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Renesas 71V65803S100BQG

Part No.:
71V65803S100BQG
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65803S100BQG.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,053

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Product details

Overview

71V65803S100BQG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst modes, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). Used in high-speed networking buffers, packet switching ASIC/FPGA interfaces, and real-time DSP memory subsystems.

For engineers reviewing the 71V65803S100BQG datasheet, 71V65803S100BQG pinout, 71V65803S100BQG application, or 71V65803S100BQG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, and support for pipelined read/write transitions without dead cycles.

Technical Context

The 71V65803S100BQG implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising CLK edge. Its ZBT™ feature eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions via internal burst counter management and ADV/LD-controlled address loading or incrementing.

It features three chip enables (CE1, CE2 active-low; CE2 active-high), asynchronous OE and ZZ inputs, static LBO for burst order selection, and internally synchronized output buffer enable-removing external OE timing constraints. All I/Os are registered, supporting pipelined system integration with deterministic 2-cycle data latency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit mode via pin configuration
Max Clock Frequency 150 MHz - enables 6.67 ns cycle time for sustained burst throughput
Clock-to-Data Access 3.8 ns - fixed 2-cycle pipeline delay from CLK rise to valid Q output
Supply Voltages VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - separate power domains reduce noise coupling
Burst Capability 4-word linear or interleaved burst - reduces address bus traffic by 75% per burst sequence
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded and telecom infrastructure
Power-Down Mode ZZ input gates internal clock - reduces standby current to <100 µA while retaining data

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated for 256K × 36 configuration per PKG100 drawing (Rev. 6.42).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK with ADV/LD low and CEN low
CLK Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge
R/W Read/Write Control Synchronous signal defining load-cycle operation type; determines data direction two cycles later
ADV/LD Advance Burst / Load Address High = increment internal burst counter; Low = load new external address into register
LBO Linear/Interleaved Burst Order Static input selecting burst sequence: Low = linear (0,1,2,3); High = interleaved (0,2,1,3)
BW1–BW4 Byte Write Enables Active-low synchronous controls for 9-bit bytes; allow partial-word writes without masking logic
CE1, CE2, CE2 Chip Enables Three-input enable scheme: CE1 & CE2 low + CE2 high selects device; any violation deselects in two cycles
OE Output Enable Asynchronous active-low control; tri-states outputs immediately - no timing coordination needed
ZZ Sleep Mode Asynchronous active-high input; gates internal clock and reduces ICC to microamp range
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional synchronous bus; registered inputs/outputs ensure clean setup/hold margins

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates dead cycles between read/write transitions - enables continuous 150 MHz burst streaming
Internally Synchronized OE Removes need for precise OE timing alignment - simplifies PCB layout and timing closure
4-Word Pipelined Burst Single address initiates four consecutive data transfers - cuts address bus utilization by 75%
Individual Byte Write Control Four independent BWx pins enable granular 9-bit writes - avoids full-word read-modify-write overhead
Three-Chip-Enable Architecture Supports seamless depth expansion with no external logic - enables 72-bit or wider memory interfaces
Industrial Temperature Range –40°C to +85°C operation - qualified for base station, industrial controller, and automotive ADAS memory buffers

Applications

Network Packet Buffer FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and payload fragments in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 3.8 ns read access and zero-turnaround burst writes.

Use Value: Enables line-rate packet processing by eliminating bus idle cycles during header-to-payload handoff sequences.

Use Scenario: Providing low-latency instruction and data cache for Xilinx Ultrascale+ or Intel Agilex FPGA-based motor control accelerators.

IC Role / Device Role / Timing Role: Synchronous memory interface bridging FPGA fabric and real-time control loops with pipelined 2-cycle latency.

Use Value: Supports 150 MHz burst reads/writes to sustain >500 MB/s bandwidth required for servo loop updates at 20 kHz.

DSP Algorithm Memory Telecom Baseband Buffer

Use Scenario: Holding FFT coefficient tables and intermediate results in TI C66x or Analog Devices SHARC+ DSP subsystems.

IC Role / Device Role / Timing Role: ZBT™ SRAM delivering burst-aligned data to dual-MAC pipelines with simultaneous read/write capability.

