Renesas 71V65703S80PFGI8
- Part No.:
- 71V65703S80PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65703S80PFGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S80PFGI8 from IDT (now Renesas) is a 9,437,184-bit (9 Mbit) 3.3V synchronous ZBT™ SRAM organized as 256K × 36, delivering 100 MHz operation with 7.5 ns clock-to-data access. It implements Zero Bus Turnaround to eliminate dead cycles between read/write transitions and supports 4-word interleaved or linear burst modes via ADV/LD and LBO control - deployed in high-speed network packet buffers and telecom line-card memory subsystems.
For engineers reviewing the 71V65703S80PFGI8 datasheet, 71V65703S80PFGI8 pinout, 71V65703S80PFGI8 application, or 71V65703S80PFGI8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), 3.3V core/I/O supply tolerance, and burst-mode byte-write granularity for cache coherency logic.
Technical Context
The 71V65703S80PFGI8 uses a synchronous CMOS architecture with registered address/control inputs triggered on the rising CLK edge, flow-through data outputs (no output register), and an internally synchronized OE path that eliminates external OE timing constraints. Its burst counter advances on ADV/LD = HIGH, while LBO selects between linear or interleaved addressing sequences - both fully static and stable during operation.
Three chip enables (CE1, CE2 active-low; CE2 active-high) enable depth expansion without bus contention; CEN suspends all synchronous activity while preserving register state; ZZ enables asynchronous sleep mode with guaranteed data retention. The device requires no power sequencing and tolerates I/O voltage up to VDDQ + 0.5 V during ramp-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9,437,184 bits) - supports high-bandwidth parallel data paths in packet forwarding engines. |
| Max Clock Frequency | 100 MHz - enables 10 ns cycle time for real-time buffering in 10Gbps+ Ethernet and CPRI interfaces. |
| Clock-to-Data Access | 7.5 ns - defines minimum latency from CLK rise to valid Q output, critical for deterministic pipeline timing. |
| ZBT™ Feature | No dead cycles between read/write transitions - eliminates bus turnaround overhead in burst-intensive memory controllers. |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual-rail design isolates core logic noise from I/O switching transients. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade deployment in base station and industrial automation equipment. |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus traffic and improves throughput in cache-line-aligned accesses. |
| Byte Write Control | BW1–BW4 enable independent 9-bit byte writes - essential for partial-word updates without read-modify-write cycles. |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, lead-free and RoHS-compliant (Pb-free, Green part per ordering info).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus - selects one of 256K locations; sampled on rising CLK when ADV/LD = LOW. |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) allow flexible depth expansion and hierarchical deselect. |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction one clock cycle after address load. |
| ADV/LD | Advance Burst / Load Address | Drives burst counter increment (HIGH) or loads new external address (LOW); controls burst initiation and termination. |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence - LBO = LOW → linear; LBO = HIGH → interleaved (IEEE 1149.1 compatible). |
| BW1–BW4 | Byte Write Enables | Four active-low signals enabling 9-bit byte writes - permits granular updates to I/O[0:31] and I/OP[1:4]. |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge (OE excluded). |
| OE | Asynchronous Output Enable | Active-low tri-state control - can be tied LOW permanently since internal synchronization removes timing dependency. |
| ZZ | Asynchronous Sleep Mode | Active-high entry into low-power retention mode; clocks gated internally, data retained, fast wake-up. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through data path - inputs registered, outputs unregistered for minimal read latency. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle bus cycles between consecutive reads/writes - increases effective bandwidth by up to 25% in burst-heavy workloads. |
| Internally Synchronized OE | Removes critical OE setup/hold timing constraints - simplifies PCB layout and eliminates need for OE delay matching. |
| Single R/W Pin Control | Reduces control bus width versus separate RD/WR signals - lowers FPGA I/O count and routing complexity in memory controllers. |
| 4-Word Burst Counter | Generates sequential addresses automatically - cuts address bus toggling by 75% per burst, reducing EMI and power consumption. |
| Individual Byte Write (BW1–BW4) | Enables 9-bit sub-word writes without read-modify-write - preserves data integrity in multi-threaded buffer management. |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless depth expansion across multiple devices - maintains full 100 MHz performance without glue logic. |
Applications
| Network Packet Buffer | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as ingress/egress packet buffer with ZBT™ eliminating turnaround gaps between frame reads and writes. Use Value: Achieves sustained 100 MHz throughput with deterministic 7.5 ns read access - meets sub-100 ns round-trip buffering requirements for 10Gbps line rates. |
Use Scenario: Buffering CPRI/Ir interface data in 4G/5G remote radio units requiring jitter-free, burst-capable memory. IC Role / Device Role / Timing Role: Synchronous SRAM providing flow-through outputs and 4-word burst for aligned IQ sample storage with minimal pipeline stalls. Use Value: Linear burst mode matches CPRI frame structure; industrial temp rating ensures reliability in outdoor base station enclosures. |
