Renesas 71V65703S80BQGI8
- Part No.:
- 71V65703S80BQGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S80BQGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S80BQGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA-based data path acceleration where deterministic latency and burst efficiency are critical.
For engineers reviewing the 71V65703S80BQGI8 datasheet, 71V65703S80BQGI8 pinout, 71V65703S80BQGI8 application, or 71V65703S80BQGI8 equivalent, key selection factors include its 100-pin TQFP package, 3.3V core/I/O supply, industrial temperature range (–40°C to +85°C), ZBT™ burst architecture, and support for interleaved/linear 4-word bursts with individual byte write control.
Technical Context
The 71V65703S80BQGI8 implements a synchronous dual-edge-triggered interface with a dedicated burst counter and ADV/LD-controlled address loading or incrementing. Its flow-through output architecture eliminates output register delay, enabling immediate data availability one cycle after address/control sampling - critical for pipelined systems.
ZBT™ operation is enforced via synchronized chip enables (CE1, CE2, CE2), asynchronous OE and ZZ controls, and internal logic that guarantees no dead cycles during bus direction reversal. The LBO pin statically selects linear or interleaved burst order, while BW1–BW4 enable per-byte write masking without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9.4 Mbit); supports high-bandwidth parallel data paths in networking ASICs |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time for real-time packet buffering |
| Access Time | 7.5 ns clock-to-data; ensures predictable timing for synchronous system integration |
| Burst Capability | 4-word burst (interleaved or linear); reduces address overhead and improves throughput |
| Supply Voltage | VDD = VDDQ = 3.3 V ±5%; compatible with standard 3.3V logic families and power rails |
| Operating Temperature | –40°C to +85°C industrial grade; validated for base station and industrial control environments |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly |
Pinout & Package
71V65703S80BQGI8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm lead pitch. Pinout conforms to PKG100 configuration for the 256K × 36 variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); allow depth expansion and partial deselection |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction one cycle after address load |
| ADV/LD | Advance Burst Address / Load New Address | Controls burst counter increment (HIGH) or new address load (LOW); defines burst initiation point |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes; enable selective word updates without full-word overwrite |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs referenced to rising edge |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately when HIGH - simplifies timing-critical read gating |
| ZZ | Sleep Mode Input | Asynchronous power-down; gates internal clock and reduces current to retention level while preserving data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through data path; input registered, output unregistered for minimal read latency |
| VDD, VDDQ, VSS | Power & Ground | Separate 3.3V core (VDD) and I/O (VDDQ) supplies; decoupling required per JEDEC layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive reads/writes - essential for back-to-back packet processing in switch fabric buffers |
| Internally Synchronized OE | Removes need for external OE timing control; outputs remain valid across clock boundaries during burst reads |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit field updates in protocol headers or status registers without disturbing adjacent bytes |
| Asynchronous Sleep (ZZ) | Reduces standby current to retention level while maintaining full data integrity - critical for low-power idle states |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed synchronous buffer providing deterministic 7.5 ns read access and zero-turnaround write-read transitions. Use Value: Enables line-rate forwarding at 10 Gbps+ by eliminating bus idle cycles and supporting 4-word burst reads of packet metadata. |
Use Scenario: Offloading memory-intensive tasks (e.g., table lookups, CRC generation) from FPGA fabric. IC Role / Device Role / Timing Role: External burst-capable SRAM tightly coupled to FPGA's high-speed I/O banks via dedicated clock domain. Use Value: Delivers 100 MHz sustained bandwidth to accelerate lookup tables and reduce FPGA logic resource usage. |
| Telecom Line Card FIFO | Industrial Real-Time Controller Memory |
|
Use Scenario: Interfacing between DSPs and framer ICs in SONET/SDH equipment requiring jitter-free data transfer. IC Role / Device Role / Timing Role: Synchronous FIFO buffer with flow-through outputs and programmable burst order for deterministic framing alignment. Use Value: Maintains bit-level synchronization across multiple clock domains using LBO-configurable burst sequences. |
Use Scenario: Storing sensor fusion data and control state in ruggedized PLCs operating in extended temperature environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM with –40°C to +85°C operation and ZZ sleep mode for energy-constrained deployments. Use Value: Guarantees data retention during brownouts and extends battery life in fanless, sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100BGXI | 256K × 36, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks | Requires differential clock routing and lacks ZBT™ zero-turnaround; better suited for true dual-port read/write concurrency | Select only if dual-port bandwidth > single-port burst efficiency is the primary requirement |
| AS7C3256A-10JIN | 256K × 36, 10 ns access, but asynchronous interface and no burst counter or ZBT™ capability | Lacks synchronous timing control and burst efficiency; requires external address sequencing logic | Choose only for legacy designs where clock domain isolation or burst simplicity is not needed |
Compared with CY7C1362BV33-100BGXI and AS7C3256A-10JIN, the 71V65703S80BQGI8 uniquely delivers zero bus turnaround within a single-port synchronous interface - reducing control logic complexity and PCB routing density while maintaining 100 MHz throughput in space-constrained telecom modules.
Availability
71V65703S80BQGI8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processing, telecom line card FIFOs, and industrial real-time controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V65703S80BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65703S80BQGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-throughput data buffering in packet-switched networks and real-time embedded systems demanding deterministic timing and burst efficiency.
FAQ
What is the memory organization and total capacity of the 71V65703S80BQGI8?
The 71V65703S80BQGI8 is organized as 256K × 36, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. This configuration provides a 36-bit wide data bus optimized for parallel packet header storage and high-bandwidth FPGA interfacing, with full addressability across all 256K words.
Does the 71V65703S80BQGI8 support burst operations, and how is burst order controlled?
Yes, the 71V65703S80BQGI8 supports 4-word burst operations in either linear or interleaved sequence. Burst order is selected statically via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH enables interleaved (A0, A2, A1, A3). This is configured at power-up and must remain static during operation.
How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S80BQGI8?
ZBTTM in the 71V65703S80BQGI8 eliminates idle cycles between consecutive read and write operations by internally managing bus direction control. When a write cycle completes, the next read cycle begins immediately on the subsequent clock edge - no wait states or external bus turnaround logic required - enabling continuous data streaming in packet buffers.
What are the power supply requirements for the 71V65703S80BQGI8, and are VDD and VDDQ independent?
The 71V65703S80BQGI8 requires two independent 3.3 V supplies: VDD (core logic, 3.135–3.465 V) and VDDQ (I/O drivers, same voltage range). They may be supplied from the same regulator but must be decoupled separately per JEDEC layout recommendations to ensure signal integrity and meet AC timing specs under load.
Can the 71V65703S80BQGI8 operate in low-power mode, and how is it activated?
Yes, the 71V65703S80BQGI8 supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and device current drops to retention level while preserving all stored data. Data retention is guaranteed across the full industrial temperature range (–40°C to +85°C) during sleep.
71V65703S80BQGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S80BQGI8 FAQ
1.How can I place an order for 71V65703S80BQGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80BQGI8 reliable?
The price and inventory of 71V65703S80BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BQGI8 is usually 5 days.
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Once your 71V65703S80BQGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80BQGI8?
For technical support, including 71V65703S80BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BQGI8 requirements.
6.How does Aetrix verify that 71V65703S80BQGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S80BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BQGI8 meets industry standards.
7.What is the process for return or replacement of 71V65703S80BQGI8?
All 71V65703S80BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BQGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80BQGI8 part is unused and in its original packaging.
Return procedure for 71V65703S80BQGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S80BQGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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