Renesas 71V65703S80PFGI
- Part No.:
- 71V65703S80PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65703S80PFGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S80PFGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 bits (9.44 Mbit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround (ZBT) architecture, flow-through outputs, and 4-word burst capability. It serves as high-speed buffer/cache memory in networking switches, telecom line cards, and packet processing systems requiring deterministic latency and seamless read/write transitions.
For engineers reviewing the 71V65703S80PFGI datasheet, 71V65703S80PFGI pinout, 71V65703S80PFGI application, or 71V65703S80PFGI equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), 3.3V core/I/O supply tolerance, and burst mode control via ADV/LD and LBO pins.
Technical Context
The 71V65703S80PFGI implements a synchronous dual-edge-triggered interface with registered address/control inputs and flow-through data outputs-no output register-enabling immediate data availability one cycle after address load. Its on-chip burst counter supports linear or interleaved sequences (selected by LBO), and internal synchronization of OE eliminates external timing constraints for output enable.
ZBT operation is enforced via dedicated chip enables (CE1, CE2 active-low; CE2 active-high), single R/W control, and ADV/LD-driven address loading/burst advancement. Power-down is managed asynchronously via ZZ input, guaranteeing data retention while reducing dynamic power consumption during idle periods.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9.44 Mbit); supports 512K × 18 in alternate variant but 71V65703S80PFGI is fixed at 256K × 36 |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time for high-throughput buffering in packet-forwarding pipelines |
| Access Time | 7.5 ns clock-to-data (tCD); guarantees deterministic read latency critical for real-time traffic shaping |
| Supply Voltage | VDD = 3.3 V ±5% (3.135–3.465 V); VDDQ = 3.3 V ±5%; separate core/I/O rails reduce noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in uncontrolled ambient telecom infrastructure |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus cycles by 75% per burst, improving bus efficiency |
| Byte Write Control | Four independent BW1–BW4 signals (active-low); enables selective 9-bit byte updates without full-word overwrite |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout conforms to PKG100 configuration for 256K × 36 organization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three enables: CE1/CE2 active-low, CE2 active-high; any false enable deselects device within one cycle |
| R/W | Read/Write Control | Synchronous signal defining cycle type; sampled at rising CLK to determine next-cycle data direction |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH advances internal burst counter; controls burst sequencing |
| LBO | Linear/Interleaved Burst Order | Static input: LOW = linear burst (0,1,2,3); HIGH = interleaved (0,2,1,3); must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Active-low enables for four 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4); allow partial-word writes |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional flow-through bus; input registered, output unregistered; tri-states on OE HIGH or deselect |
| CLK | System Clock | Primary timing reference; all synchronous operations referenced to rising edge; CEN disables propagation |
| OE | Output Enable | Asynchronous; drives I/O pins to high-Z when HIGH; may be tied LOW for continuous read operation |
| ZZ | Sleep Mode | Asynchronous; gates internal CLK and reduces power; retains data; requires no sequence or timing coordination |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead cycles between read/write transitions-enables back-to-back accesses without bus turnaround delay |
| Internally Synchronized OE | Removes need for precise OE timing control; outputs remain valid across clock boundaries when OE is static |
| Single R/W Pin | Reduces control bus complexity versus separate RD/WR signals; simplifies FPGA/CPLD interface logic |
| 4-Word Burst Counter | Generates sequential addresses internally-cuts external address generation overhead and improves bandwidth utilization |
| Individual Byte Write (BW1–BW4) | Enables granular 9-bit updates-avoids full-word read-modify-write, preserving integrity of adjacent data bytes |
| Three Chip Enables (CE1/CE2/CE2) | Supports depth expansion across multiple devices without external decoding logic; enables flexible memory mapping |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Primary ZBT SRAM buffer providing sub-10 ns read access and zero-turnaround write-read transitions for pipeline-aligned forwarding decisions. Use Value: Enables sustained 100 MHz throughput with deterministic timing-critical for non-blocking switch fabric performance. |
Use Scenario: Temporary storage of voice-over-IP (VoIP) payload buffers and jitter compensation memory in carrier-grade DSLAMs. IC Role / Device Role / Timing Role: Synchronous burst-access memory supporting 4-word interleaved reads to match DSP DMA burst patterns. Use Value: Reduces external address generation overhead by 75% per burst, lowering FPGA resource usage and power. |
| Industrial PLC Real-Time Data Cache | Radar Signal Processing FIFO |
Use Scenario: Holding time-critical I/O status snapshots and motion control command queues in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-temperature SRAM with guaranteed data retention during ZZ sleep mode for low-power standby states. Use Value: Maintains state integrity across thermal cycling (–40°C to +85°C) and supports deterministic wake-up latency. |
