Renesas 71V65703S85BQG8
- Part No.:
- 71V65703S85BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S85BQG8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,799
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V65703S85BQG8 from IDT (now Renesas) is a 9,437,184-bit (9 Mbit) 3.3V synchronous ZBT™ SRAM organized as 256K × 36, delivering zero bus turnaround for high-speed memory subsystems in network switches and telecom line cards. It supports 100 MHz operation with 7.5 ns clock-to-data access, burst read/write capability, and flow-through outputs - enabling seamless back-to-back memory transactions without dead cycles.
For engineers reviewing the 71V65703S85BQG8 datasheet, 71V65703S85BQG8 pinout, 71V65703S85BQG8 application, or 71V65703S85BQG8 equivalent, this page provides verified timing parameters, TQFP-100 pin mapping, ZBT burst control logic, industrial temperature support (–40°C to +85°C), and direct alternatives for memory interface redesigns requiring low-latency, high-bandwidth SRAM.
Technical Context
The 71V65703S85BQG8 implements a synchronous, clocked architecture with registered address/control inputs and flow-through data outputs - eliminating output registers to minimize read latency. Its on-chip burst counter supports both linear and interleaved 4-word bursts, controlled by the static LBO pin and advanced via ADV/LD transitions.
ZBT™ operation is enforced through synchronized chip enable (CE1/CE2/CE2) and R/W control, enabling immediate bus direction reversal between reads and writes. Internally synchronized OE eliminates external timing constraints, while CEN suspends all synchronous activity without disrupting data integrity or output states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9,437,184 bits), fixed configuration for this variant |
| Max Clock Frequency | 100 MHz - enables 10 ns cycle time for sustained burst throughput |
| Clock-to-Data Access | 7.5 ns - deterministic read latency from CLK edge to valid Q output |
| Burst Capability | 4-word (interleaved or linear) - reduces address bus overhead and improves bandwidth efficiency |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - dual-rail compatibility with 3.3V logic systems |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded networking hardware |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly |
Pinout & Package
71V65703S85BQG8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, lead pitch 0.5 mm. Pinout validated per IDT document 5298 drw 02 (256K × 36 PKG100 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates one-cycle deselect |
| R/W | Read/Write Control | Synchronous signal defining transaction type; determines data direction one cycle after address load |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH advances internal burst counter - critical for burst sequencing |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst pattern; LOW = linear, HIGH = interleaved - sets memory access stride behavior |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous operations referenced to this edge |
| OE | Output Enable | Asynchronous, active-low; tri-states outputs immediately - no timing coordination required with CLK |
| ZZ | Sleep Mode Input | Asynchronous, active-high; gates internal CLK and reduces power to retention level while preserving data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional flow-through data path; inputs registered, outputs unregistered for minimal read delay |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enables continuous 100 MHz bus utilization in packet buffering |
| Internally Synchronized OE | Removes need for precise OE timing control - simplifies PCB layout and reduces timing closure effort |
| Single R/W Pin Control | Reduces control bus width vs. separate RD/WR signals - saves FPGA/GPIO resources and routing layers |
| Individual Byte Write (BW1–BW4) | Enables partial-word updates without read-modify-write - critical for protocol header manipulation in networking ASICs |
| Three Chip Enables (CE1/CE2/CE2) | Supports depth expansion across multiple devices with flexible enable polarity - simplifies multi-SRAM bank decoding |
| Flow-Through Output Architecture | Delivers data one clock cycle after access with no output register delay - achieves lowest possible read latency |
Applications
| High-Speed Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to switch fabric controller; handles burst reads/writes at line rate. Use Value: 7.5 ns clock-to-data access and ZBT™ operation ensure sub-10 ns effective read latency, meeting 10 Gbps+ switching timing margins. |
Use Scenario: Frame storage and reassembly in SONET/SDH optical transport equipment. IC Role / Device Role / Timing Role: Dual-port accessible memory bank supporting simultaneous ingress/egress DMA channels. Use Value: 4-word burst mode reduces address setup overhead by 75%, increasing effective bandwidth to >3.2 GB/s at 100 MHz. |
| Network Processor Co-Processor Memory | Industrial Real-Time Control Buffer |
|
Use Scenario: Offloading packet classification and lookup table storage from main NPU core. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory mapped into NPU's local address space. Use Value: Individual byte write (BW1–BW4) allows atomic updates of 9-bit metadata fields without corrupting adjacent bytes. |
