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Renesas 71V65703S85BGG8

Part No.:
71V65703S85BGG8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65703S85BGG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,053

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Product details

Overview

71V65703S85BGG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), delivering 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer/cache memory in network switches, telecom line cards, and packet processing engines requiring deterministic burst transfers.

For engineers reviewing the 71V65703S85BGG8 datasheet, 71V65703S85BGG8 pinout, 71V65703S85BGG8 application, or 71V65703S85BGG8 equivalent, key selection criteria include ZBT™ burst capability (linear/interleaved), individual byte write control (BW1–BW4), asynchronous OE/ZZ for output disable and sleep mode, and JEDEC-standard 119-ball BGA (BGG119) packaging compatible with industrial temperature range (–40°C to +85°C).

Technical Context

The 71V65703S85BGG8 implements a synchronous dual-edge-triggered architecture with registered address/control inputs and registered data-in path, while using flow-through (unregistered) data-out path. Its on-chip burst counter advances on ADV/LD = HIGH, supporting four-word bursts with LBO-selectable linear or interleaved addressing sequences.

Three chip enables (CE1, CE2 active-low; CE2 active-high) enable depth expansion without external logic. Clock Enable (CEN) suspends all synchronous operations while preserving register state, and ZZ input gates internal clock to enter low-power sleep mode with guaranteed data retention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36 (9.4 Mbit); supports 512K × 18 via pin-compatible variant
Max Clock Frequency100 MHz - enables 10 ns cycle time for high-throughput packet buffering
Clock-to-Data Access7.5 ns - guarantees deterministic read latency for real-time traffic shaping
ZBT™ ArchitectureNo dead cycles between read/write transitions - eliminates bus turnaround overhead in full-duplex data paths
Burst Capability4-word burst (linear or interleaved) - reduces address setup overhead per transfer block
Supply VoltagesVDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - ensures compatibility with 3.3V logic families
Operating Temperature–40°C to +85°C - qualified for industrial-grade networking and base station applications
Package119-ball fine-pitch BGA (BGG119), 14 mm × 20 mm - supports high-density PCB layouts with thermal pad

Pinout & Package

71V65703S85BGG8 is packaged in a JEDEC-standard 119-ball fine-pitch ball grid array (BGG119), 14 mm × 20 mm footprint, with exposed thermal pad. Pinout conforms to BG119 layout for 256K × 36 configuration (per datasheet drawing 5298 drw 13a).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high) allow flexible depth expansion without glue logic
R/WRead/Write ControlSynchronous signal defining cycle type; determines data direction one clock cycle after address load
ADV/LDBurst Counter ControlLOW loads new external address; HIGH increments internal burst counter - enables seamless burst sequencing
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence
BW1–BW4Byte Write EnablesFour active-low signals controlling 9-bit byte writes; support partial-word updates without read-modify-write
CLKSystem ClockPrimary timing reference; all synchronous inputs referenced to rising edge
OEOutput EnableAsynchronous control; tri-states I/Os immediately when HIGH - eliminates need for precise timing coordination
ZZSleep ModeAsynchronous input gating internal clock; reduces power consumption while retaining memory contents
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus; input path registered, output path flow-through - minimizes read latency
VDD, VDDQ, VSSPower/GroundDual-supply design: VDD powers core logic; VDDQ powers I/O drivers - improves noise immunity and signal integrity

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates idle cycles between consecutive read/write operations - increases effective bus utilization by up to 33% in mixed-access workloads
Internally Synchronized OERemoves requirement for external OE timing control - simplifies interface design and reduces PCB routing complexity
Single R/W PinReduces control signal count versus separate RD/WR lines - saves FPGA/CPLD I/O resources and simplifies address decode logic
Individual Byte Write (BW1–BW4)Enables selective 9-bit updates without disturbing adjacent bytes - critical for protocol header manipulation in packet processors
Flow-Through OutputsDelivers data one clock cycle after access initiation - achieves lowest possible read latency for time-critical applications
Three Chip EnablesSupports seamless memory depth expansion across multiple devices - avoids external address decoding logic in multi-SRAM systems

Applications

Network Packet BufferingTelecom Line Card Cache

Use Scenario: Storing ingress/egress packet headers and payload fragments in Layer 2/3 switches during classification and forwarding.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 7.5 ns read access and zero-turnaround burst writes.

Use Value: Enables line-rate processing of 10 Gbps+ Ethernet traffic by eliminating bus arbitration delays between header parse and payload store operations.

Use Scenario: Caching ATM cell headers and signaling messages in DSLAM or OLT line cards operating in harsh environmental conditions.

IC Role / Device Role / Timing Role: Industrial-temperature-rated ZBT SRAM providing burst-mode access for time-sensitive QoS queue management.

Use Value: Guarantees reliable operation at –40°C to +85°C while sustaining 100 MHz throughput for real-time traffic shaping and policing.

Baseband Processor MemoryRadar Signal Processing Buffer

Use Scenario: Serving as instruction/data scratchpad for DSP cores in wireless baseband units handling LTE/5G physical layer processing.

