Renesas 71V65803S100BG
- Part No.:
- 71V65803S100BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65803S100BG.pdf
- Description:
- IC SRAM 9MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,310
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Product details
Overview
71V65803S100BG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature (–40°C to +85°C). Used in high-speed networking buffers, packet switching ASIC interfaces, and FPGA co-processor memory subsystems.
For engineers reviewing the 71V65803S100BG datasheet, 71V65803S100BG pinout, 71V65803S100BG application, or 71V65803S100BG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, industrial-grade thermal performance, and byte-write enable (BW1–BW4) control for partial-word writes.
Technical Context
The 71V65803S100BG implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising edge of CLK. Its ZBT™ feature eliminates dead cycles between read/write transitions via internal burst counter management and ADV/LD-controlled address loading or incrementing.
It uses a dual-supply design (VDD = 3.3 V ±5% for core logic, VDDQ = 3.3 V ±5% for I/O), supports asynchronous OE and ZZ inputs for output enable and sleep mode, and provides individual byte write enables (BW1–BW4) for selective 9-bit word updates without full 36-bit bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports 512K × 18-bit configuration via pin-strapping |
| Max Clock Frequency | 150 MHz - enables 6.67 ns cycle time for sustained burst transfers in high-throughput systems |
| Clock-to-Data Access | 3.8 ns - guarantees deterministic data valid window two clocks after address/control registration |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus overhead and improves bandwidth efficiency |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - requires separate low-noise regulation for core and I/O domains |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including base station and industrial automation |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm) - compatible with standard SMT reflow profiles |
Pinout & Package
71V65803S100BG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 1 marked by corner notch or dot; top-side marking includes "71V65803S100BG" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this signal |
| R/W | Read/Write Control | Synchronous command input determining load-cycle direction; sampled with ADV/LD to initiate read/write |
| ADV/LD | Burst Address Control | LOW loads external address; HIGH advances internal burst counter - defines burst sequence start and progression |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit subwords (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enable Inputs | Three-input hierarchical enable: CE1=LOW, CE2=LOW, CE2=HIGH required for selection; any violation initiates 2-cycle deselect |
| OE | Output Enable | Asynchronous, active-low control - tri-states outputs immediately regardless of clock state |
| ZZ | Sleep Mode Input | Asynchronous, active-high signal that gates internal clock and reduces power to retention level while preserving data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered input and output paths ensure timing closure in pipelined designs |
| VDD, VDDQ, VSS | Power/Ground | VDD (core), VDDQ (I/O), and VSS (common ground) require local decoupling per JEDEC TQFP layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations - increases effective bus utilization by up to 33% in mixed-access patterns |
| Pipelined Output Buffer | Internally synchronized OE-independent output enable - removes need for external OE timing control in burst sequences |
| 4-Word Burst Counter | Hardware-based linear or interleaved burst generation controlled by LBO pin - reduces address bus toggling and controller overhead |
| Individual Byte Write (BW1–BW4) | Enables partial 9-bit word updates without masking logic or full-bus arbitration - critical for protocol header manipulation |
| Three-Chip-Enable Architecture | Supports depth expansion with minimal glue logic - CE1/CE2/CE2 combination allows hierarchical memory bank selection |
Applications
| High-Speed Network Packet Buffer | FPGA-Based Protocol Accelerator |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payload fragments in 10G/25G Ethernet line cards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly with MAC-layer logic and traffic manager ASICs. Use Value: ZBT™ architecture delivers continuous 150 MHz burst throughput without turnaround penalties, enabling line-rate packet processing. | Use Scenario: Offloading TCP/IP checksum, encryption, or VLAN tagging in FPGA-accelerated edge servers. IC Role / Device Role / Timing Role: Shared memory resource between FPGA fabric and host processor for descriptor and metadata exchange. Use Value: 4-word burst and byte-write capability reduce PCIe transaction count and improve descriptor update efficiency. |
| Industrial PLC Motion Controller | Avionics Data Concentrator Unit |
Use Scenario: Real-time interpolation table storage and servo command buffering in multi-axis CNC controllers. IC Role / Device Role / Timing Role: Deterministic-access memory for motion profile lookups synchronized to servo loop clock. Use Value: 3.8 ns clock-to-data access and industrial temperature rating ensure jitter-free execution under thermal stress. | Use Scenario: Aggregating ARINC 429 and MIL-STD-1553 bus data in flight control computers. IC Role / Device Role / Timing Role: Time-critical buffer for sensor fusion preprocessing before DSP ingestion. Use Value: ZZ sleep mode enables rapid power gating during idle intervals while retaining mission-critical data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1372KV18 | 512K × 18-bit organization, 165-ball fBGA only, no TQFP option; 133 MHz max frequency | Lacks ZBT™ zero-turnaround; uses conventional burst interface requiring OE coordination | Select when board space permits BGA and system timing budget allows 133 MHz with added OE control overhead |
| AS7C3256P | 32K × 8-bit async SRAM, 55 ns access, DIP/SOIC packages only; no burst or pipelining | No synchronous interface, no burst capability, no ZBT™ feature - fundamentally different timing model | Only suitable for legacy redesigns where synchronous timing and burst features are not required |
Compared with CY7C1372KV18 and AS7C3256P, the 71V65803S100BG uniquely delivers ZBT™-enabled 150 MHz burst throughput in a manufacturable TQFP package, making it optimal for new industrial and networking designs demanding deterministic latency and high bus efficiency.