Use Value: Achieves 9.4 Mbit capacity at 150 MHz without wait states - critical for real-time spectral analysis in radar systems.

Use Scenario: Buffering OFDM symbol streams between RF front-end ADC/DAC and channel estimation blocks in 5G massive MIMO radios.

IC Role / Device Role / Timing Role: Industrial-temp SRAM providing jitter-free, pipelined data flow with ZZ sleep mode for power-gated symbol processing phases.

Use Value: Maintains data integrity across –40°C to +85°C while enabling burst-mode symbol buffering with <100 µA standby current.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-133AXC 133 MHz max, 256K × 36, same TQFP-100, Cypress (Infineon) ZBT SRAM Lacks ZZ sleep mode; higher ICC in active mode (225 mA vs. 195 mA typical) Select when legacy Cypress footprint compatibility is required and sleep mode is not needed.
AS7C33128PFSI-15BIN 150 MHz, 256K × 36, 100-pin TQFP, Alliance Memory ZBT SRAM No LBO pin - fixed linear burst only; no individual BWx - byte masking via external logic required Select for cost-sensitive industrial designs where burst flexibility and byte-write granularity are secondary.

Compared with CY7C1371DV33-133AXC and AS7C33128PFSI-15BIN, the 71V65803S100BQG uniquely combines 150 MHz performance, ZBTTM architecture, ZZ sleep mode, and full 4-byte write control - making it optimal for thermally constrained, high-throughput telecom and networking buffers requiring deterministic low-latency behavior.

Availability

71V65803S100BQG is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and DSP algorithm memory applications requiring stable component supply, long-term industrial temperature support, and ZBT™-optimized timing behavior.

Supply support for 71V65803S100BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65803S100BQG belongs to Renesas' high-speed ZBT™ SRAM product line, engineered specifically for zero-latency memory interfacing in packet-switched networks, baseband processing, and real-time embedded systems demanding deterministic burst performance.

FAQ

What is the maximum operating frequency of the 71V65803S100BQG?

The 71V65803S100BQG is rated for 150 MHz operation, corresponding to a 6.67 ns clock period and 3.8 ns clock-to-data access time. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions, as verified in the AC timing specifications of the official Renesas datasheet (Rev. 6.42).

Does the 71V65803S100BQG support both linear and interleaved burst modes?

Yes, the 71V65803S100BQG supports both linear and interleaved 4-word burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven low, the burst follows linear order (A0, A1, A2, A3); when high, it follows interleaved order (A0, A2, A1, A3). This selection is static and must remain stable during burst operation.

How does the ZBTTM feature eliminate dead cycles in the 71V65803S100BQG?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S100BQG allows immediate transition from a write burst to a read burst (or vice versa) without inserting idle cycles. This is achieved through internal burst counter synchronization and ADV/LD-controlled address sequencing - ensuring the bus remains active and productive at 150 MHz sustained throughput.

What package type is used for the 71V65803S100BQG?

The 71V65803S100BQG uses a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), designated PKG100, with 14 mm × 20 mm body size and 0.5 mm lead pitch. This package is explicitly confirmed in the Renesas datasheet (Rev. 6.42) for the 256K × 36 configuration and supports industrial temperature operation.

Can the 71V65803S100BQG operate in power-down mode, and how is it controlled?

Yes, the 71V65803S100BQG supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven high, the internal clock is gated and core current drops to under 100 µA while retaining memory contents. The device resumes normal operation within one clock cycle after ZZ returns low, with no initialization delay required.

71V65803S100BQG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65803S100BQG FAQ

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Please submit a Request for Quotation (RFQ) for 71V65803S100BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 71V65803S100BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100BQG is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S100BQG?

For technical support, including 71V65803S100BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100BQG requirements.

6.How does Aetrix verify that 71V65803S100BQG is sourced from the original manufacturer or authorized distributors?

All 71V65803S100BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100BQG meets industry standards.

7.What is the process for return or replacement of 71V65803S100BQG?

All 71V65803S100BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100BQG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S100BQG part is unused and in its original packaging.

Return procedure for 71V65803S100BQG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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