Renesas 71V65703S85BQ8
- Part No.:
- 71V65703S85BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S85BQ8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S85BQ8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs for high-speed burst data transfer in networking and telecom buffer applications.
For engineers reviewing the 71V65703S85BQ8 datasheet, 71V65703S85BQ8 pinout, 71V65703S85BQ8 application, or 71V65703S85BQ8 equivalent, key selection criteria include its 100-pin TQFP package, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW4), synchronous R/W and ADV/LD interface, and industrial temperature support (–40°C to +85°C).
Technical Context
The 71V65703S85BQ8 implements a synchronous dual-edge-triggered architecture with an on-chip burst counter and flow-through output path-no output register-enabling deterministic 1-cycle latency from address/control assertion to data availability. Its ZBT™ architecture eliminates dead cycles by allowing immediate bus direction reversal after any access.
It uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, supports asynchronous OE and ZZ (sleep mode), and features internally synchronized output buffer enable-removing external OE timing constraints. The LBO pin statically selects linear or interleaved burst order, and CEN suspends all synchronous operation without affecting output state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9.4 Mbit); supports 512K × 18 via pin-compatible variant |
| Clock Frequency | 100 MHz max; enables 10 ns cycle time for high-throughput packet buffering |
| Access Time | 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time systems |
| Burst Capability | 4-word burst (interleaved or linear); reduces address overhead in sequential transfers |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains isolate noise |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for base station and edge infrastructure |
| Package | 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm; JEDEC standard footprint |
Pinout & Package
71V65703S85BQ8 is packaged in a JEDEC-standard 100-pin TQFP (PKG100), 14 mm × 20 mm body, with exposed thermal pad option per datasheet revision. Pin functions are fully defined for 256K × 36 configuration; unused pins (e.g., A18, NC positions) are no-connects in this variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference; all synchronous inputs referenced to CLK |
| A0–A17 | Address inputs | 18-bit address bus for 256K-depth addressing; no A18 used in 256K×36 mode |
| R/W | Read/Write control | Synchronous signal defining access type; sampled with ADV/LD to initiate load cycle |
| ADV/LD | Advance burst / Load address | Low = load new external address; High = increment internal burst counter |
| BW1–BW4 | Byte write enables | Active-low per-9-bit-byte controls; enables partial writes without masking logic |
| CE1, CE2, CE2 | Chip enables | Three independent enables (CE1/CE2 low, CE2 high) for flexible depth expansion |
| LBO | Burst order select | Static input: Low = linear burst, High = interleaved burst (LBO tied to VDD if unused) |
| ZZ | Sleep mode | Asynchronous high-active input; gates internal clock and reduces power while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus (32 data + 4 parity); flow-through outputs eliminate output register delay |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes-enables back-to-back burst transfers without bus idle time |
| Internally synchronized OE | Removes need for precise OE timing control; outputs remain valid across clock cycles when OE is asserted |
| Single R/W pin | Reduces control line count vs. separate RD/WR signals-simplifies FPGA/CPLD interface logic |
| 4-word burst counter | Generates four sequential addresses from one load event-cuts address bus activity by 75% in streaming applications |
| Individual byte write (BW1–BW4) | Enables granular 9-bit writes without external byte-enable logic-critical for protocol header updates in packet buffers |
| Power-down via ZZ pin | Asynchronous sleep entry with guaranteed data retention-supports dynamic power gating in energy-sensitive systems |
Applications
| Packet Buffering in Switch ASICs | Cell-Based ATM Line Cards |
|---|---|
|
Use Scenario: Storing variable-length Ethernet frames in cut-through switching pipelines where latency must be bounded and throughput maximized. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level frame buffer with deterministic 7.5 ns read access and zero-turnaround burst writes. Use Value: Enables full-line-rate forwarding at 10 Gbps+ by eliminating bus turnaround stalls during header inspection and rewrite operations. |
Use Scenario: Holding fixed-size 53-byte ATM cells in OC-48/192 line interface modules requiring seamless cell reordering and rate adaptation. IC Role / Device Role / Timing Role: Synchronous ZBT SRAM providing 4-word burst reads/writes aligned to cell boundaries with precise clock-domain crossing. Use Value: Supports 622 Mbps–2.5 Gbps cell processing with no inter-cell gaps, reducing jitter and improving QoS compliance. |
| Telecom Backplane Interface Buffers | High-Speed Test Equipment Memory |
