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Renesas 71V65703S85PFG
- Part No.:
- 71V65703S85PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65703S85PFG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,511
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Product details
Overview
71V65703S85PFG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K × 36 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA-based data-path acceleration where deterministic latency and burst efficiency are critical.
For engineers reviewing the 71V65703S85PFG datasheet, 71V65703S85PFG pinout, 71V65703S85PFG application, or 71V65703S85PFG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and 3.3V I/O supply (VDDQ) decoupling requirements.
Technical Context
The 71V65703S85PFG implements a synchronous, clock-driven architecture with registered address/control inputs and unregistered (flow-through) data outputs. Its on-chip 4-word burst counter supports both linear and interleaved sequences via the LBO pin, and internal synchronization of OE eliminates external timing control.
ZBT™ operation is enforced by strict sequencing: ADV/LD low loads an external address; ADV/LD high advances the burst counter; R/W determines cycle type at load time; and CE1/CE2/CE2 enable depth expansion with one-cycle deselect. CEN suspends all synchronous logic while preserving register state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9.4 Mbit); fixed configuration for this part number |
| Max Clock Frequency | 100 MHz - enables 10 ns cycle time in high-throughput buffering applications |
| Clock-to-Data Access | 7.5 ns - defines minimum latency from CLK edge to valid Q output |
| Burst Capability | 4-word burst (linear or interleaved) - reduces address bus traffic by 75% per burst sequence |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires separate decoupling networks |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly |
Pinout & Package
71V65703S85PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm lead pitch. Pin 1 is marked by a dot or beveled corner; pins are numbered counter-clockwise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) for depth expansion without external logic |
| R/W | Read/Write Control | Single synchronous signal defining cycle type at address load; no separate RD/WR pins required |
| ADV/LD | Address Load / Burst Advance | LOW loads new external address; HIGH increments internal burst counter - core to ZBT™ timing |
| LBO | Burst Order Select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence |
| BW1–BW4 | Byte Write Enables | Four active-low signals enabling independent 9-bit byte writes; all may be tied LOW for full-word writes |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus with flow-through outputs - no output register; OE controls tri-state |
| CLK | System Clock | Primary timing reference; all synchronous inputs sampled on rising edge |
| OE | Output Enable | Asynchronous; drives I/Os to high-Z when HIGH - may be permanently tied LOW in most designs |
| ZZ | Sleep Mode | Asynchronous high-active input gating internal clock to reduce power; retains data during sleep |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead cycles between read/write transitions - enables back-to-back memory accesses without bus turnaround overhead |
| Internally Synchronized OE | Removes need for precise OE timing control relative to CLK - simplifies PCB layout and timing closure |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; LBO pin selects linear or interleaved addressing for cache-line alignment |
| Individual Byte Write (BW1–BW4) | Enables selective 9-bit updates without read-modify-write - critical for protocol header manipulation in networking |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using only one set of control signals |
Applications
| Packet Buffering in Switch ASICs | Real-Time Signal Processing FIFO |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before classification and forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer with deterministic 7.5 ns access and zero-turnaround burst reads/writes. Use Value: Enables line-rate 10Gbps packet processing by sustaining 100 MHz sustained throughput with no bus idle cycles. | Use Scenario: Holding intermediate samples between DSP pipeline stages in radar or medical imaging systems. IC Role / Device Role / Timing Role: Synchronous FIFO with flow-through outputs and programmable burst order for aligned data streaming. Use Value: Eliminates pipeline stalls during multi-sample transfers; LBO selection matches FFT or filter coefficient addressing patterns. |
| FPGA Co-Processor Memory | Industrial PLC Data Logging Buffer |
Use Scenario: Offloading memory-intensive tasks from FPGA fabric to dedicated SRAM in motor control or vision systems. IC Role / Device Role / Timing Role: Externally accessible scratchpad with single R/W pin and burst capability for efficient DMA transfers. Use Value: Reduces FPGA pin count and logic utilization; 4-word bursts cut AXI transaction count by 75% versus discrete word access. | Use Scenario: Capturing sensor telemetry at 1 kHz in harsh factory environments with extended temperature range. IC Role / Device Role / Timing Role: Industrial-grade buffer with –40°C to +85°C operation and ZZ sleep mode for power-constrained edge nodes. Use Value: Guarantees data retention during brownouts via sleep mode; TQFP package withstands thermal cycling in DIN-rail enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18 organization; different burst addressing and no ZBT™-guaranteed zero turnaround | Optimized for x18 bus width; lacks native 256K × 36 mapping and identical timing behavior | Select only if system uses 18-bit data path and can accommodate non-ZBT™ timing margins |
| AS7C3256B | Asynchronous interface; no clock, no burst counter, no ADV/LD or LBO pins | Requires external address sequencing logic; unsuitable for deterministic high-speed burst protocols | Consider only for legacy designs where clockless operation and lower speed (<33 MHz) are acceptable |
Compared with CY7C1373KV18 and AS7C3256B, the 71V65703S85PFG uniquely delivers guaranteed zero bus turnaround, 256K × 36 organization, and industrial-temperature TQFP packaging - making it irreplaceable in ZBT™-compliant network and real-time control systems requiring precise burst timing.
