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Renesas 71V65703S85BQG8

Part No.:
71V65703S85BQG8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65703S85BQG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,799

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Product details

Overview

71V65703S85BQG8 from IDT (now Renesas) is a 9,437,184-bit (9 Mbit) 3.3V synchronous ZBT™ SRAM organized as 256K × 36, delivering zero bus turnaround for high-speed memory subsystems in network switches and telecom line cards. It supports 100 MHz operation with 7.5 ns clock-to-data access, burst read/write capability, and flow-through outputs - enabling seamless back-to-back memory transactions without dead cycles.

For engineers reviewing the 71V65703S85BQG8 datasheet, 71V65703S85BQG8 pinout, 71V65703S85BQG8 application, or 71V65703S85BQG8 equivalent, this page provides verified timing parameters, TQFP-100 pin mapping, ZBT burst control logic, industrial temperature support (–40°C to +85°C), and direct alternatives for memory interface redesigns requiring low-latency, high-bandwidth SRAM.

Technical Context

The 71V65703S85BQG8 implements a synchronous, clocked architecture with registered address/control inputs and flow-through data outputs - eliminating output registers to minimize read latency. Its on-chip burst counter supports both linear and interleaved 4-word bursts, controlled by the static LBO pin and advanced via ADV/LD transitions.

ZBT™ operation is enforced through synchronized chip enable (CE1/CE2/CE2) and R/W control, enabling immediate bus direction reversal between reads and writes. Internally synchronized OE eliminates external timing constraints, while CEN suspends all synchronous activity without disrupting data integrity or output states.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 (9,437,184 bits), fixed configuration for this variant
Max Clock Frequency 100 MHz - enables 10 ns cycle time for sustained burst throughput
Clock-to-Data Access 7.5 ns - deterministic read latency from CLK edge to valid Q output
Burst Capability 4-word (interleaved or linear) - reduces address bus overhead and improves bandwidth efficiency
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - dual-rail compatibility with 3.3V logic systems
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded networking hardware
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly

Pinout & Package

71V65703S85BQG8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, lead pitch 0.5 mm. Pinout validated per IDT document 5298 drw 02 (256K × 36 PKG100 configuration).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates one-cycle deselect
R/W Read/Write Control Synchronous signal defining transaction type; determines data direction one cycle after address load
ADV/LD Advance Burst / Load Address LOW loads new external address; HIGH advances internal burst counter - critical for burst sequencing
LBO Linear/Interleaved Burst Order Static input selecting burst pattern; LOW = linear, HIGH = interleaved - sets memory access stride behavior
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CLK System Clock Input Rising-edge-triggered master timing reference; all synchronous operations referenced to this edge
OE Output Enable Asynchronous, active-low; tri-states outputs immediately - no timing coordination required with CLK
ZZ Sleep Mode Input Asynchronous, active-high; gates internal CLK and reduces power to retention level while preserving data
I/O0–I/O31, I/OP1–I/OP4 Data I/O Bus 36-bit bidirectional flow-through data path; inputs registered, outputs unregistered for minimal read delay

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates dead cycles between read/write transitions - enables continuous 100 MHz bus utilization in packet buffering
Internally Synchronized OE Removes need for precise OE timing control - simplifies PCB layout and reduces timing closure effort
Single R/W Pin Control Reduces control bus width vs. separate RD/WR signals - saves FPGA/GPIO resources and routing layers
Individual Byte Write (BW1–BW4) Enables partial-word updates without read-modify-write - critical for protocol header manipulation in networking ASICs
Three Chip Enables (CE1/CE2/CE2) Supports depth expansion across multiple devices with flexible enable polarity - simplifies multi-SRAM bank decoding
Flow-Through Output Architecture Delivers data one clock cycle after access with no output register delay - achieves lowest possible read latency

Applications

High-Speed Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to switch fabric controller; handles burst reads/writes at line rate.

Use Value: 7.5 ns clock-to-data access and ZBT™ operation ensure sub-10 ns effective read latency, meeting 10 Gbps+ switching timing margins.

Use Scenario: Frame storage and reassembly in SONET/SDH optical transport equipment.

IC Role / Device Role / Timing Role: Dual-port accessible memory bank supporting simultaneous ingress/egress DMA channels.

