Renesas 71V65703S85BQI
- Part No.:
- 71V65703S85BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65703S85BQI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S85BQI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), delivering 100 MHz operation with 7.5 ns clock-to-data access. It implements Zero Bus Turnaround for dead-cycle-free read/write transitions, supports 4-word interleaved or linear burst, and features flow-through outputs with asynchronous OE control. It is used in high-speed packet buffering and cache applications in networking ASICs and FPGA-based data path systems.
For engineers reviewing the 71V65703S85BQI datasheet, 71V65703S85BQI pinout, 71V65703S85BQI application, or 71V65703S85BQI equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O compatibility, industrial temperature support (–40°C to +85°C), TQFP-100 packaging, and byte-write granularity across four 9-bit data groups.
Technical Context
The 71V65703S85BQI uses a synchronous CMOS architecture with registered address/control inputs and flow-through data outputs - no output register - enabling deterministic 1-cycle latency from clock edge to valid Q. Its internal burst counter advances on ADV/LD = HIGH, with burst order selected by static LBO pin (LOW = linear, HIGH = interleaved).
It integrates three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, supports power-down via asynchronous ZZ input, and employs separate VDD (core) and VDDQ (I/O) supplies. Clock Enable (CEN) suspends all synchronous operations while preserving register state, and individual BW1–BW4 pins enable per-byte write control without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9.4 Mbit); fixed configuration for this variant - not reconfigurable to 512K × 18 |
| Clock Frequency | 100 MHz maximum - enables 10 ns cycle time for sustained burst transfers |
| Access Time | 7.5 ns clock-to-data (tCD) - defines minimum latency from CLK rising edge to valid output |
| Burst Capability | 4-word burst (interleaved or linear) - reduces address bus traffic by 75% per burst sequence |
| Operating Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - requires dual-rail 3.3V supply with independent decoupling |
| Temperature Range | –40°C to +85°C (industrial grade) - validated for extended thermal operation in telecom infrastructure |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount, leaded, RoHS-compliant |
Pinout & Package
71V65703S85BQI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, with exposed pad not electrically connected. Pin functions are synchronized to CLK except OE (asynchronous) and LBO/ZZ (static/asynchronous). All address, control, and data inputs meet setup/hold timing relative to CLK rising edge.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus - selects one of 256K locations; A18 unused in 256K×36 mode |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high - enables flexible depth expansion with no external logic |
| R/W | Read/Write Control | Synchronous signal sampled at CLK edge - determines cycle type (read or write) for current address load |
| ADV/LD | Burst Counter Control | LOW loads new external address; HIGH increments internal burst counter - defines burst vs. random access behavior |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte groups (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| OE | Output Enable | Asynchronous, active-low - tri-states outputs independently of clock; may be tied LOW for continuous read |
| LBO | Burst Order Select | Static input - LOW selects linear burst (0,1,2,3); HIGH selects interleaved (0,2,1,3) - must remain stable during burst |
| ZZ | Sleep Mode Input | Asynchronous, active-high - gates internal CLK and reduces ICC to ≤5 µA while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus - registered input path, flow-through output path; no output register required |
| CLK | System Clock | Single-ended input - all synchronous timing referenced to rising edge; CEN disables propagation |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between consecutive reads/writes - enables back-to-back memory transactions at full speed |
| Internally Synchronized OE | Removes need for external OE timing control - OE assertion/release is fully asynchronous and does not affect internal timing margins |
| Single R/W Pin | Reduces control bus complexity versus separate RD/WR signals - simplifies FPGA/ASIC interface logic and PCB routing |
| Individual Byte Write | Enables partial-word updates without read-modify-write - BW1–BW4 allow selective 9-bit writes to match typical bus widths |
| Three Chip Enables | Supports seamless depth expansion (e.g., 2× 256K×36 → 512K×36) using only CE logic - no address decoding required |
Applications
| High-Speed Packet Buffering | FPGA-Based Data Path Caching |
|---|---|
|
Use Scenario: Line-rate buffering of Ethernet frames in Layer 2/3 switches where ingress/egress ports operate at 1 Gbps+. IC Role / Device Role / Timing Role: Primary temporary storage for variable-length packets; acts as first-level buffer between MAC and switching fabric with zero-turnaround burst reads/writes. Use Value: 7.5 ns tCD and 100 MHz clock support real-time frame queuing without pipeline stalls; ZBT eliminates inter-packet dead cycles critical for jitter-sensitive traffic. |
Use Scenario: On-board cache for FPGA-accelerated compute engines processing streaming sensor or video data. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory co-located with FPGA fabric; provides low-latency, burst-capable access to intermediate computation results. Use Value: 4-word burst mode reduces address bus overhead by 75%; flow-through outputs align with FPGA register-to-register timing paths without added latency. |
