Renesas 71V65803S100BQG
- Part No.:
- 71V65803S100BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65803S100BQG.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,053
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V65803S100BQG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst modes, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). Used in high-speed networking buffers, packet switching ASIC/FPGA interfaces, and real-time DSP memory subsystems.
For engineers reviewing the 71V65803S100BQG datasheet, 71V65803S100BQG pinout, 71V65803S100BQG application, or 71V65803S100BQG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, and support for pipelined read/write transitions without dead cycles.
Technical Context
The 71V65803S100BQG implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising CLK edge. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions via internal burst counter management and ADV/LD-controlled address loading or incrementing.
It features three chip enables (CE1, CE2 active-low; CE2 active-high), asynchronous OE and ZZ inputs, static LBO for burst order selection, and internally synchronized output buffer enable-removing external OE timing constraints. All I/Os are registered, supporting pipelined system integration with deterministic 2-cycle data latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit mode via pin configuration |
| Max Clock Frequency | 150 MHz - enables 6.67 ns cycle time for sustained burst throughput |
| Clock-to-Data Access | 3.8 ns - fixed 2-cycle pipeline delay from CLK rise to valid Q output |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - separate power domains reduce noise coupling |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus traffic by 75% per burst sequence |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded and telecom infrastructure |
| Power-Down Mode | ZZ input gates internal clock - reduces standby current to <100 µA while retaining data |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated for 256K × 36 configuration per PKG100 drawing (Rev. 6.42).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK with ADV/LD low and CEN low |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle operation type; determines data direction two cycles later |
| ADV/LD | Advance Burst / Load Address | High = increment internal burst counter; Low = load new external address into register |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence: Low = linear (0,1,2,3); High = interleaved (0,2,1,3) |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for 9-bit bytes; allow partial-word writes without masking logic |
| CE1, CE2, CE2 | Chip Enables | Three-input enable scheme: CE1 & CE2 low + CE2 high selects device; any violation deselects in two cycles |
| OE | Output Enable | Asynchronous active-low control; tri-states outputs immediately - no timing coordination needed |
| ZZ | Sleep Mode | Asynchronous active-high input; gates internal clock and reduces ICC to microamp range |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered inputs/outputs ensure clean setup/hold margins |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enables continuous 150 MHz burst streaming |
| Internally Synchronized OE | Removes need for precise OE timing alignment - simplifies PCB layout and timing closure |
| 4-Word Pipelined Burst | Single address initiates four consecutive data transfers - cuts address bus utilization by 75% |
| Individual Byte Write Control | Four independent BWx pins enable granular 9-bit writes - avoids full-word read-modify-write overhead |
| Three-Chip-Enable Architecture | Supports seamless depth expansion with no external logic - enables 72-bit or wider memory interfaces |
| Industrial Temperature Range | –40°C to +85°C operation - qualified for base station, industrial controller, and automotive ADAS memory buffers |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payload fragments in 10G/25G Ethernet switch ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 3.8 ns read access and zero-turnaround burst writes. Use Value: Enables line-rate packet processing by eliminating bus idle cycles during header-to-payload handoff sequences. |
Use Scenario: Providing low-latency instruction and data cache for Xilinx Ultrascale+ or Intel Agilex FPGA-based motor control accelerators. IC Role / Device Role / Timing Role: Synchronous memory interface bridging FPGA fabric and real-time control loops with pipelined 2-cycle latency. Use Value: Supports 150 MHz burst reads/writes to sustain >500 MB/s bandwidth required for servo loop updates at 20 kHz. |
| DSP Algorithm Memory | Telecom Baseband Buffer |
|
Use Scenario: Holding FFT coefficient tables and intermediate results in TI C66x or Analog Devices SHARC+ DSP subsystems. IC Role / Device Role / Timing Role: ZBT™ SRAM delivering burst-aligned data to dual-MAC pipelines with simultaneous read/write capability. Use Value: Achieves 9.4 Mbit capacity at 150 MHz without wait states - critical for real-time spectral analysis in radar systems. |