Availability
71V65803S100BG is available at Aetrix Electronics and suitable for high-speed network packet buffers, FPGA-based protocol accelerators, and industrial motion controllers requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V65803S100BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S100BG belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-bandwidth, low-latency memory subsystems in networking equipment, telecom infrastructure, and real-time industrial control systems.
FAQ
What is the maximum operating frequency of the 71V65803S100BG?
The 71V65803S100BG is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The 3.8 ns clock-to-data access time reflects its optimized pipelined output architecture, enabling deterministic timing in high-speed synchronous systems.
Does the 71V65803S100BG support both 256K × 36 and 512K × 18 configurations?
Yes, the 71V65803S100BG supports both memory organizations. The 256K × 36-bit mode is the default configuration for the S100BG variant (100-pin TQFP), while the 512K × 18-bit mode is achieved via pin strapping and functional mapping - confirmed in the device's functional block diagrams and pin configuration tables for PKG100. Both modes retain ZBT™, burst, and pipelined features.
How does the ZBTTM feature eliminate dead cycles in the 71V65803S100BG?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S100BG eliminates dead cycles by allowing immediate transition between read and write operations without bus idle time. This is achieved through internal synchronization of the output buffer enable and burst counter logic, so the device can accept a new address/control cycle on the same clock edge that completes the prior data transfer - verified in the synchronous truth table and timing diagrams.
What is the function of the ADV/LD and LBO pins on the 71V65803S100BG?
On the 71V65803S100BG, ADV/LD is a synchronous input that determines whether the current clock cycle loads a new external address (ADV/LD = LOW) or advances the internal burst counter (ADV/LD = HIGH). LBO is a static input selecting burst order: LOW enables linear sequence (0,1,2,3), HIGH enables interleaved (0,2,1,3). Both are essential for controlling burst behavior and are defined in the pin description summary and burst sequence tables.
Is the 71V65803S100BG pin-compatible with other members of the 71V65603/71V65803 family?
Yes, the 71V65803S100BG shares identical pinout, electrical characteristics, and functional behavior with the 71V65603S100BG in the 100-pin TQFP package. Differences are limited to memory organization (256K × 36 vs. 512K × 18) and internal address decoding - confirmed in the dual pin configuration diagrams (PKG100 for both variants) and functional descriptions. No PCB changes are required for migration within the same package variant.
71V65803S100BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65803S100BG FAQ
1.How can I place an order for 71V65803S100BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S100BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S100BG reliable?
The price and inventory of 71V65803S100BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100BG is usually 5 days.
3.What payment methods are accepted for 71V65803S100BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S100BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65803S100BG?
71V65803S100BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S100BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S100BG?
For technical support, including 71V65803S100BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100BG requirements.
6.How does Aetrix verify that 71V65803S100BG is sourced from the original manufacturer or authorized distributors?
All 71V65803S100BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100BG meets industry standards.
7.What is the process for return or replacement of 71V65803S100BG?
All 71V65803S100BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S100BG part is unused and in its original packaging.
Return procedure for 71V65803S100BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S100BG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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