Renesas 71V65703S85PFGI
- Part No.:
- 71V65703S85PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65703S85PFGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65703S85PFGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 256K x 36 (9.44 Mbit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA-based data path acceleration where deterministic latency and burst efficiency are critical.
For engineers reviewing the 71V65703S85PFGI datasheet, 71V65703S85PFGI pinout, 71V65703S85PFGI application, or 71V65703S85PFGI equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 industrial-grade packaging, 3.3V core/I/O supply tolerance, linear/interleaved burst order control via LBO, and support for individual byte write (BW1–BW4) in high-reliability embedded systems.
Technical Context
The 71V65703S85PFGI implements a synchronous, clocked architecture with registered address/control inputs and flow-through data outputs-no output register-enabling immediate data availability one cycle after read initiation. Its on-chip burst counter supports 4-word interleaved or linear sequences controlled by ADV/LD and LBO, eliminating dead cycles during bus turnaround.
Three chip enables (CE1, CE2 active-low; CE2 active-high) allow flexible depth expansion, while CEN suspends all synchronous operation without affecting output state. The device uses separate VDD (3.3V core) and VDDQ (3.3V I/O) supplies, with ZZ enabling asynchronous sleep mode for low-power retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9,437,184 bits); supports 512K × 18 via pin-compatible variant |
| Max Clock Frequency | 100 MHz - enables 10 ns cycle time for high-throughput buffering in packet-switching applications |
| Clock-to-Data Access | 7.5 ns - guarantees deterministic read latency critical for real-time traffic shaping |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus overhead and improves bandwidth efficiency |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - requires dual regulated 3.3V rails with independent noise filtering |
| Operating Temperature | −40°C to +85°C - qualified for industrial networking and base station equipment |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant (PFGI suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Synchronous timing reference; all registered inputs sampled on rising edge |
| A0–A17 | Address inputs | 18-bit address bus for 256K-depth addressing; A18 unused in 256K×36 mode |
| R/W | Read/Write control | Single synchronous signal determining cycle direction; latched with ADV/LD |
| ADV/LD | Advance burst / Load new address | Controls burst counter increment (HIGH) or external address load (LOW) |
| LBO | Linear/Interleaved burst order | Static input selecting burst sequence; LOW = linear, HIGH = interleaved |
| BW1–BW4 | Byte write enables | Four active-low signals enabling independent 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip enable inputs | Three enables for depth expansion: CE1/CE2 active-low, CE2 active-high |
| OE | Output enable | Asynchronous; tri-states outputs when HIGH - can be tied LOW for simplified interface |
| ZZ | Sleep mode | Asynchronous; gates internal clock and reduces power while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus with flow-through outputs; no output register |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive reads/writes - increases effective bus utilization by up to 33% in burst-heavy workloads |
| Internally synchronized OE | Removes need for external OE timing control - simplifies PCB layout and reduces gate count in system logic |
| 4-word burst counter | Reduces address bus toggling and controller overhead - delivers four sequential words per single address setup |
| Individual byte write (BW1–BW4) | Enables precise 9-bit granularity updates without masking logic - essential for protocol header manipulation and partial writes |
| Dual 3.3V supplies (VDD/VDDQ) | Isolates core logic noise from I/O drivers - improves signal integrity in mixed-signal environments |
Applications
| Packet Buffering in Switch ASICs | Real-Time Signal Processing Buffers |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches before classification and forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 7.5 ns read access and zero-turnaround burst writes. Use Value: Enables line-rate packet processing at 10 Gbps+ by eliminating bus dead cycles during header modification and queue management. | Use Scenario: Holding intermediate FFT coefficients and filter taps in radar DSP subsystems requiring rapid coefficient updates and parallel data access. IC Role / Device Role / Timing Role: Synchronous burst-access memory interfacing directly with FPGA fabric for pipelined arithmetic units. Use Value: 4-word burst capability reduces address generation logic and improves throughput by 2.5× versus discrete word accesses. |
| Telecom Line Card Control Memory | FPGA-Based Protocol Acceleration |
Use Scenario: Storing configuration tables, status registers, and channelized TDM buffers in carrier-grade SDH/SONET line cards operating at −40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing reliable, jitter-free memory access synchronized to line clock domains. Use Value: Dual 3.3V supplies (VDD/VDDQ) and robust ESD tolerance ensure stable operation in electrically noisy backplane environments. | Use Scenario: Offloading TCP/IP checksum calculation, VLAN tagging, and deep packet inspection in smart NICs using FPGA-accelerated engines. IC Role / Device Role / Timing Role: Burst-capable SRAM serving as scratchpad memory for FPGA-based state machines performing parallel packet parsing. Use Value: Individual byte write (BW1–BW4) allows atomic update of 8-bit fields (e.g., TTL, checksum bytes) without full-word read-modify-write cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18 organization; same 100 MHz speed, but narrower 18-bit bus and different burst control (no LBO pin) | Optimized for memory-constrained designs needing higher density per bit width; lacks 256K × 36 compatibility | Select when system bus width is fixed at 18 bits and burst sequencing simplicity is prioritized over byte-select flexibility |
| AS7C3256B | Asynchronous SRAM; no clock, no burst, no ZBT™; 32K × 8 organization; 15 ns access | Used in legacy microcontroller interfaces or simple glue logic; incompatible with synchronous timing-critical systems | Choose only for cost-sensitive, non-burst, low-frequency control-plane storage where clock domain isolation is unnecessary |
Compared with CY7C1373KV18 and AS7C3256B, the 71V65703S85PFGI uniquely delivers 256K × 36 density with ZBTTM burst efficiency, individual byte write, and industrial temperature support - making it irreplaceable in high-performance, space-constrained telecom and networking datapaths requiring deterministic timing and flexible bus width.
