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Renesas 71V65703S80BQI

Part No.:
71V65703S80BQI
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65703S80BQI.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,425

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Product details

Overview

71V65703S80BQI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), featuring zero bus turnaround, 100 MHz operation (7.5 ns clock-to-data access), flow-through outputs, and 4-word burst capability. It serves as high-speed buffer/cache memory in networking switches, telecom line cards, and packet processing engines requiring deterministic latency and no dead cycles between read/write transitions.

For engineers reviewing the 71V65703S80BQI datasheet, 71V65703S80BQI pinout, 71V65703S80BQI application, or 71V65703S80BQI equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 industrial-grade packaging, 3.3V core/I/O supply tolerance, individual byte write control (BW1–BW4), and support for linear/interleaved burst ordering via LBO.

Technical Context

The 71V65703S80BQI implements a synchronous dual-edge-triggered architecture with registered address/control inputs and flow-through data outputs-no output register-enabling immediate data availability one cycle after address load. Its on-chip burst counter advances on ADV/LD = HIGH, supporting both linear and interleaved sequences selected by static LBO pin state.

ZBT™ operation eliminates bus turnaround overhead: a write cycle can be immediately followed by a read (or vice versa) without tri-state delay, enabled by internally synchronized OE and three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion. Clock Enable (CEN) suspends all synchronous logic while preserving register state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 (9.4 Mbit); supports 512K × 18 via pin-compatible variant but not this exact part
Clock Frequency 100 MHz max; enables 10 ns cycle time for high-throughput packet buffering
Access Time 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time systems
Supply Voltage VDD = 3.3 V ±5% (3.135–3.465 V); VDDQ = 3.3 V ±5%; separate core/I/O rails reduce noise coupling
Operating Temperature –40°C to +85°C (industrial grade); validated for base station and industrial control environments
Burst Capability 4-word burst (linear or interleaved); reduces address bus traffic and controller overhead
Byte Write Control Four independent BW1–BW4 pins; enables selective 9-bit byte writes without masking logic

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Industrial temperature grade, green (RoHS-compliant) construction.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2 Chip Enables Three enables: CE1/CE2 active-low, CE2 active-high; any false enable deselects device in one cycle
R/W Read/Write Control Synchronous signal defining cycle type; sampled at rising CLK to determine next-cycle data direction
ADV/LD Advance Burst / Load Address LOW loads new external address; HIGH increments internal burst counter; determines burst sequence start
LBO Linear/Interleaved Burst Order Static input: LOW = linear (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during burst
BW1–BW4 Byte Write Enables Active-low per-byte controls for I/O[0:7]/I/OP1 through I/O[24:31]/I/OP4; enable partial-word writes
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional flow-through bus; input registered, output unregistered; OE asynchronous disables outputs
CLK System Clock Rising-edge-triggered master clock; all synchronous timing referenced to this edge
ZZ Sleep Mode Asynchronous HIGH gates internal clock and reduces power; retains data in low-power standby

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates dead cycles between consecutive reads/writes-critical for back-to-back packet buffering in switch fabric
Internally Synchronized OE Removes need for external OE timing control; simplifies PCB layout and reduces controller GPIO usage
Single R/W Pin Reduces control bus width vs. separate RD/WR signals; lowers FPGA pin count and routing complexity
Individual Byte Write (BW1–BW4) Enables precise 9-bit updates without full-word overwrite-essential for protocol header modification in real-time stacks
Three Chip Enables Supports seamless depth expansion across multiple devices without external decode logic
Flow-Through Outputs Delivers data one clock cycle after address load-no added latency from output registers

Applications

Networking Switch Buffer Telecom Line Card Cache

Use Scenario: High-speed packet buffering in Layer 2/3 Ethernet switches handling 10 Gbps+ line rates.

IC Role / Device Role / Timing Role: Primary FIFO/cache SRAM interfacing directly to MAC controllers and traffic managers.

Use Value: ZBT™ burst and zero turnaround enable sustained 100 MHz throughput without pipeline stalls during mixed read/write traffic.

Use Scenario: Control-plane cache in SONET/SDH add-drop multiplexers requiring fast configuration lookup.

IC Role / Device Role / Timing Role: Low-latency storage for routing tables and channel status registers accessed by ARM-based control processors.

Use Value: 7.5 ns tCD and industrial temp rating ensure deterministic response under thermal stress in sealed chassis.

Industrial PLC Data Exchange Radar Signal Processing Buffer

Use Scenario: Real-time I/O mapping and tag database storage in programmable logic controllers with deterministic scan cycles.

IC Role / Device Role / Timing Role: Shared memory between CPU and fieldbus interface ASICs using parallel synchronous bus.

