Renesas 71V65703S85BG
- Part No.:
- 71V65703S85BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65703S85BG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S85BG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 bits (9.44 Mbit), featuring zero bus turnaround, 100 MHz operation (7.5 ns clock-to-data access), flow-through outputs, and 4-word burst capability. It serves as high-speed buffer/cache memory in networking switches, packet processors, and FPGA-based data path acceleration where deterministic latency and dead-cycle elimination are critical.
For engineers reviewing the 71V65703S85BG datasheet, 71V65703S85BG pinout, 71V65703S85BG application, or 71V65703S85BG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and byte-write enable (BW1–BW4) control for partial-word writes in multi-protocol interface buffers.
Technical Context
The 71V65703S85BG implements a synchronous, clocked architecture with registered address/control inputs and flow-through (unregistered) data outputs. Its on-chip burst counter advances on ADV/LD = HIGH, supporting linear or interleaved sequences selected by LBO, and eliminates bus turnaround delay between read/write transitions via ZBT™ protocol.
It features three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, asynchronous OE and ZZ controls, and separate VDD (core) and VDDQ (I/O) supplies. All synchronous operations are edge-triggered on CLK rising edge, with CEN enabling full clock gating for power management without state loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9.44 Mbit); supports 512K × 18 via pin-compatible variant - defines data bus width and address space for system-level memory mapping |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time - directly determines sustained throughput in burst-mode packet buffering |
| Access Time | 7.5 ns clock-to-data (tCD) - guarantees deterministic read latency from CLK edge to valid Q output |
| Burst Capability | 4-word interleaved or linear burst - reduces address setup overhead per transfer, improving effective bandwidth in streaming applications |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires dual-rail 3.3 V regulation; decoupling must meet fast transient current demands |
| Operating Temperature | –40°C to +85°C (industrial grade) - validated for deployment in telecom infrastructure and industrial control enclosures |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm) - compatible with standard SMT reflow profiles and automated optical inspection |
Pinout & Package
71V65703S85BG is packaged in a 100-pin plastic thin quad flatpack (TQFP), JEDEC MO-145, 14 mm × 20 mm body, 0.5 mm lead pitch. Pin 1 is marked by a dot or beveled corner at top-left when viewed top-down with pins facing outward.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled - selects one of 256K locations |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition deselects device - enables 3-way depth expansion without external logic |
| R/W | Read/Write Control | Synchronous signal defining cycle type; sampled with ADV/LD to initiate load-read or load-write - determines direction of data flow one cycle later |
| ADV/LD | Advance Burst / Load Address | Controls burst counter: LOW loads new external address; HIGH increments internal counter - enables seamless burst sequencing without address bus updates |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte lanes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) - allows partial-word writes without masking logic |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge - sets maximum operational frequency and synchronizes internal registers |
| OE | Output Enable | Asynchronous, active-low; tri-states I/O pins independently of clock - permits dynamic bus sharing without timing constraints |
| ZZ | Sleep Mode Input | Asynchronous, active-high; gates internal clock and reduces ICC to standby level while retaining data - used for low-power idle states in burst-idle intervals |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through data path; input registered, output unregistered - eliminates output register delay, enabling immediate read data availability |
| VDD, VDDQ, VSS | Power/Ground | VDD = core supply (3.3 V), VDDQ = I/O supply (3.3 V), VSS = common ground - requires separate decoupling for noise isolation between logic and I/O domains |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive read/write or write/read bursts - increases effective bus utilization by up to 33% in mixed-access traffic |
| Internally synchronized OE | Removes need for external OE timing control - simplifies PCB layout and eliminates race conditions in high-speed bus arbitration |
| Single R/W pin | Reduces control signal count versus separate RD/WR lines - lowers FPGA I/O usage and simplifies address decode logic |
| Individual byte write (BW1–BW4) | Enables 9-bit granularity writes without external byte-lane gating - critical for protocol header updates in packet processing pipelines |
| Three chip enables (CE1/CE2/CE2) | Supports direct depth expansion across multiple devices - avoids glue logic for memory banks >256K × 36 |
| Flow-through outputs | Delivers read data one clock cycle after address/control setup - provides minimum-latency response for real-time data path buffering |
Applications
| High-Speed Packet Buffering | Network Switch Data Path |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payload fragments in Layer 2/3 switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly with SerDes and MAC controllers. Use Value: 100 MHz burst reads/writes and ZBT™ eliminate turnaround stalls, sustaining line-rate forwarding for 10 GbE+ interfaces. |
Use Scenario: Acting as shared memory for lookup tables, queue descriptors, and statistics counters in modular switch fabrics. IC Role / Device Role / Timing Role: Deterministic-access memory resource synchronized to switch fabric clock domain. Use Value: Flow-through outputs and 7.5 ns tCD ensure sub-10 ns read latency for priority queue arbitration and congestion control decisions. |
