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Renesas 71V65703S80BQGI

Part No.:
71V65703S80BQGI
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65703S80BQGI.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,688

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Product details

Overview

71V65703S80BQGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA-based data path acceleration where deterministic latency and burst efficiency are critical.

For engineers reviewing the 71V65703S80BQGI datasheet, 71V65703S80BQGI pinout, 71V65703S80BQGI application, or 71V65703S80BQGI equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and 3.3V I/O voltage tolerance with VDDQ decoupling requirements.

Technical Context

The 71V65703S80BQGI implements a synchronous, clocked architecture with registered address/control inputs and flow-through (unregistered) data outputs. Its on-chip burst counter supports 4-word linear or interleaved sequences controlled by the LBO pin, while ADV/LD determines whether an external address is loaded or the internal counter is advanced.

It features three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, individual byte write enables (BW1–BW4) for 9-bit granularity, and asynchronous OE/ZZ controls for output tri-state and sleep mode. Clock Enable (CEN) suspends all synchronous operations without affecting output state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 bits (9.4 Mbit); supports 512K × 18 via pin-compatible variant
Clock Frequency 100 MHz maximum - enables 10 ns cycle time for high-throughput buffering
Access Time 7.5 ns clock-to-data - guarantees deterministic read latency for real-time systems
Burst Capability 4-word burst (linear or interleaved) - reduces address bus traffic and improves bandwidth efficiency
Supply Voltages VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - requires separate decoupling for noise isolation
Operating Temperature –40°C to +85°C (industrial grade) - validated for extended thermal cycling in base station and industrial control environments
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly

Pinout & Package

71V65703S80BQGI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 1 marked by dot; top view shown in datasheet drawing 5298 drw 02.

Pin Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2 Chip Enables Three independent enables: CE1/CE2 active-low, CE2 active-high; any false enable initiates one-cycle deselect
R/W Read/Write Control Synchronous signal defining cycle type; data transfer occurs one clock cycle later
ADV/LD Advance Burst Address / Load New Address LOW loads new external address; HIGH advances internal burst counter - defines burst sequencing behavior
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CLK System Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge
OE Output Enable Asynchronous, active-low; tri-states outputs immediately - eliminates need for precise timing coordination
ZZ Sleep Mode Input Asynchronous, active-high; gates internal clock and reduces power to minimum while retaining data
I/O0–I/O31, I/OP1–I/OP4 Data I/O Bus 36-bit bidirectional flow-through data path; input registered, output unregistered - enables zero-latency reads
VDD, VDDQ, VSS Power & Ground VDD = core supply (3.3 V); VDDQ = I/O supply (3.3 V); separate planes required to suppress switching noise

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates dead cycles between consecutive read/write operations - increases effective bus utilization by up to 33% in mixed-access patterns
Internally Synchronized OE Removes requirement for external OE timing control - simplifies PCB layout and reduces FPGA I/O resource usage
Single R/W Pin Reduces control signal count versus separate RD/WR lines - lowers routing congestion in dense memory interfaces
Individual Byte Write (BW1–BW4) Enables partial-word updates without read-modify-write - critical for protocol header manipulation in packet processing
4-Word Burst with LBO Select Configurable linear/interleaved addressing via static LBO pin - matches burst order expectations of MIPS/PowerPC and x86 host interfaces

Applications

Network Packet Buffering FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet line cards.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer between MAC and traffic manager ASICs, synchronized to system clock domain.

Use Value: 7.5 ns access and ZBT™ burst capability enable full-line-rate packet queuing with no pipeline stalls.

Use Scenario: Providing scratchpad memory for Xilinx Kintex or Intel Stratix FPGA-based digital signal processing pipelines.

IC Role / Device Role / Timing Role: Off-chip synchronous SRAM acting as low-latency data store for FFT, filtering, or encryption engines.

Use Value: Flow-through outputs and 100 MHz clocking match FPGA register-to-register timing constraints without added logic delay.

Telecom Baseband Processing Industrial Real-Time Control

Use Scenario: Buffering channelized TDM data streams in wireless base station transceivers (e.g., CPRI, eCPRI).

IC Role / Device Role / Timing Role: Deterministic latency memory interfacing directly with TI C66x DSP or Arm-based baseband controllers.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliability in outdoor cabinet deployments.

Use Scenario: Storing motion control trajectory tables and sensor fusion buffers in servo drive controllers.

IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free data access for real-time PLC and motion sequencer firmware.