Use Value: Individual byte write (BW1–BW4) allows atomic update of discrete I/O states without corrupting adjacent process variables.

Use Scenario: Intermediate storage for FFT coefficients and range-Doppler map data in pulsed radar front-ends.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad between ADC interface and DSP accelerator.

Use Value: 4-word burst mode matches typical FFT word grouping, reducing address generation overhead by 75% per transfer.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1373KV18 512K × 18 organization; 165-ball fBGA only; no LBO pin-fixed interleaved burst Requires board redesign for x18 data width and BGA footprint; lacks linear burst option Select only if system uses x18 bus and requires higher density; verify burst order compatibility
AS7C3256A Commercial grade (0°C to +70°C); no ZZ sleep mode; 10 ns access (slower than 7.5 ns) Not qualified for industrial environments; higher power in standby due to missing sleep mode Acceptable for cost-sensitive non-industrial designs where 2.5 ns latency penalty and ambient temp limits are acceptable

Compared with CY7C1373KV18 and AS7C3256A, the 71V65703S80BQI uniquely delivers 256K × 36 width in TQFP-100 with industrial temp support, ZBTTM timing, and selectable burst order-making it optimal for legacy parallel-bus systems requiring drop-in reliability and deterministic performance.

Availability

71V65703S80BQI is available at Aetrix Electronics and suitable for networking switch buffers, telecom line card caches, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.

Supply support for 71V65703S80BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V65703S80BQI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in packet-switched networks and real-time control systems.

FAQ

What is the maximum operating frequency of the 71V65703S80BQI?

The 71V65703S80BQI is rated for 100 MHz maximum clock frequency, corresponding to a 10 ns clock period. This enables guaranteed 7.5 ns clock-to-data access time (tCD) under industrial temperature and voltage conditions, making it suitable for high-speed packet buffering applications where deterministic timing is critical. The 71V65703S80BQI achieves this performance using a high-speed CMOS process and optimized synchronous register design.

Does the 71V65703S80BQI support both linear and interleaved burst modes?

Yes, the 71V65703S80BQI supports both linear and interleaved 4-word burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, the burst follows linear order (A0, A0+1, A0+2, A0+3); when LBO = HIGH, it follows interleaved order (A0, A0+2, A0+1, A0+3). This flexibility allows optimization for different memory access patterns in networking and signal processing applications, and the 71V65703S80BQI requires LBO to remain static during burst execution.

What package type and pin count does the 71V65703S80BQI use?

The 71V65703S80BQI is supplied in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP) with 14 mm × 20 mm body size and 0.5 mm lead pitch. This package supports industrial temperature operation (–40°C to +85°C) and is RoHS-compliant. The 71V65703S80BQI's TQFP-100 footprint provides robust thermal and electrical performance for high-density PCB layouts in telecom and industrial equipment.

How does the ZBTTM feature eliminate dead cycles in the 71V65703S80BQI?

ZBTTM (Zero Bus Turnaround) in the 71V65703S80BQI eliminates dead cycles by allowing immediate transition between read and write operations without bus tri-state delay. This is achieved through internally synchronized output enable (OE) and precise control of data bus timing relative to ADV/LD and R/W signals. As a result, the 71V65703S80BQI sustains full bandwidth during mixed-access workloads common in packet forwarding engines and real-time control buffers.

What are the voltage requirements for VDD and VDDQ on the 71V65703S80BQI?

The 71V65703S80BQI requires VDD = 3.3 V ±5% (3.135 V to 3.465 V) for core logic and VDDQ = 3.3 V ±5% for I/O drivers. These separate supplies isolate core switching noise from data bus signaling, improving signal integrity. The 71V65703S80BQI specifies VIH ≥ 2.0 V and VIL ≤ 0.8 V for all inputs, ensuring robust noise margins across its industrial operating range.

71V65703S80BQI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65703S80BQI FAQ

1.How can I place an order for 71V65703S80BQI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S80BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65703S80BQI reliable?

The price and inventory of 71V65703S80BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80BQI is usually 5 days.

3.What payment methods are accepted for 71V65703S80BQI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S80BQI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65703S80BQI?

71V65703S80BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65703S80BQI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S80BQI?

For technical support, including 71V65703S80BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80BQI requirements.

6.How does Aetrix verify that 71V65703S80BQI is sourced from the original manufacturer or authorized distributors?

All 71V65703S80BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80BQI meets industry standards.

7.What is the process for return or replacement of 71V65703S80BQI?

All 71V65703S80BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80BQI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S80BQI part is unused and in its original packaging.

Return procedure for 71V65703S80BQI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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