| FPGA-Based Protocol Acceleration | Industrial Real-Time Control Buffering |
|
Use Scenario: Offloading TCP/IP checksum, encryption, or packet classification tasks from host CPU using FPGA co-processing. IC Role / Device Role / Timing Role: Dual-port accessible memory block for FPGA soft-core and external processor coherency. Use Value: 4-word burst mode and byte-write enables accelerate partial updates of protocol state variables without full-word overwrites. |
Use Scenario: Buffering sensor fusion data streams (e.g., motion, thermal, vibration) in programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: Industrial-grade SRAM providing reliable, jitter-free data staging between ADCs and control algorithms. Use Value: –40°C to +85°C operation and ZZ sleep mode support extended uptime and low-power idle modes in harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18 organization, 165-ball fBGA only, no TQFP option; 133 MHz max, 6.5 ns tCD | Higher density but narrower data bus; suited for systems prioritizing capacity over 36-bit parallelism | Select when migrating to higher-density, BGA-only designs requiring faster access but accepting x18 interface redesign |
| AS7C3256B | Commercial-grade only (0°C to +70°C), no ZZ sleep mode, no burst counter, asynchronous interface | Lacks ZBT™, burst, and industrial temp - limited to cost-sensitive, non-real-time embedded buffers | Choose only for non-critical, ambient-temperature applications where deterministic timing and low-power sleep are unnecessary |
Compared with CY7C1373KV18 and AS7C3256B, the 71V65703S85BG uniquely delivers 256K × 36 organization in TQFP-100 with ZBT™, industrial temperature, and integrated burst counter - making it irreplaceable for legacy or space-constrained 36-bit data path designs requiring guaranteed turnaround-free operation.
Availability
71V65703S85BG is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch data path acceleration, and FPGA-based protocol offload applications requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V65703S85BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65703S85BG belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency, high-throughput data buffering in networking and real-time embedded systems where bus efficiency and deterministic timing are paramount.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V65703S85BG?
The 71V65703S85BG operates at up to 100 MHz with a guaranteed clock-to-data access time (tCD) of 7.5 ns. This specification is measured under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply, ensuring deterministic performance in real-world deployed systems. The 71V65703S85BG achieves this timing without requiring external wait-state insertion.
Does the 71V65703S85BG support both linear and interleaved burst sequences, and how is the mode selected?
Yes, the 71V65703S85BG supports both linear and interleaved 4-word burst sequences. The mode is selected by the static LBO (Linear/Interleaved Burst Order) input: LBO = LOW configures linear order (A0, A0+1, A0+2, A0+3); LBO = HIGH configures interleaved order (A0, A0+2, A0+1, A0+3). LBO must remain stable during burst operation and can be hardwired or controlled by system logic.
How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S85BG?
ZBTTM in the 71V65703S85BG eliminates dead cycles between consecutive read and write operations by allowing immediate bus direction reversal. When a read burst completes and a write burst begins on the next cycle, no idle clock period is required - the device internally manages bus contention and timing handoff. This is implemented via dedicated control logic and flow-through outputs, not external bus arbitration.
What are the power supply requirements for the 71V65703S85BG, and are VDD and VDDQ interchangeable?
The 71V65703S85BG requires two independent 3.3 V supplies: VDD (core logic, 3.3 V ±5%) and VDDQ (I/O drivers, 3.3 V ±5%). They are not interchangeable - VDD powers internal registers and control logic; VDDQ powers the output drivers and input receivers. Separating them allows independent noise filtering and improves signal integrity on the 36-bit data bus.
Can the 71V65703S85BG operate in low-power mode, and how is it activated?
Yes, the 71V65703S85BG supports low-power sleep mode via the asynchronous ZZ input. When ZZ is driven HIGH, the internal clock is gated, reducing ICC to standby current while retaining full data integrity in memory cells. Sleep mode exits automatically on ZZ transition to LOW, with data available after one clock cycle - no initialization or refresh is needed.
71V65703S85BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65703S85BG FAQ
1.How can I place an order for 71V65703S85BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S85BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S85BG reliable?
The price and inventory of 71V65703S85BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85BG is usually 5 days.
3.What payment methods are accepted for 71V65703S85BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S85BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65703S85BG?
71V65703S85BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S85BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S85BG?
For technical support, including 71V65703S85BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85BG requirements.
6.How does Aetrix verify that 71V65703S85BG is sourced from the original manufacturer or authorized distributors?
All 71V65703S85BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BG meets industry standards.
7.What is the process for return or replacement of 71V65703S85BG?
All 71V65703S85BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85BG part is unused and in its original packaging.
Return procedure for 71V65703S85BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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