Use Scenario: Acting as ping-pong FIFO for ADC sample buffering in phased-array radar front-ends operating at 100 MSPS. IC Role / Device Role / Timing Role: Flow-through output SRAM delivering immediate data availability post-address load-minimizing pipeline stalls. Use Value: Eliminates output register delay, enabling direct connection to high-speed DACs or FFT engines without added latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-100AXC | 100 MHz, 256K × 36, but uses QDR-II architecture with separate read/write ports and differential clocks | Requires differential clock routing and dual-port controller logic-not drop-in compatible with ZBT timing | Select only if system already implements QDR-II infrastructure and requires concurrent read/write bandwidth |
| AS7C3256A-10JIN | 10 ns access, 256K × 36, but asynchronous SRAM-no clock, no burst, no ZBT-max 33 MHz effective rate | Lacks burst, flow-through, and ZBT features; incompatible with synchronous bus protocols | Consider only for legacy designs where clockless interface and lower speed are acceptable trade-offs |
Compared with CY7C1371DV33-100AXC and AS7C3256A-10JIN, the 71V65703S80PFGI uniquely delivers ZBT timing, flow-through outputs, and synchronous burst capability in a single-package solution-enabling higher effective bandwidth and simpler controller design for modern packet-processing systems.
Availability
71V65703S80PFGI is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and industrial PLC real-time data caches requiring stable component supply across extended product lifecycles.
Supply support for 71V65703S80PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65703S80PFGI belongs to IDT's ZBT SRAM product line, engineered specifically for applications demanding zero bus turnaround, deterministic latency, and burst-efficient memory access in high-speed digital systems.
FAQ
What is the memory organization and total capacity of the 71V65703S80PFGI?
The 71V65703S80PFGI is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration is fixed for the 71V65703S80PFGI variant and differs from the 512K × 18 option found in the 71V65903 family member. The 36-bit data bus supports parallel transfer of four 9-bit bytes, aligning with common bus widths in networking ASICs.
Does the 71V65703S80PFGI support both linear and interleaved burst modes?
Yes, the 71V65703S80PFGI supports both linear and interleaved 4-word burst sequences, selected by the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, the burst order is linear (A0, A1, A2, A3); when LBO = HIGH, it is interleaved (A0, A2, A1, A3). This flexibility allows optimization for different cache line or DMA engine addressing patterns without firmware changes.
How does the ZBTTM architecture eliminate dead cycles in the 71V65703S80PFGI?
The ZBTTM (Zero Bus Turnaround) architecture in the 71V65703S80PFGI removes idle cycles between consecutive read and write operations by allowing immediate bus direction reversal. Unlike conventional SRAMs requiring OE deassertion and bus stabilization, the 71V65703S80PFGI uses synchronized control and flow-through outputs to transition seamlessly-enabling back-to-back accesses at full 100 MHz clock rate.
Can the 71V65703S80PFGI operate in industrial temperature conditions?
Yes, the 71V65703S80PFGI is rated for industrial temperature operation from –40°C to +85°C. This rating is confirmed in the "Recommended Operating Temperature and Supply Voltage" table and applies to the "I" grade suffix in the part number. It ensures reliable functionality in harsh environments such as outdoor telecom cabinets and factory-floor automation equipment.
What is the function of the ZZ pin on the 71V65703S80PFGI?
The ZZ pin on the 71V65703S80PFGI is an asynchronous sleep mode input. When driven HIGH, it internally gates the clock and places the device in ultra-low-power state while guaranteeing data retention. No timing sequence or additional control is required-making it ideal for power-aware systems needing rapid wake-up with preserved memory contents.
71V65703S80PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65703S80PFGI FAQ
1.How can I place an order for 71V65703S80PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80PFGI reliable?
The price and inventory of 71V65703S80PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80PFGI is usually 5 days.
3.What payment methods are accepted for 71V65703S80PFGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S80PFGI transactions.
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4.How is shipping managed for 71V65703S80PFGI?
71V65703S80PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S80PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80PFGI?
For technical support, including 71V65703S80PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80PFGI requirements.
6.How does Aetrix verify that 71V65703S80PFGI is sourced from the original manufacturer or authorized distributors?
All 71V65703S80PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80PFGI meets industry standards.
7.What is the process for return or replacement of 71V65703S80PFGI?
All 71V65703S80PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80PFGI part is unused and in its original packaging.
Return procedure for 71V65703S80PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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