Availability
71V65703S85PFGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking equipment, and FPGA-based acceleration platforms requiring stable component supply, long-term lifecycle assurance, and industrial-grade reliability.
Supply support for 71V65703S85PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65703S85PFGI belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet processing, switching, and real-time signal buffering applications.
FAQ
What is the memory organization and total capacity of the 71V65703S85PFGI?
The 71V65703S85PFGI is organized as 256K × 36, delivering 9,437,184 bits (9.44 Mbit) of synchronous SRAM. This configuration supports 36-bit wide data paths ideal for high-bandwidth applications like network packet buffering and FPGA co-processing. It shares pinout and timing compatibility with the 512K × 18 variant (71V65903), allowing flexible density scaling within the same footprint.
Does the 71V65703S85PFGI support burst read and write operations, and how is burst order selected?
Yes, the 71V65703S85PFGI supports 4-word synchronous bursts in both read and write modes. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW configures linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). This selection is static and must remain stable during burst execution to avoid undefined behavior in the 71V65703S85PFGI.
How does the ZBTTM (Zero Bus Turnaround) feature function in the 71V65703S85PFGI?
ZBTTM eliminates idle bus cycles when transitioning between read and write operations. In the 71V65703S85PFGI, a write cycle can immediately follow a read (or vice versa) without requiring wait states or bus release/reacquisition. This is achieved through internal synchronization of R/W, ADV/LD, and chip enables - resulting in up to 33% higher effective bus utilization compared to conventional synchronous SRAMs.
What are the power supply requirements for the 71V65703S85PFGI, and is separate core/I/O regulation required?
The 71V65703S85PFGI requires two independent 3.3 V supplies: VDD (core logic, ±5%) and VDDQ (I/O drivers, ±5%). While they share the same nominal voltage, separation is mandatory - VDD powers internal registers and control logic, while VDDQ drives the 36-bit I/O bus. This isolation minimizes switching noise coupling and ensures signal integrity, especially under burst-mode I/O activity in the 71V65703S85PFGI.
Can the 71V65703S85PFGI operate in low-power mode, and how is it enabled?
Yes, the 71V65703S85PFGI supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated, reducing dynamic power consumption significantly while maintaining full data retention across the industrial temperature range (−40°C to +85°C). No clock stopping sequence or register programming is needed - activation is immediate and transparent to ongoing memory state in the 71V65703S85PFGI.
71V65703S85PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65703S85PFGI FAQ
1.How can I place an order for 71V65703S85PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65703S85PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65703S85PFGI reliable?
The price and inventory of 71V65703S85PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65703S85PFGI is usually 5 days.
3.What payment methods are accepted for 71V65703S85PFGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65703S85PFGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65703S85PFGI?
71V65703S85PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65703S85PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65703S85PFGI?
For technical support, including 71V65703S85PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65703S85PFGI requirements.
6.How does Aetrix verify that 71V65703S85PFGI is sourced from the original manufacturer or authorized distributors?
All 71V65703S85PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65703S85PFGI meets industry standards.
7.What is the process for return or replacement of 71V65703S85PFGI?
All 71V65703S85PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65703S85PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65703S85PFGI part is unused and in its original packaging.
Return procedure for 71V65703S85PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65703S85PFGI Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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