|
Use Scenario: Interfacing between SERDES PHYs and packet processors across multi-gigabit backplanes in modular routers. IC Role / Device Role / Timing Role: Flow-through-output SRAM absorbing timing skew between clock domains while maintaining burst coherency. Use Value: Delivers stable 100 MHz operation across –40°C to +85°C, enabling reliable buffer operation in fanless chassis environments. |
Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) where deep memory and sub-10 ns access are required. IC Role / Device Role / Timing Role: Deterministic-access SRAM serving as acquisition memory with programmable burst depth and byte-select granularity. Use Value: Allows precise trigger-aligned capture of 4-word bursts without pipeline bubbles-improving test vector density and repeatability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100AXC | 100 MHz, 256K × 36, but uses QDR-II architecture with separate read/write ports and differential clocks | Requires differential clock routing and dual-port controller logic; not drop-in compatible | Select only when true simultaneous read/write bandwidth is needed-71V65703S85BQ8 is superior for simpler ZBT-style burst control. |
| AS7C3256B-10JIN | 10 ns access, 256K × 36, but asynchronous SRAM with no burst counter or ZBT functionality | Lacks ADV/LD, BWx, and burst modes-requires full address generation per word and higher CPU overhead | Choose only for legacy designs lacking clock-synchronized control; 71V65703S85BQ8 delivers 3× lower effective latency in burst scenarios. |
Compared with CY7C1362BV33-100AXC and AS7C3256B-10JIN, the 71V65703S85BQ8 uniquely balances deterministic 7.5 ns access, zero-turnaround burst efficiency, and simple single-clock synchronous control-making it optimal for cost-sensitive, high-throughput telecom buffers where QDR complexity or async overhead is prohibitive.
Availability
71V65703S85BQ8 is available at Aetrix Electronics and suitable for packet buffering, telecom line cards, backplane interface buffers, and high-speed test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V65703S85BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor leader specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V65703S85BQ8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-bandwidth buffering in networking ASICs, telecom line cards, and test instrumentation where deterministic timing and burst efficiency are critical.
FAQ
What is the memory organization and total capacity of the 71V65703S85BQ8?
The 71V65703S85BQ8 is organized as 256K × 36, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. It is pin-compatible with the 512K × 18 variant (71V65903), but the 71V65703S85BQ8 specifically implements the 256K × 36 configuration with A0–A17 address lines active and A18 unused.
Does the 71V65703S85BQ8 support burst read and write operations-and how is burst order controlled?
Yes, the 71V65703S85BQ8 supports 4-word burst operations in both read and write modes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear burst (A0, A1, A2, A3), while LBO = HIGH enables interleaved burst (A0, A2, A1, A3). This is configured statically and must remain stable during operation.
What is the role of the ADV/LD pin in the 71V65703S85BQ8, and how does it interact with burst mode?
The ADV/LD pin determines whether the 71V65703S85BQ8 loads a new external address (ADV/LD = LOW) or advances the internal burst counter (ADV/LD = HIGH). During burst sequences, ADV/LD remains HIGH to auto-increment the address, eliminating the need for external address updates-reducing control overhead in streaming applications.
How does the 71V65703S85BQ8 implement zero bus turnaround (ZBT™), and what design benefit does it provide?
The 71V65703S85BQ8 achieves ZBT™ by allowing immediate bus direction reversal between successive read and write cycles-no dead cycles are inserted. This is enabled by its synchronous control architecture and flow-through outputs. The result is sustained 100 MHz throughput in mixed-access patterns typical of packet buffering and protocol processing.
Can the 71V65703S85BQ8 operate in low-power mode-and how is it activated?
Yes, the 71V65703S85BQ8 supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and core power drops significantly while data retention is guaranteed. This feature enables dynamic power management in systems with intermittent traffic bursts.
71V65703S85BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S85BQ8 FAQ
1.How can I place an order for 71V65703S85BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S85BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that 71V65703S85BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S85BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BQ8 meets industry standards.
7.What is the process for return or replacement of 71V65703S85BQ8?
All 71V65703S85BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85BQ8 part is unused and in its original packaging.
Return procedure for 71V65703S85BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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