Renesas 71V65703S85BGGI
- Part No.:
- 71V65703S85BGGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65703S85BGGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,931
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Product details
Overview
71V65703S85BGGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 bits (9.44 Mbit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround (ZBT) for dead-cycle-free read/write transitions, flow-through outputs, and 4-word burst capability. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA co-processor interfaces requiring deterministic latency.
For engineers reviewing the 71V65703S85BGGI datasheet, 71V65703S85BGGI pinout, 71V65703S85BGGI application, or 71V65703S85BGGI equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O compatibility, industrial temperature support (–40°C to +85°C), TQFP/BGA package options, and byte-write control granularity for partial-word updates.
Technical Context
The 71V65703S85BGGI implements a synchronous dual-edge-triggered architecture with registered address/control inputs and unregistered (flow-through) data outputs. Its on-chip burst counter supports linear or interleaved sequences via the LBO pin, and ADV/LD controls either external address load (low) or internal counter increment (high).
Three chip enables (CE1, CE2 active-low; CE2 active-high) enable depth expansion without external logic. Clock Enable (CEN) suspends all synchronous operations while preserving register state, and ZZ input places the device in low-power sleep mode with guaranteed data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports 512K × 18-bit via pin-compatible variant |
| Clock Frequency | 100 MHz maximum - enables 10 ns cycle time for high-throughput buffering |
| Access Time | 7.5 ns clock-to-data - defines minimum latency between CLK rise and valid Q output |
| ZBT Architecture | Zero Bus Turnaround - eliminates idle cycles between consecutive reads/writes |
| Burst Mode | 4-word burst (linear or interleaved) - reduces address overhead for sequential accesses |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation |
| Operating Temperature | –40°C to +85°C (industrial grade) - qualified for embedded telecom and industrial control |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 119-ball BGA (BGG), or 165-ball fine-pitch BGA (BQG). The 71V65703S85BGGI uses the BGG119 package variant (119-ball grid array, 1.0 mm pitch, 14 mm × 20 mm footprint).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus for 256K-depth addressing |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge |
| R/W | Read/Write Control | Synchronous signal determining cycle type; sampled with ADV/LD to initiate load operation |
| ADV/LD | Advance Burst / Load Address | Low = load new external address; high = increment internal burst counter |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence (low = linear, high = interleaved) |
| BW1–BW4 | Byte Write Enables | Four active-low signals enabling independent 9-bit byte writes within 36-bit word |
| CE1, CE2, CE2 | Chip Enables | Three enables (CE1/CE2 low, CE2 high) for flexible depth expansion and deselect control |
| OE | Output Enable | Asynchronous; tri-states outputs when high - may be tied low for simplified interface |
| ZZ | Sleep Mode | Asynchronous high-active input gating internal clock and reducing power to minimum retention level |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional flow-through data bus (no output register); supports burst reads/writes |
Key Features
| Feature | Design Value |
|---|---|
| Zero Bus Turnaround (ZBT) | Eliminates dead cycles between read and write bursts - improves sustained bandwidth in ping-pong buffer applications |
| Flow-Through Outputs | No output register - reduces read latency by one clock cycle versus pipelined SRAMs |
| Individual Byte Write Control | BW1–BW4 allow selective 9-bit writes without masking logic or full-word overwrite overhead |
| Internally Synchronized OE | OE is asynchronous but internally synchronized - avoids metastability without external clock-domain crossing logic |
| Three Chip Enables | Enables seamless depth expansion across multiple devices using only CE logic - no address decoding required |
Applications
| Packet Buffering in Switch ASICs | FPGA-Based Protocol Accelerators |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches before classification and forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with switch fabric controller and MAC layer logic. Use Value: ZBT architecture ensures continuous data flow during header inspection → payload fetch → checksum update sequences without bus idle cycles. | Use Scenario: Offloading TCP/IP stack processing from host CPU using FPGA-based hardware accelerators in server NICs. IC Role / Device Role / Timing Role: Dual-port-accessible SRAM acting as descriptor queue and packet staging buffer between PCIe interface and custom datapath logic. Use Value: 4-word burst mode reduces address setup overhead for sequential descriptor reads, improving DMA efficiency by >25% vs. non-burst SRAMs. |
| Industrial PLC Motion Control Buffers | Baseband Processing in Wireless Infrastructure |
