Renesas 71V65803S100BQI
- Part No.:
- 71V65803S100BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65803S100BQI.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,031
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Product details
Overview
71V65803S100BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined burst outputs. It supports interleaved/linear 4-word bursts, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). Used in high-speed packet buffering, network switch fabric, and real-time DSP memory subsystems.
For engineers reviewing the 71V65803S100BQI datasheet, 71V65803S100BQI pinout, 71V65803S100BQI application, or 71V65803S100BQI equivalent, key selection criteria include ZBT™ timing compatibility, TQFP-100 package footprint, 3.3V I/O and core supply requirements, and support for burst read/write without dead cycles between bus direction changes.
Technical Context
The 71V65803S100BQI implements a fully synchronous, clock-edge-triggered interface with address/control/data registers aligned to the rising edge of CLK. Its ZBT™ architecture eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions using internal burst counter logic and ADV/LD-controlled address loading.
It features three chip enables (CE1, CE2, CE2) with dual-polarity logic, asynchronous OE and ZZ inputs, and static LBO pin selection for linear or interleaved burst order. Output enable is internally synchronized, removing external timing constraints on OE control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports 512K × 18-bit via configuration - defines data path width and address depth for system memory mapping |
| Max Clock Frequency | 150 MHz - enables 6.67 ns cycle time for high-throughput streaming applications like telecom line cards |
| Clock-to-Data Access | 3.8 ns - guarantees deterministic output valid timing two clocks after address/control registration |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - requires separate low-noise core and I/O rails; no power sequencing needed |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems including base station and industrial automation controllers |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus traffic and improves bandwidth efficiency in sequential access patterns |
| Input Capacitance | ≤5 pF (BGA), ≤7 pF (TQFP) - ensures signal integrity at 150 MHz with minimal trace loading |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per Renesas document 5304 drw 02 (PKG100, 256K×36 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference for all synchronous registers; all setup/hold times referenced to this edge |
| A0–A17 | Address inputs | 18-bit address bus for 256K-depth addressing; registered on rising CLK when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip enables | Three-input enable logic: CE1 = LOW, CE2 = LOW, CE2 = HIGH selects device; any violation initiates 2-cycle deselect |
| R/W | Read/write control | Synchronous signal determining cycle type; sampled with ADV/LD to initiate load or burst operation |
| ADV/LD | Advance burst / Load address | LOW loads new external address; HIGH advances internal burst counter - controls burst sequence initiation and progression |
| BW1–BW4 | Byte write enables | Four independent active-LOW enables for 9-bit bytes (I/O[0:31] + I/OP1–I/OP4); allows partial-word writes without masking logic |
| OE | Output enable | Asynchronous, active-LOW; tri-states outputs immediately - may be tied LOW for simplified read-only operation |
| ZZ | Sleep mode | Asynchronous, active-HIGH; gates internal clock and reduces power to minimum retention level while preserving data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered inputs and outputs eliminate external latch requirements |
| LBO | Burst order select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during burst operation |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enables continuous 150 MHz bus utilization in full-duplex memory interfaces |
| Internally synchronized OE | Removes need for precise OE timing control - simplifies PCB layout and eliminates external OE delay matching |
| 4-word burst counter with LBO control | Reduces address bus activity by 75% for sequential accesses - lowers system-level EMI and routing congestion |
| Individual byte write (BW1–BW4) | Enables granular 9-bit updates without read-modify-write - critical for protocol header manipulation in networking ASICs |
| Three chip enables with dual polarity | Supports flexible depth expansion and hierarchical memory decoding - allows stacking multiple 71V65803S100BQI devices without glue logic |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in multi-gigabit switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer SRAM interfacing directly to MAC and switching fabric logic. Use Value: ZBT™ architecture delivers zero-cycle turnaround between frame header reads and payload writes - sustaining 150 MHz throughput without pipeline stalls. |
Use Scenario: Real-time buffering of TDM and packetized voice/data streams in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Synchronous burst-access memory supporting deterministic jitter-free data transfer between PHY and DSP cores. Use Value: 4-word burst mode and pipelined outputs reduce controller overhead by 60% versus discrete address strobes - improving channel density per card. |
| DSP Co-Processor Cache | Industrial Motion Controller FIFO |
|
