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Renesas 71V65703S85BQGI8

Part No.:
71V65703S85BQGI8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65703S85BQGI8.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,074

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Product details

Overview

71V65703S85BQGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 100 MHz clock frequency, 7.5 ns clock-to-data access time, zero bus turnaround (ZBT) architecture, and flow-through outputs. It serves as high-speed buffer/cache memory in network switches, telecom line cards, and packet processing systems requiring burst read/write without dead cycles.

For engineers reviewing the 71V65703S85BQGI8 datasheet, 71V65703S85BQGI8 pinout, 71V65703S85BQGI8 application, or 71V65703S85BQGI8 equivalent, this page delivers verified timing parameters, TQFP-100 pin mapping, industrial-grade temperature support (–40°C to +85°C), burst mode behavior (linear/interleaved), and byte-write control - all critical for DDR-adjacent memory subsystem design and legacy ZBT migration.

Technical Context

The 71V65703S85BQGI8 implements a synchronous, clock-driven interface with registered address/control inputs and flow-through data outputs - eliminating output registers to minimize read latency. Its on-chip 4-word burst counter advances on ADV/LD = HIGH, with sequence order determined by static LBO pin state.

ZBT operation is enabled via three chip enables (CE1, CE2 active-low; CE2 active-high), single R/W control, and internally synchronized OE - removing external OE timing constraints. Power-down is managed asynchronously via ZZ input, guaranteeing data retention during sleep mode while gating internal clock paths.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant - enables flexible data bus width matching in 32-bit or 64-bit systems.
Clock Frequency 100 MHz maximum; defines system timing budget for backplane or switch fabric interfaces requiring deterministic memory access.
Access Time 7.5 ns clock-to-data (tCD); ensures sub-10 ns read latency critical for pipeline-constrained real-time packet buffering.
Burst Capability 4-word interleaved or linear burst; reduces address setup overhead per transfer - improves effective bandwidth by up to 3× vs. single-word mode.
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupled power domains allow independent noise management for logic and data paths.
Operating Temperature –40°C to +85°C industrial grade; qualified for deployment in uncontrolled ambient environments like base station cabinets or industrial controllers.
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly and thermal performance validated for sustained 100 MHz operation.

Pinout & Package

71V65703S85BQGI8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch and exposed thermal pad (per PKG100 footprint). Pin functions are fully synchronized except OE (asynchronous) and ZZ (asynchronous sleep).

Pin/Terminal Circuit Role Design Meaning
CLK Clock Input Rising-edge-triggered master timing reference; all synchronous inputs (address, R/W, ADV/LD, BWx, CEN, CE1/CE2/CE2) sampled relative to CLK edge.
A0–A17 Address Inputs 18-bit address bus for 256K depth; A0–A17 directly map to memory array row/column decoding - no internal multiplexing required.
R/W Read/Write Control Single synchronous signal determining cycle type; data transfer occurs one clock cycle after R/W assertion, enabling precise pipeline alignment.
ADV/LD Advance Burst / Load Address Controls burst counter (HIGH) or loads new external address (LOW); enables seamless transition between sequential burst and random access modes.
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte lanes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4); allows partial-word writes without read-modify-write overhead.
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 low-active, CE2 high-active) support depth expansion and hierarchical memory banking without external logic.
OE Output Enable Asynchronous, active-low control of I/O drivers; can be tied LOW permanently since outputs tri-state automatically during deselect or write cycles.
ZZ Sleep Mode Input Asynchronous high-active signal that gates internal clock and reduces ICC to standby level (<100 µA typical) while retaining memory contents.
I/O0–I/O31, I/OP1–I/OP4 Data I/O Bus 36-bit bidirectional flow-through data path; input register captures data on CLK edge; output path has no register - minimizing read latency to 7.5 ns.

Key Features

Feature Design Value
Zero Bus Turnaround (ZBT) Eliminates dead cycles between read/write transitions - enables back-to-back memory operations essential for high-throughput packet buffering in Layer 2/3 switches.
Internally Synchronized OE Removes need for external OE timing control; outputs auto-tri-state during write or deselect - simplifies PCB layout and reduces timing closure effort.
4-Word Burst Counter Reduces address bus toggling by 75% per burst; supports both linear and interleaved sequences (via LBO pin) to match processor or DMA controller addressing patterns.
Individual Byte Write (BW1–BW4) Enables granular 9-bit writes without full-word masking - critical for protocol header updates or status flag manipulation in real-time networking stacks.
Three Chip Enables Supports depth expansion across multiple devices using simple NAND logic; CE2's inverted polarity allows direct connection to FPGA I/O banks with fixed drive strength.
Flow-Through Outputs Delivers data one clock cycle after address/control setup - achieves lowest possible read latency among synchronous SRAMs at 100 MHz operation.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switches before classification or forwarding decisions.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with MAC or switch fabric ASICs via parallel 36-bit bus.

Use Value: 7.5 ns tCD and ZBT architecture enable sustained 100 MHz throughput with zero inter-cycle gaps - maximizing switch fabric utilization under bursty traffic loads.

Use Scenario: Acting as shared memory between DSPs and FPGA-based framer/mapper units in SONET/SDH line cards handling OC-48 or OC-192 data streams.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access for time-critical frame assembly/disassembly and overhead byte insertion.

Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V I/O compatibility ensure reliable operation in sealed, fanless telecom chassis with wide ambient swings.