| Telecom Baseband Processing | Industrial Real-Time Control Buffers |
|
Use Scenario: Inter-stage buffering in wireless baseband processors handling LTE/5G modulation/demodulation pipelines. IC Role / Device Role / Timing Role: Synchronous FIFO replacement for channel estimation, FFT, and equalization blocks requiring deterministic read/write turnaround. Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in outdoor base stations; separate VDD/VDDQ allows optimized power domain partitioning. |
Use Scenario: Deterministic I/O buffering in PLCs and motion controllers managing servo feedback loops with sub-millisecond deadlines. IC Role / Device Role / Timing Role: Time-critical data staging between real-time CPU and fieldbus interfaces (e.g., EtherCAT, PROFINET) requiring guaranteed access timing. Use Value: Asynchronous ZZ sleep mode enables rapid power gating during idle intervals without data loss; CEN allows precise clock gating during non-critical phases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-100AXC | Same 256K×36 organization, 100 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks - no ZBT or burst counter | Requires dual-clock routing and more complex controller logic; better suited for true simultaneous read/write workloads | Select when true concurrent access is required; avoid if ZBT timing or single-clock simplicity is mandatory |
| AS7C3256B-10JIN | 256K×36 async SRAM with 10 ns access; no clock, no burst, no ZBT - purely asynchronous interface | Lacks deterministic timing and burst efficiency; suitable only for legacy designs without clock-domain synchronization needs | Choose only for drop-in replacement in non-synchronous systems; not viable for 71V65703S85BQI's clocked, burst-oriented use cases |
Compared with CY7C1371BV33-100AXC and AS7C3256B-10JIN, the 71V65703S85BQI uniquely delivers zero-turnaround burst operation on a single clock domain - enabling simpler controller design and higher effective bandwidth in sequential-access scenarios common in packet and stream processing.
Availability
71V65703S85BQI is available at Aetrix Electronics and suitable for high-speed packet buffering, FPGA-based data path caching, telecom baseband processing, and industrial real-time control applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.
Supply support for 71V65703S85BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and high-performance mixed-signal ICs for communications, computing, and industrial markets.
The 71V65703S85BQI belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed, low-latency, burst-oriented memory applications in networking, telecom, and real-time embedded systems where deterministic timing and bus efficiency are critical.
FAQ
What memory organization does the 71V65703S85BQI support?
The 71V65703S85BQI is fixed at 256K × 36 (9,437,184 bits) and does not support reconfiguration to 512K × 18. This organization is hardwired in silicon and verified in the functional block diagram and pin configuration diagrams for PKG100. The 71V65703S85BQI uses A0–A17 for addressing and leaves A18 unconnected in this variant.
Does the 71V65703S85BQI support both linear and interleaved burst modes?
Yes, the 71V65703S85BQI supports both burst orders via the LBO pin: LOW selects linear (0,1,2,3), HIGH selects interleaved (0,2,1,3). This is confirmed in the Linear/Interleaved Burst Sequence Tables and Pin Definitions, where LBO is explicitly defined as a static input that must remain stable during burst operation.
What is the role of the ZZ pin on the 71V65703S85BQI?
The ZZ pin on the 71V65703S85BQI is an asynchronous active-high sleep mode input. When asserted, it internally gates the clock and reduces ICC to ≤5 µA while guaranteeing data retention - confirmed in Absolute Maximum Ratings, Pin Definitions, and DC Electrical Characteristics tables. It requires no clock alignment or sequencing.
Can the 71V65703S85BQI operate with only one power supply?
No - the 71V65703S85BQI requires two independent 3.3 V ±5% supplies: VDD for core logic and VDDQ for I/O drivers. This separation is specified in Recommended DC Operating Conditions and Functional Block Diagrams, and mixing or tying them together violates the absolute maximum ratings and risks timing violations or excessive noise coupling.
How many chip enable signals does the 71V65703S85BQI have, and what are their polarities?
The 71V65703S85BQI has three chip enable signals: CE1 and CE2 are active-low, while CE2 is active-high. This configuration is documented in Pin Description Summary, Pin Definitions, and Synchronous Truth Table - enabling flexible depth expansion without external inverters when combining multiple devices.
71V65703S85BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65703S85BQI FAQ
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6.How does Aetrix verify that 71V65703S85BQI is sourced from the original manufacturer or authorized distributors?
All 71V65703S85BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85BQI meets industry standards.
7.What is the process for return or replacement of 71V65703S85BQI?
All 71V65703S85BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85BQI part is unused and in its original packaging.
Return procedure for 71V65703S85BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S85BQI Tags

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M24C02-WMN6TP
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