst counter |
| LBO | Linear/Interleaved Burst Order | Static input: LOW = linear sequence, HIGH = interleaved; must remain stable during burst |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three enables: CE1/CE2 active low, CE2 active high; any false condition deselects device in one cycle |
| OE | Output Enable | Asynchronous, active-low; tri-states outputs independently of clock; may be tied low |
| ZZ | Sleep Mode | Asynchronous, active-high; gates internal clock and reduces power while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus; input path registered, output path flow-through (no output register) |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive reads/writes - enables back-to-back memory transactions without bus contention |
| Internally Synchronized OE | Removes need for precise OE timing control; output enable is automatically aligned to clock domain |
| Single R/W Pin | Reduces control signal count vs. separate RD/WR lines - simplifies ASIC/FPGA interface logic |
| 4-Word Burst Counter | Generates sequential addresses internally - cuts external address generation overhead by 75% for burst transfers |
| Individual Byte Write (BW1–BW4) | Enables partial-word updates without read-modify-write; critical for protocol header manipulation in packet processors |
| Clock Enable (CEN) | Suspends all synchronous operation without affecting outputs - supports dynamic clock gating for power management |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Primary data buffer with deterministic 7.5 ns read latency and zero-turnaround burst writes for line-rate forwarding. Use Value: Enables full-duplex 10 Gbps+ throughput by eliminating bus idle time between successive packet writes and reads. |
Use Scenario: Interfacing with network processors requiring low-latency, burst-capable external memory for context switching. IC Role / Device Role / Timing Role: Synchronous SRAM acting as instruction/data cache extension with flow-through outputs for immediate data availability. Use Value: Reduces processor wait states via 100 MHz clock rate and burst addressing - improves instruction fetch bandwidth by 3.2× vs. non-burst SRAM. |
| Telecom Baseband Processing | Industrial Real-Time Control Buffer |
|
Use Scenario: Temporary storage of OFDM symbol data in LTE/5G remote radio units before FFT processing. IC Role / Device Role / Timing Role: High-reliability memory buffer operating across –40°C to +85°C with guaranteed data retention in ZZ sleep mode. Use Value: Maintains symbol integrity during thermal cycling and supports low-power sleep between transmission frames using ZZ pin. |
Use Scenario: Capturing sensor fusion data streams (IMU, ADC, encoder) in motion-control PLCs with jitter-free timing. IC Role / Device Role / Timing Role: Deterministic-access memory for time-critical control loops where worst-case latency must be bounded at 7.5 ns. Use Value: Guarantees sub-10 ns read response independent of bus activity pattern - essential for <1 µs control cycle compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-100AXC | 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks | Requires dual-clock routing and differential layout; not drop-in compatible due to different timing model and pinout | Select when true simultaneous read/write bandwidth is required; avoid if replacing legacy ZBT designs |
| AS7C3256A-10JIN | 256K × 36, 10 ns access, asynchronous interface - no burst counter, no ZBT, no ADV/LD or LBO pins | Lacks burst capability and zero-turnaround; requires external address sequencing logic and tighter OE timing control | Only suitable for cost-sensitive, non-burst applications where 2.5 ns slower access is acceptable |
Compared with CY7C1371DV33-100AXC and AS7C3256A-10JIN, the 71V65703S80BQG8 uniquely delivers ZBT™-enabled bus efficiency and integrated burst addressing in a single-clock, single-R/W synchronous interface - reducing FPGA logic utilization and PCB routing complexity in high-speed data-path designs.
Availability
71V65703S80BQG8 is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, telecom baseband processing, and industrial real-time control applications requiring stable component supply and long-term lifecycle support.
Supply support for 71V65703S80BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V65703S80BQG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in packet-switched networks, base stations, and real-time embedded systems demanding deterministic access and burst efficiency.
FAQ
What is the memory organization and total capacity of the 71V65703S80BQG8?
The 71V65703S80BQG8 is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration is fixed for this specific part number; although the 71V65903 variant supports 512K × 18, the 71V65703S80BQG8 is exclusively 256K × 36 and does not support reconfiguration.
Does the 71V65703S80BQG8 support burst read and write operations, and how is burst order controlled?
Yes, the 71V65703S80BQG8 supports 4-word burst operations in both read and write modes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The burst counter advances on ADV/LD = HIGH and wraps after four words.
How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S80BQG8?
ZBTTM in the 71V65703S80BQG8 eliminates idle bus cycles between consecutive read and write operations by overlapping the completion of one access with initiation of the next. This is achieved through synchronized CE, R/W, and ADV/LD timing - allowing back-to-back transactions without external bus arbitration or turnaround delays.
What package type and ball count does the 71V65703S80BQG8 use?
The 71V65703S80BQG8 uses a 165-ball fine-pitch ball grid array (fBGA) package, designated BQG165 per IDT documentation. It conforms to JEDEC MO-245AC mechanical standards (13 mm × 15.5 mm body, 0.8 mm ball pitch) and is distinct from the 100-pin TQFP and 119-ball BGA variants in the same family.
Can the 71V65703S80BQG8 operate in low-power mode, and how is it activated?
Yes, the 71V65703S80BQG8 supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated, dynamic power drops significantly, and data retention is guaranteed across the full industrial temperature range (–40°C to +85°C). No other signals need to be controlled during entry or exit.
71V65703S80BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S80BQG8 FAQ
1.How can I place an order for 71V65703S80BQG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80BQG8 reliable?
The price and inventory of 71V65703S80BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BQG8 is usually 5 days.
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Once your 71V65703S80BQG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80BQG8?
For technical support, including 71V65703S80BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BQG8 requirements.
6.How does Aetrix verify that 71V65703S80BQG8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S80BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BQG8 meets industry standards.
7.What is the process for return or replacement of 71V65703S80BQG8?
All 71V65703S80BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80BQG8 part is unused and in its original packaging.
Return procedure for 71V65703S80BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S80BQG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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