IC Role / Device Role / Timing Role: Synchronous SRAM interfaced directly to DSP EMIF with burst-aligned address generation and byte-selectable writes.

Use Value: Reduces memory stall cycles during FFT/IFFT execution by enabling 4-word burst reads aligned to natural data widths.

Use Scenario: Buffering digitized IF samples in phased-array radar receivers prior to digital beamforming computation.

IC Role / Device Role / Timing Role: Low-jitter, flow-through SRAM capturing ADC output streams with precise clock-to-data timing (7.5 ns max).

Use Value: Preserves signal integrity in wideband sampling by avoiding output register-induced skew across 36-bit parallel bus.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355BV18-100BZI100 MHz, 512K × 18 organization; different burst order control (no LBO pin); uses separate BYTE pins instead of BW1–BW4Optimized for x18 systems; lacks native 256K × 36 mapping and ZBT™-specific timing optimizationsSelect when system uses 18-bit data bus and requires Cypress's QDR-II+ compatibility
AS7C33128PFS-10BIN100 MHz, 256K × 36; no ZBT™ architecture - includes standard synchronous SRAM timing with turnaround cyclesHigher latency in mixed read/write sequences; requires external OE management and lacks burst counterChoose for cost-sensitive designs where zero-turnaround is non-critical and legacy timing models are acceptable

Compared with CY7C1355BV18-100BZI and AS7C33128PFS-10BIN, the 71V65703S85BGG8 uniquely delivers ZBT™-optimized zero-turnaround operation, integrated burst counter with LBO-selectable sequencing, and true 36-bit-wide byte-write granularity - making it the only option for high-efficiency packet buffer architectures requiring deterministic sub-10 ns read latency and seamless burst transitions.

Availability

71V65703S85BGG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card cache, baseband processor memory, and radar signal processing applications requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.

Supply support for 71V65703S85BGG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications infrastructure.

The 71V65703S85BGG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth data buffering in carrier-grade networking and real-time signal processing systems.

FAQ

What is the memory organization and total capacity of the 71V65703S85BGG8?

The 71V65703S85BGG8 is organized as 256K × 36, providing 9,437,184 bits (9.4 Mbit) of synchronous SRAM. This configuration supports 36-bit-wide data transfers and is pin-compatible with the 512K × 18 variant (71V65903) in the same family. The device uses a 18-bit address bus (A0–A17) and delivers deterministic access timing optimized for burst-oriented traffic flows.

Does the 71V65703S85BGG8 support burst read and write operations, and how is burst order controlled?

Yes, the 71V65703S85BGG8 supports 4-word burst operations for both reads and writes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The internal burst counter advances on ADV/LD = HIGH, and the initial address is loaded when ADV/LD = LOW - enabling predictable, hardware-controlled burst sequencing without CPU intervention.

How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S85BGG8?

ZBTTM eliminates idle cycles between consecutive read and write operations by allowing immediate bus direction reversal. In the 71V65703S85BGG8, this is achieved through synchronized control logic that decouples address/control latching from data transfer timing. When a write cycle completes, the next read cycle begins on the subsequent clock edge without requiring bus release or re-arbitration - increasing effective bandwidth in mixed-access applications like packet buffering.

What are the power supply requirements and thermal specifications for the 71V65703S85BGG8?

The 71V65703S85BGG8 requires two 3.3 V supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. It operates across –40°C to +85°C (industrial grade) and features an asynchronous ZZ pin that gates the internal clock to reduce power during idle periods while maintaining data retention. The BGG119 package includes a thermal pad to support dissipation up to 2.0 W maximum.

Can the 71V65703S85BGG8 be used with standard 3.3V CMOS logic interfaces without level-shifting?

Yes, the 71V65703S85BGG8 is fully compatible with standard 3.3V CMOS interfaces. Its VIH (input high voltage) is specified as 2.0 V minimum and VDDQ + 0.3 V maximum, and VIL (input low voltage) is –0.3 V to 0.8 V - matching common 3.3V logic thresholds. The device also supports direct connection to FPGAs, ASICs, and DSPs with 3.3V I/O banks, and its flow-through outputs eliminate timing mismatches caused by output registers.

71V65703S85BGG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65703S85BGG8 FAQ

1.How can I place an order for 71V65703S85BGG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S85BGG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65703S85BGG8 reliable?

The price and inventory of 71V65703S85BGG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85BGG8 is usually 5 days.

3.What payment methods are accepted for 71V65703S85BGG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S85BGG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65703S85BGG8?

71V65703S85BGG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65703S85BGG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S85BGG8?

For technical support, including 71V65703S85BGG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85BGG8 requirements.

6.How does Aetrix verify that 71V65703S85BGG8 is sourced from the original manufacturer or authorized distributors?

All 71V65703S85BGG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BGG8 meets industry standards.

7.What is the process for return or replacement of 71V65703S85BGG8?

All 71V65703S85BGG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BGG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S85BGG8 part is unused and in its original packaging.

Return procedure for 71V65703S85BGG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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