Industrial PLC Data Cache Legacy System Memory Upgrade

Use Scenario: Caching sensor fusion results and motion control command buffers in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Deterministic-access memory supporting real-time cyclic executive tasks with jitter <10 ns - meeting IEC 61131-3 soft-PLC timing requirements.

Use Value: Byte-write capability (BW1–BW4) allows atomic updates of individual process variables without corrupting adjacent data - enhancing functional safety integrity.

Use Scenario: Drop-in replacement for aging ZBT SRAMs (e.g., IDT71V65703S80BG) in avionics or medical imaging systems requiring extended component availability.

IC Role / Device Role / Timing Role: Pin- and function-compatible upgrade delivering identical 256K×36 organization, TQFP-100 package, and ZBT timing behavior.

Use Value: Same AC/DC electrical specs and industrial temperature range ensure zero firmware or hardware revision - reducing qualification cost and time-to-market.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
71V65703S85BQGI Same die, identical AC/DC specs, but commercial temperature range (0°C to +70°C); no industrial qualification. Not suitable for deployments outside controlled environments (e.g., outdoor base stations, factory floors). Select only if operating ambient stays within 0–70°C and lifecycle sourcing prioritizes lower unit cost over long-term reliability margin.
71V65903S85BQGI8 Pin-compatible variant with 512K × 18 organization; same timing, voltage, package, and feature set - differs only in memory depth/width mapping. Used when system requires wider address space over narrower data bus (e.g., 18-bit microcontroller interfaces or legacy 16-bit bus extensions). Choose based on system bus width and memory depth requirements - no redesign needed beyond address decode logic adjustment.

Compared with 71V65703S85BQGI (commercial grade), the 71V65703S85BQGI8 adds guaranteed industrial temperature operation without sacrificing speed or features; versus 71V65903S85BQGI8, it provides higher data width (36-bit vs. 18-bit) at identical clock rate - optimizing bandwidth for parallel bus architectures.

Availability

71V65703S85BQGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data caching requiring stable component supply across extended production lifecycles.

Supply support for 71V65703S85BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V65703S85BQGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in high-speed networking and telecom infrastructure where deterministic burst access and minimal bus turnaround are mandatory.

FAQ

What is the memory organization and total capacity of the 71V65703S85BQGI8?

The 71V65703S85BQGI8 is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.4 Mbit). This configuration supports 36-bit parallel data transfers and is optimized for systems requiring high-bandwidth buffering with minimal address overhead - such as network switch fabric interfaces and packet processors. The device also shares pinout and timing compatibility with the 512K × 18 variant (71V65903S85BQGI8) for flexible design reuse.

Does the 71V65703S85BQGI8 support burst read and write operations, and how is burst order controlled?

Yes, the 71V65703S85BQGI8 supports 4-word burst operations in both read and write modes. Burst sequence order - either linear or interleaved - is selected by the static LBO (Linear/Interleaved Burst Order) input pin: LBO = LOW selects linear order, while LBO = HIGH selects interleaved order. The burst counter advances on each rising CLK edge when ADV/LD = HIGH, and the initial address is loaded when ADV/LD = LOW - enabling seamless integration with burst-capable processors or DMA engines.

How does the Zero Bus Turnaround (ZBT) feature work in the 71V65703S85BQGI8, and what benefit does it provide?

The ZBT feature in the 71V65703S85BQGI8 eliminates idle bus cycles between consecutive read and write operations - allowing immediate transition from one memory access to the next without wait states. This is achieved through internal arbitration and output driver control logic that manages bus direction and timing autonomously. The result is sustained 100 MHz throughput with no dead cycles, significantly improving effective bandwidth in high-speed packet buffering and real-time signal processing applications.

What are the power supply requirements and thermal specifications for the 71V65703S85BQGI8?

The 71V65703S85BQGI8 requires two separate 3.3 V supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. It operates across the industrial temperature range of –40°C to +85°C, with data retention guaranteed in sleep mode (ZZ = HIGH). Power dissipation is rated at ≤2.0 W maximum, and thermal design must accommodate the 100-pin TQFP package's thermal characteristics under sustained 100 MHz operation.

Can the 71V65703S85BQGI8 be used with a 100 MHz system clock, and what is its actual clock-to-data access time?

Yes, the 71V65703S85BQGI8 is fully rated for 100 MHz operation, with a guaranteed clock-to-data access time (tCD) of 7.5 ns. This parameter is measured from the rising edge of CLK to valid data appearing on the I/O bus during a read cycle - confirming deterministic sub-10 ns latency critical for tight-timing applications like telecom framer buffers and real-time control loops.

71V65703S85BQGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65703S85BQGI8 FAQ

1.How can I place an order for 71V65703S85BQGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65703S85BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65703S85BQGI8 reliable?

The price and inventory of 71V65703S85BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85BQGI8 is usually 5 days.

3.What payment methods are accepted for 71V65703S85BQGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S85BQGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65703S85BQGI8?

71V65703S85BQGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65703S85BQGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65703S85BQGI8?

For technical support, including 71V65703S85BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85BQGI8 requirements.

6.How does Aetrix verify that 71V65703S85BQGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65703S85BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BQGI8 meets industry standards.

7.What is the process for return or replacement of 71V65703S85BQGI8?

All 71V65703S85BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BQGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65703S85BQGI8 part is unused and in its original packaging.

Return procedure for 71V65703S85BQGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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