Use Scenario: Real-time buffering of position feedback, trajectory commands, and servo loop coefficients in multi-axis CNC controllers. IC Role / Device Role / Timing Role: Deterministic-latency memory for cyclic motion profile updates synchronized to 1 kHz+ servo clock. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V I/O compatibility ensure reliable operation in fanless, thermally constrained enclosures. | Use Scenario: Staging IQ samples and FFT intermediate results in LTE/5G remote radio head (RRH) digital front-end processing. IC Role / Device Role / Timing Role: Low-jitter, flow-through SRAM providing pipeline stages between ADC/DAC interfaces and DSP cores. Use Value: 7.5 ns clock-to-data access and burst capability meet strict timing budgets for sub-100 ns sample-to-process latency requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100BGXI | 100 MHz, 256K × 36, but uses QDR-II architecture with separate read/write ports and differential clocks | Requires differential clock routing and separate R/W address buses - incompatible pinout and control protocol | Select only if dual-port concurrent access is required and board layout supports QDR-II signaling |
| AS7C3256A-10JIN | 10 ns access, 256K × 36, asynchronous interface - no clock, no burst, no ZBT | Lacks synchronous timing, burst capability, and zero-turnaround - unsuitable for high-speed pipelined systems | Consider only for cost-sensitive, low-frequency control-plane buffers where deterministic latency is not critical |
Compared with CY7C1362BV33-100BGXI and AS7C3256A-10JIN, the 71V65703S85BGGI uniquely delivers ZBT timing, flow-through outputs, and synchronous burst control in a single-package solution optimized for high-throughput, low-latency buffering without dual-port complexity or asynchronous timing uncertainty.
Availability
71V65703S85BGGI is available at Aetrix Electronics and suitable for network infrastructure, industrial automation, and wireless baseband applications requiring stable component supply, long-term lifecycle support, and industrial-grade thermal performance.
Supply support for 71V65703S85BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65703S85BGGI belongs to IDT's ZBT SRAM product line, designed specifically for high-speed packet buffering, real-time signal processing, and FPGA-adjacent memory applications demanding deterministic latency and burst efficiency.
FAQ
What is the memory organization and capacity of the 71V65703S85BGGI?
The 71V65703S85BGGI is organized as 256K × 36 bits, delivering 9,437,184 total bits (9.44 Mbit) of synchronous SRAM storage. This configuration supports 36-bit wide data paths ideal for 32-bit systems with parity or ECC overhead. It shares pin compatibility with the 512K × 18 variant (71V65903), allowing layout reuse across density options.
Does the 71V65703S85BGGI support burst read and write operations?
Yes, the 71V65703S85BGGI supports 4-word burst operations in both linear and interleaved sequences, selected by the LBO pin. Burst mode is initiated after loading an initial address with ADV/LD low, then advancing the internal counter with ADV/LD high. Each burst cycle delivers four consecutive words with a single address setup, reducing control overhead in streaming applications.
How does the Zero Bus Turnaround (ZBT) feature work in the 71V65703S85BGGI?
The ZBT feature in the 71V65703S85BGGI eliminates idle bus cycles between alternating read and write operations. When transitioning from a read burst to a write burst (or vice versa), the device immediately accepts the next command on the subsequent clock edge - no wait states or turnaround cycles are inserted. This is achieved through internal handshake logic that manages bus direction and timing without external intervention.
What are the power supply requirements for the 71V65703S85BGGI?
The 71V65703S85BGGI requires two independent 3.3 V supplies: VDD (core logic, 3.3 V ±5%) and VDDQ (I/O drivers, 3.3 V ±5%). These must be decoupled per JEDEC guidelines. The device also supports asynchronous sleep mode via the ZZ pin, reducing power consumption while maintaining data retention across the full industrial temperature range.
Can the 71V65703S85BGGI operate in industrial temperature conditions?
Yes, the 71V65703S85BGGI is rated for industrial temperature operation from –40°C to +85°C. This qualification covers all electrical specifications including access time, setup/hold timing, and DC parameters. The BGG119 package variant used in this part is specifically characterized and screened for reliability under these extended thermal conditions.
71V65703S85BGGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65703S85BGGI FAQ
1.How can I place an order for 71V65703S85BGGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S85BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S85BGGI reliable?
The price and inventory of 71V65703S85BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85BGGI is usually 5 days.
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5.How can I obtain technical support or documentation for 71V65703S85BGGI?
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6.How does Aetrix verify that 71V65703S85BGGI is sourced from the original manufacturer or authorized distributors?
All 71V65703S85BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BGGI meets industry standards.
7.What is the process for return or replacement of 71V65703S85BGGI?
All 71V65703S85BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BGGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85BGGI part is unused and in its original packaging.
Return procedure for 71V65703S85BGGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S85BGGI Tags

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M24C02-WMN6TP
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