Use Value: Single R/W pin and burst capability reduce microcontroller GPIO count and improve loop execution predictability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355BV33-100AXC 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks Requires dual-clock routing and different controller logic; not drop-in compatible with ZBT™ burst protocols Select only if migrating to QDR-II interface for higher aggregate bandwidth; not suitable for direct 71V65703S80BQGI replacement
AS7C3256A-10JIN 256K × 36, 10 ns access, asynchronous interface - no burst counter, no ZBT™, no clock enable Lacks synchronous timing, burst, and power management features - unsuitable for high-speed deterministic systems Consider only for cost-sensitive, non-real-time applications where clock domain synchronization is unnecessary

Compared with CY7C1355BV33-100AXC and AS7C3256A-10JIN, the 71V65703S80BQGI uniquely delivers ZBT™-optimized burst sequencing, single-cycle deselect, and integrated sleep mode - making it irreplaceable in latency-critical, power-aware telecom and industrial control designs.

Availability

71V65703S80BQGI is available at Aetrix Electronics and suitable for network infrastructure, FPGA acceleration, telecom baseband, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for 71V65703S80BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 71V65703S80BQGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency, burst-oriented buffering in packet-switched networks and real-time embedded systems.

FAQ

What is the maximum operating frequency and access time of the 71V65703S80BQGI?

The 71V65703S80BQGI operates at up to 100 MHz with a guaranteed clock-to-data access time of 7.5 ns. This specification is valid across the full industrial temperature range (–40°C to +85°C) and under 3.3 V ±5% supply conditions. The 71V65703S80BQGI achieves this performance using a high-speed CMOS process and flow-through output architecture, enabling deterministic timing for real-time applications.

Does the 71V65703S80BQGI support burst read and write operations, and how is burst order configured?

Yes, the 71V65703S80BQGI supports 4-word synchronous bursts in either linear or interleaved sequence. Burst order is selected statically via the LBO pin: LBO = LOW selects linear order (A0, A1, A2, A3), while LBO = HIGH selects interleaved (A0, A2, A1, A3). The burst counter advances on each rising CLK edge when ADV/LD = HIGH, and the 71V65703S80BQGI maintains full burst integrity even during partial writes using BW1–BW4.

How does the ZBTTM (Zero Bus Turnaround) feature work in the 71V65703S80BQGI?

ZBTTM eliminates idle bus cycles between consecutive read and write operations. In the 71V65703S80BQGI, a write cycle can be immediately followed by a read cycle (or vice versa) without inserting wait states - the bus transitions seamlessly because address/control setup and data transfer are fully pipelined. This is implemented via internal synchronization of OE and burst logic, and the 71V65703S80BQGI guarantees no dead cycles under valid timing conditions per datasheet Table 08.

What are the power supply requirements for the 71V65703S80BQGI, and is separate VDDQ decoupling mandatory?

The 71V65703S80BQGI requires two independent 3.3 V supplies: VDD (core, pins 16, 30, 45, 60, 75, 90) and VDDQ (I/O, pins 46, 55, 64, 73, 82, 91). Per datasheet Section 9, VDD and VDDQ must be decoupled separately using 0.1 µF ceramic capacitors placed within 10 mm of respective pins. Mixing VDD/VDDQ or sharing decoupling violates AC timing specs and risks data corruption due to I/O noise coupling into core logic.

Can the 71V65703S80BQGI be used in industrial temperature applications, and what is its qualification status?

Yes, the 71V65703S80BQGI is qualified for industrial temperature operation from –40°C to +85°C, as confirmed in the "Recommended Operating Temperature and Supply Voltage" table (Section 9). The 'I' suffix in the part number (71V65703S80BQGI) explicitly denotes industrial grade. It undergoes extended burn-in and temperature cycling validation per JESD22-A108, and the 71V65703S80BQGI retains full functionality including ZZ sleep mode and burst operation across this range.

71V65703S80BQGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65703S80BQGI FAQ

1.How can I place an order for 71V65703S80BQGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S80BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65703S80BQGI reliable?

The price and inventory of 71V65703S80BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BQGI is usually 5 days.

3.What payment methods are accepted for 71V65703S80BQGI?

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4.How is shipping managed for 71V65703S80BQGI?

71V65703S80BQGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65703S80BQGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S80BQGI?

For technical support, including 71V65703S80BQGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BQGI requirements.

6.How does Aetrix verify that 71V65703S80BQGI is sourced from the original manufacturer or authorized distributors?

All 71V65703S80BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BQGI meets industry standards.

7.What is the process for return or replacement of 71V65703S80BQGI?

All 71V65703S80BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BQGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S80BQGI part is unused and in its original packaging.

Return procedure for 71V65703S80BQGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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