| Industrial PLC Data Cache | Test Equipment Pattern Memory |
|
Use Scenario: Real-time I/O mapping and status history logging in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Dual-rail (VDD/VDDQ) SRAM supporting isolated noise domains and byte-write capability for atomic tag updates. Use Value: BW1–BW4 enables concurrent update of status flags and counters without corrupting adjacent process variables. |
Use Scenario: Storing high-speed digital stimulus/response patterns in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: 100 MHz ZBT™ SRAM serving as pattern RAM with zero-cycle turnaround between vector reads and result writes. Use Value: Eliminates bus idle time during pattern loop execution - increases test throughput by ~22% versus standard SSRAMs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18 organization, 165-ball fBGA only, no TQFP option; 133 MHz max, 6.5 ns access. | Better bandwidth density but incompatible pinout and package - requires PCB redesign and layout revalidation. | Select only if migrating to higher-density x18 interface and fBGA assembly capability exists. |
| AS7C3256A | Asynchronous SRAM, 32K × 8, no burst, no ZBT, 15 ns access; SOIC-28 package. | Lacks synchronous timing, burst, and ZBT - unsuitable for high-speed controller interfaces requiring deterministic latency. | Consider only for legacy cost-sensitive designs where timing margins exceed 15 ns and burst is unnecessary. |
Compared with CY7C1373KV18 and AS7C3256A, the 71V65703S80PFGI8 uniquely balances TQFP-100 manufacturability, ZBT™ timing efficiency, and industrial temperature support - making it optimal for field-deployable networking and telecom hardware where layout stability and thermal robustness are non-negotiable.
Availability
71V65703S80PFGI8 is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, industrial PLC data caches, and ATE pattern memory requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for 71V65703S80PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65703S80PFGI8 belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-turnaround, burst-capable memory subsystems in carrier-grade infrastructure where deterministic latency and bus efficiency are critical.
FAQ
What is the maximum operating frequency and access time of the 71V65703S80PFGI8?
The 71V65703S80PFGI8 operates at up to 100 MHz with a guaranteed clock-to-data access time of 7.5 ns. This specification is validated across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The 71V65703S80PFGI8 achieves this performance using a synchronous flow-through output architecture with no output register delay.
Does the 71V65703S80PFGI8 support burst read and write operations?
Yes, the 71V65703S80PFGI8 supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin. Burst mode is initiated by sampling ADV/LD = HIGH after an initial address load (ADV/LD = LOW). Each burst cycle advances the internal counter automatically, and the 71V65703S80PFGI8 guarantees full 100 MHz burst throughput without cycle penalties.
How does the ZBTTM feature improve system-level performance in the 71V65703S80PFGI8?
ZBTTM (Zero Bus Turnaround) eliminates idle bus cycles when transitioning between read and write operations - a common bottleneck in traditional SSRAMs. In the 71V65703S80PFGI8, the bus remains active across consecutive cycles, increasing effective bandwidth by up to 25% in burst-intensive applications like packet buffering and pattern generation.
What are the power supply requirements for the 71V65703S80PFGI8?
The 71V65703S80PFGI8 requires two independent 3.3 V supplies: VDD (core logic, 3.3 V ±5%) and VDDQ (I/O drivers, 3.3 V ±5%). These rails may be supplied from separate regulators to minimize noise coupling. The 71V65703S80PFGI8 has no power sequencing requirement, and I/O pins tolerate up to VDDQ + 0.5 V during power ramp-up.
Can the 71V65703S80PFGI8 operate in low-power mode, and how is it enabled?
Yes, the 71V65703S80PFGI8 supports asynchronous low-power sleep mode via the ZZ pin. When ZZ is driven HIGH, the internal clock is gated and dynamic power drops significantly while retaining memory contents. Data retention is guaranteed over the full industrial temperature range, and wake-up is immediate upon ZZ return to LOW.
71V65703S80PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65703S80PFGI8 FAQ
1.How can I place an order for 71V65703S80PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S80PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S80PFGI8 reliable?
The price and inventory of 71V65703S80PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S80PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V65703S80PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S80PFGI8 transactions.
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4.How is shipping managed for 71V65703S80PFGI8?
71V65703S80PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S80PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S80PFGI8?
For technical support, including 71V65703S80PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S80PFGI8 requirements.
6.How does Aetrix verify that 71V65703S80PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S80PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S80PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V65703S80PFGI8?
All 71V65703S80PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S80PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S80PFGI8 part is unused and in its original packaging.
Return procedure for 71V65703S80PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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