Use Scenario: Deterministic data logging and motion control trajectory buffering in PLCs and CNC controllers. IC Role / Device Role / Timing Role: Low-jitter, predictable-access memory for time-critical servo loop buffers. Use Value: –40°C to +85°C industrial temp range and ZZ sleep mode guarantee reliable operation under thermal stress and power cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100BGXI | 256K × 36, 100 MHz, 3.3V, but uses pipelined (not flow-through) outputs - adds 1-cycle read latency | Less suitable for zero-latency read-after-write scenarios; requires OE timing management | Prefer when system design accommodates pipelined output staging and prioritizes Cypress ecosystem support |
| AS7C3256A-10JIN | 256K × 36, 10 ns access (vs. 7.5 ns), no ZBT™ or burst counter - basic synchronous SRAM | Lacks burst addressing and zero-turnaround capability; requires external burst logic | Select when cost sensitivity outweighs performance needs and simpler timing model is preferred |
Compared with CY7C1362BV33-100BGXI and AS7C3256A-10JIN, the 71V65703S85BQG8 delivers lower read latency, integrated burst control, and true ZBT™ operation - making it optimal for latency-constrained, high-throughput memory interfaces where bus turnaround efficiency is critical.
Availability
71V65703S85BQG8 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, network processor co-processor memory, and industrial real-time control buffer applications requiring stable component supply and long-term industrial temperature support.
Supply support for 71V65703S85BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V65703S85BQG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-bandwidth memory subsystems in networking, telecom, and real-time embedded systems demanding deterministic timing and zero bus turnaround.
FAQ
What is the memory organization of the 71V65703S85BQG8?
The 71V65703S85BQG8 is organized as 256K × 36, providing 9,437,184 bits (9 Mbit) of synchronous SRAM. This configuration is fixed for the 71V65703S85BQG8 variant and differs from the 512K × 18 option found in the 71V65903 family members. The 36-bit data bus supports parallel access to full words without external multiplexing.
Does the 71V65703S85BQG8 support burst read and write operations?
Yes, the 71V65703S85BQG8 supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin and advanced via the ADV/LD signal. Burst mode is initiated after loading an initial address and then incrementing the internal counter - reducing address bus traffic and improving effective bandwidth over single-word transfers.
What is the function of the ZZ pin on the 71V65703S85BQG8?
The ZZ pin on the 71V65703S85BQG8 is an asynchronous sleep mode input. When driven HIGH, it internally gates the clock and places the device in its lowest power consumption state while guaranteeing data retention. This feature enables dynamic power management in systems requiring rapid wake-up with preserved memory contents.
How does the ZBTTM feature improve system performance in the 71V65703S85BQG8?
ZBTTM (Zero Bus Turnaround) in the 71V65703S85BQG8 eliminates idle cycles when switching between read and write operations. By synchronizing bus direction control entirely within the device's internal logic, it enables immediate back-to-back transactions - increasing usable memory bandwidth and reducing average access latency in high-throughput packet processing paths.
Is the 71V65703S85BQG8 compatible with industrial temperature requirements?
Yes, the 71V65703S85BQG8 is rated for industrial temperature operation from –40°C to +85°C. This qualification ensures reliable functionality in harsh environments such as base station equipment, factory automation controllers, and outdoor telecom infrastructure where ambient thermal stress is significant.
71V65703S85BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S85BQG8 FAQ
1.How can I place an order for 71V65703S85BQG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S85BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S85BQG8 reliable?
The price and inventory of 71V65703S85BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85BQG8 is usually 5 days.
3.What payment methods are accepted for 71V65703S85BQG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S85BQG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65703S85BQG8?
71V65703S85BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S85BQG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S85BQG8?
For technical support, including 71V65703S85BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85BQG8 requirements.
6.How does Aetrix verify that 71V65703S85BQG8 is sourced from the original manufacturer or authorized distributors?
All 71V65703S85BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BQG8 meets industry standards.
7.What is the process for return or replacement of 71V65703S85BQG8?
All 71V65703S85BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85BQG8 part is unused and in its original packaging.
Return procedure for 71V65703S85BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S85BQG8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