Use Scenario: Buffering OFDM symbol streams between RF front-end ADC/DAC and channel estimation blocks in 5G massive MIMO radios. IC Role / Device Role / Timing Role: Industrial-temp SRAM providing jitter-free, pipelined data flow with ZZ sleep mode for power-gated symbol processing phases. Use Value: Maintains data integrity across –40°C to +85°C while enabling burst-mode symbol buffering with <100 µA standby current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-133AXC | 133 MHz max, 256K × 36, same TQFP-100, Cypress (Infineon) ZBT SRAM | Lacks ZZ sleep mode; higher ICC in active mode (225 mA vs. 195 mA typical) | Select when legacy Cypress footprint compatibility is required and sleep mode is not needed. |
| AS7C33128PFSI-15BIN | 150 MHz, 256K × 36, 100-pin TQFP, Alliance Memory ZBT SRAM | No LBO pin - fixed linear burst only; no individual BWx - byte masking via external logic required | Select for cost-sensitive industrial designs where burst flexibility and byte-write granularity are secondary. |
Compared with CY7C1371DV33-133AXC and AS7C33128PFSI-15BIN, the 71V65803S100BQG uniquely combines 150 MHz performance, ZBTTM architecture, ZZ sleep mode, and full 4-byte write control - making it optimal for thermally constrained, high-throughput telecom and networking buffers requiring deterministic low-latency behavior.
Availability
71V65803S100BQG is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and DSP algorithm memory applications requiring stable component supply, long-term industrial temperature support, and ZBT™-optimized timing behavior.
Supply support for 71V65803S100BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S100BQG belongs to Renesas' high-speed ZBT™ SRAM product line, engineered specifically for zero-latency memory interfacing in packet-switched networks, baseband processing, and real-time embedded systems demanding deterministic burst performance.
FAQ
What is the maximum operating frequency of the 71V65803S100BQG?
The 71V65803S100BQG is rated for 150 MHz operation, corresponding to a 6.67 ns clock period and 3.8 ns clock-to-data access time. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions, as verified in the AC timing specifications of the official Renesas datasheet (Rev. 6.42).
Does the 71V65803S100BQG support both linear and interleaved burst modes?
Yes, the 71V65803S100BQG supports both linear and interleaved 4-word burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven low, the burst follows linear order (A0, A1, A2, A3); when high, it follows interleaved order (A0, A2, A1, A3). This selection is static and must remain stable during burst operation.
How does the ZBTTM feature eliminate dead cycles in the 71V65803S100BQG?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S100BQG allows immediate transition from a write burst to a read burst (or vice versa) without inserting idle cycles. This is achieved through internal burst counter synchronization and ADV/LD-controlled address sequencing - ensuring the bus remains active and productive at 150 MHz sustained throughput.
What package type is used for the 71V65803S100BQG?
The 71V65803S100BQG uses a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), designated PKG100, with 14 mm × 20 mm body size and 0.5 mm lead pitch. This package is explicitly confirmed in the Renesas datasheet (Rev. 6.42) for the 256K × 36 configuration and supports industrial temperature operation.
Can the 71V65803S100BQG operate in power-down mode, and how is it controlled?
Yes, the 71V65803S100BQG supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven high, the internal clock is gated and core current drops to under 100 µA while retaining memory contents. The device resumes normal operation within one clock cycle after ZZ returns low, with no initialization delay required.
71V65803S100BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65803S100BQG FAQ
1.How can I place an order for 71V65803S100BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S100BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S100BQG reliable?
The price and inventory of 71V65803S100BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100BQG is usually 5 days.
3.What payment methods are accepted for 71V65803S100BQG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S100BQG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65803S100BQG?
71V65803S100BQG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S100BQG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S100BQG?
For technical support, including 71V65803S100BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100BQG requirements.
6.How does Aetrix verify that 71V65803S100BQG is sourced from the original manufacturer or authorized distributors?
All 71V65803S100BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100BQG meets industry standards.
7.What is the process for return or replacement of 71V65803S100BQG?
All 71V65803S100BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S100BQG part is unused and in its original packaging.
Return procedure for 71V65803S100BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S100BQG Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