Use Value: 4-word burst mode reduces address setup overhead by 75%, increasing effective bandwidth to >3.2 GB/s at 100 MHz.

Network Processor Co-Processor Memory Industrial Real-Time Control Buffer

Use Scenario: Offloading packet classification and lookup table storage from main NPU core.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory mapped into NPU's local address space.

Use Value: Individual byte write (BW1–BW4) allows atomic updates of 9-bit metadata fields without corrupting adjacent bytes.

Use Scenario: Deterministic data logging and motion control trajectory buffering in PLCs and CNC controllers.

IC Role / Device Role / Timing Role: Low-jitter, predictable-access memory for time-critical servo loop buffers.

Use Value: –40°C to +85°C industrial temp range and ZZ sleep mode guarantee reliable operation under thermal stress and power cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-100BGXI 256K × 36, 100 MHz, 3.3V, but uses pipelined (not flow-through) outputs - adds 1-cycle read latency Less suitable for zero-latency read-after-write scenarios; requires OE timing management Prefer when system design accommodates pipelined output staging and prioritizes Cypress ecosystem support
AS7C3256A-10JIN 256K × 36, 10 ns access (vs. 7.5 ns), no ZBT™ or burst counter - basic synchronous SRAM Lacks burst addressing and zero-turnaround capability; requires external burst logic Select when cost sensitivity outweighs performance needs and simpler timing model is preferred

Compared with CY7C1362BV33-100BGXI and AS7C3256A-10JIN, the 71V65703S85BQG8 delivers lower read latency, integrated burst control, and true ZBT™ operation - making it optimal for latency-constrained, high-throughput memory interfaces where bus turnaround efficiency is critical.

Availability

71V65703S85BQG8 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, network processor co-processor memory, and industrial real-time control buffer applications requiring stable component supply and long-term industrial temperature support.

Supply support for 71V65703S85BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The 71V65703S85BQG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-bandwidth memory subsystems in networking, telecom, and real-time embedded systems demanding deterministic timing and zero bus turnaround.

FAQ

What is the memory organization of the 71V65703S85BQG8?

The 71V65703S85BQG8 is organized as 256K × 36, providing 9,437,184 bits (9 Mbit) of synchronous SRAM. This configuration is fixed for the 71V65703S85BQG8 variant and differs from the 512K × 18 option found in the 71V65903 family members. The 36-bit data bus supports parallel access to full words without external multiplexing.

Does the 71V65703S85BQG8 support burst read and write operations?

Yes, the 71V65703S85BQG8 supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin and advanced via the ADV/LD signal. Burst mode is initiated after loading an initial address and then incrementing the internal counter - reducing address bus traffic and improving effective bandwidth over single-word transfers.

What is the function of the ZZ pin on the 71V65703S85BQG8?

The ZZ pin on the 71V65703S85BQG8 is an asynchronous sleep mode input. When driven HIGH, it internally gates the clock and places the device in its lowest power consumption state while guaranteeing data retention. This feature enables dynamic power management in systems requiring rapid wake-up with preserved memory contents.

How does the ZBTTM feature improve system performance in the 71V65703S85BQG8?

ZBTTM (Zero Bus Turnaround) in the 71V65703S85BQG8 eliminates idle cycles when switching between read and write operations. By synchronizing bus direction control entirely within the device's internal logic, it enables immediate back-to-back transactions - increasing usable memory bandwidth and reducing average access latency in high-throughput packet processing paths.

Is the 71V65703S85BQG8 compatible with industrial temperature requirements?

Yes, the 71V65703S85BQG8 is rated for industrial temperature operation from –40°C to +85°C. This qualification ensures reliable functionality in harsh environments such as base station equipment, factory automation controllers, and outdoor telecom infrastructure where ambient thermal stress is significant.

71V65703S85BQG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65703S85BQG8 FAQ

1.How can I place an order for 71V65703S85BQG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S85BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 71V65703S85BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85BQG8 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S85BQG8?

For technical support, including 71V65703S85BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85BQG8 requirements.

6.How does Aetrix verify that 71V65703S85BQG8 is sourced from the original manufacturer or authorized distributors?

All 71V65703S85BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BQG8 meets industry standards.

7.What is the process for return or replacement of 71V65703S85BQG8?

All 71V65703S85BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BQG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S85BQG8 part is unused and in its original packaging.

Return procedure for 71V65703S85BQG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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