Availability
71V65703S85PFG is available at Aetrix Electronics and suitable for packet buffering, real-time signal processing, and FPGA co-processor memory applications requiring stable component supply, long-term industrial lifecycle support, and verified ZBT™ timing compliance.
Supply support for 71V65703S85PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory, and interface solutions for high-performance computing and communications infrastructure.
The 71V65703S85PFG belongs to IDT's ZBT™ SRAM product line, designed specifically for applications demanding deterministic low-latency memory access, burst efficiency, and seamless integration into synchronous digital systems such as network processors and telecom baseband units.
FAQ
What is the memory organization of the 71V65703S85PFG?
The 71V65703S85PFG is organized as 256K × 36 bits (9,437,184 total bits). This fixed configuration differs from the pin-compatible 71V65903, which is 512K × 18. The 71V65703S85PFG does not support reconfiguration - its address space and data width are hardwired per the 256K × 36 topology defined in the functional block diagram and pinout.
Does the 71V65703S85PFG support true zero bus turnaround (ZBT™)?
Yes, the 71V65703S85PFG implements ZBTTM architecture as defined by Renesas. It guarantees no dead cycles between consecutive read and write operations when properly sequenced using ADV/LD and R/W - a feature validated in the synchronous truth table and timing diagrams. This is distinct from generic burst SRAMs lacking ZBT™ certification.
What package type and footprint does the 71V65703S85PFG use?
The 71V65703S85PFG uses a 100-pin plastic thin quad flatpack (TQFP) per JEDEC MO-140, with 14 mm × 20 mm body size and 0.5 mm lead pitch. The "S85PFG" suffix explicitly denotes this TQFP package variant - confirmed by pin configuration drawings PKG100 and mechanical data in the datasheet.
Can the 71V65703S85PFG operate over the industrial temperature range?
Yes, the 71V65703S85PFG is rated for –40°C to +85°C operation, as specified in the Recommended Operating Temperature and Supply Voltage table. This industrial grade is inherent to the part number and verified across AC/DC electrical characteristics - no derating or special ordering code is required.
How is burst order controlled on the 71V65703S85PFG?
Burst order is controlled by the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear sequence (0,1,2,3); LBO = HIGH selects interleaved (0,2,1,3). This static input must remain stable during burst operation and is not sampled synchronously - its state directly configures the internal burst counter's stepping logic.
71V65703S85PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65703S85PFG FAQ
1.How can I place an order for 71V65703S85PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S85PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S85PFG reliable?
The price and inventory of 71V65703S85PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85PFG is usually 5 days.
3.What payment methods are accepted for 71V65703S85PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S85PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65703S85PFG?
71V65703S85PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S85PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S85PFG?
For technical support, including 71V65703S85PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85PFG requirements.
6.How does Aetrix verify that 71V65703S85PFG is sourced from the original manufacturer or authorized distributors?
All 71V65703S85PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85PFG meets industry standards.
7.What is the process for return or replacement of 71V65703S85PFG?
All 71V65703S85PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85PFG part is unused and in its original packaging.
Return procedure for 71V65703S85PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S85PFG Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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