Use Scenario: Offloading FFT and filtering operations in FPGA-based motor drives requiring sub-microsecond memory response. IC Role / Device Role / Timing Role: Low-latency scratchpad memory tightly coupled to soft-core RISC processors or hardware accelerators. Use Value: 3.8 ns clock-to-data access and industrial temperature rating ensure deterministic execution timing even under thermal stress. |
Use Scenario: Synchronizing encoder feedback and PWM command streams in servo drives with nanosecond jitter tolerance. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via burst reads/writes and independent byte enables for concurrent data staging. Use Value: Individual BW1–BW4 control allows atomic update of position setpoints and status flags without corrupting adjacent motion parameters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V65603S100BQI | Same 256K×36 organization and pinout, but rated for commercial temperature (0°C to +70°C) only | Not suitable for industrial environments; lacks extended temperature qualification and associated reliability testing | Select when cost sensitivity outweighs ambient operating range requirements and thermal derating is acceptable |
| AS7C3256B-10JIN | 256K×16-bit (4 Mbit), 10 ns access, 3.3V CMOS - no ZBT™, no burst counter, no ADV/LD or LBO pins | Requires external burst logic and address generation; higher latency limits use in real-time packet processing | Choose only for legacy designs where ZBT™ timing is unnecessary and lower density suffices |
Compared with 71V65603S100BQI and AS7C3256B-10JIN, the 71V65803S100BQI uniquely delivers industrial-temperature ZBT™ operation with 36-bit width and integrated burst control - enabling single-chip solutions for high-reliability, high-throughput memory subsystems without external timing glue.
Availability
71V65803S100BQI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial motion controller FIFO applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for 71V65803S100BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S100BQI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed, low-latency memory subsystems in networking, telecommunications, and real-time embedded systems demanding deterministic bus turnaround and burst efficiency.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V65803S100BQI?
The 71V65803S100BQI operates up to 150 MHz with a guaranteed clock-to-data access time of 3.8 ns. This specification is measured under industrial conditions (–40°C to +85°C) with VDD and VDDQ at 3.3 V ±5%. The timing ensures deterministic output validity two clock cycles after address/control registration, critical for pipelined system architectures.
Does the 71V65803S100BQI support both linear and interleaved burst modes, and how is the selection made?
Yes, the 71V65803S100BQI supports both linear and interleaved 4-word burst sequences. Selection is controlled by the static LBO (Linear Burst Order) pin: LBO = LOW configures linear order (0,1,2,3), while LBO = HIGH selects interleaved order (0,2,1,3). The pin must remain stable during burst operation and is not sampled dynamically.
How does the ZBTTM feature eliminate dead cycles in the 71V65803S100BQI?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S100BQI uses an internal burst counter and ADV/LD-controlled address sequencing to allow immediate transition between read and write operations. Unlike conventional SRAMs requiring bus idle cycles for direction change, the 71V65803S100BQI sustains continuous 150 MHz throughput without insertion of wait states or dead cycles.
What are the voltage and sequencing requirements for VDD and VDDQ on the 71V65803S100BQI?
The 71V65803S100BQI requires VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. Power sequencing is not required: either rail may ramp first, but no input or I/O pin voltage may exceed VDDQ during ramp-up. Both supplies must reach nominal value before applying CLK.
Can the 71V65803S100BQI be used in depth-expanded memory configurations, and what pins enable this?
Yes, the 71V65803S100BQI supports depth expansion using its three chip enables: CE1 (active LOW), CE2 (active LOW), and CE2 (active HIGH). These allow hierarchical decoding across multiple devices - for example, using CE1/CE2 to select bank and CE2 to enable individual units - enabling seamless memory capacity scaling without external logic.
71V65803S100BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65803S100BQI FAQ
1.How can I place an order for 71V65803S100BQI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S100BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S100BQI reliable?
The price and inventory of 71V65803S100BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100BQI is usually 5 days.
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71V65803S100BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S100BQI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S100BQI?
For technical support, including 71V65803S100BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100BQI requirements.
6.How does Aetrix verify that 71V65803S100BQI is sourced from the original manufacturer or authorized distributors?
All 71V65803S100BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100BQI meets industry standards.
7.What is the process for return or replacement of 71V65803S100BQI?
All 71V65803S100BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S100BQI part is unused and in its original packaging.
Return procedure for 71V65803S100BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S100BQI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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