Renesas 71V65803S100PFG
- Part No.:
- 71V65803S100PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65803S100PFG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65803S100PFG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz operation, 3.8 ns clock-to-data access, zero bus turnaround (ZBT), and pipelined burst reads/writes - deployed in high-speed networking line cards and packet buffering subsystems.
For engineers reviewing the 71V65803S100PFG datasheet, 71V65803S100PFG pinout, 71V65803S100PFG application, or 71V65803S100PFG equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V I/O interface alignment, industrial temperature support (–40°C to +85°C), and burst-mode control via ADV/LD and LBO.
Technical Context
The 71V65803S100PFG implements a fully synchronous, positive-edge-triggered architecture with registered address, control, and data paths. Its ZBT feature eliminates dead cycles between read/write transitions by overlapping bus turnaround with internal memory access, enabled by dual-phase burst counter logic and internally synchronized OE.
It supports interleaved or linear 4-word bursts controlled by static LBO input, uses three chip enables (CE1/CE2/CE2) for depth expansion, and integrates individual byte write (BW1–BW4) control with pipelined output registers - all operating under a single 3.3V core (VDD) and I/O (VDDQ) supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports 512K × 18-bit mode via pin configuration |
| Max Clock Frequency | 150 MHz - enables 6.67 ns cycle time for sustained high-throughput packet buffering |
| Clock-to-Data Access | 3.8 ns - defines minimum latency from CLK edge to valid Q output in read cycles |
| ZBT Feature | Zero Bus Turnaround - allows immediate read-after-write or write-after-read without idle cycles |
| Supply Voltage | VDD = VDDQ = 3.3 V ±5% - requires separate core and I/O rail regulation |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded telecom and infrastructure applications |
| Burst Capability | 4-word linear or interleaved burst - reduces address overhead in sequential memory access patterns |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with 0.5 mm pitch and exposed thermal pad (not electrically connected). Pin 1 marked by corner notch; top-side marking includes "71V65803S100PFG" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge when ADV/LD = LOW and CE active |
| CLK | System Clock Input | Positive-edge-triggered master timing reference; all synchronous inputs referenced to this edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle direction; data transfer occurs two cycles later |
| ADV/LD | Burst Counter Control | LOW loads external address; HIGH advances internal burst counter - enables 4-word burst sequencing |
| LBO | Burst Order Select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) burst address sequence |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) for multi-chip depth expansion |
| OE | Output Enable | Asynchronous; tri-states outputs when HIGH - no timing coordination needed with CLK |
| ZZ | Deep Sleep Mode | Asynchronous; gates internal CLK and reduces power to retention level while preserving data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus with registered input/output paths and VDDQ-referenced I/O |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus idle cycles between read/write transitions - increases effective bandwidth in burst-intensive traffic flows |
| Pipelined Output Buffers | Internally synchronized OE removes need for external timing control - simplifies PCB layout and timing closure |
| 4-Word Burst Mode | Single address initiates four consecutive data transfers - cuts address bus utilization by 75% in sequential access |
| Individual Byte Write | Four independent BWx signals enable partial-word writes without read-modify-write - critical for header editing in packet processors |
| Three Chip Enables | Supports seamless depth expansion across multiple devices - enables scalable memory subsystems up to 18-Mbit+ capacity |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
Use Scenario: Storing ingress/egress packet payloads in Layer 2/3 switches with line-rate throughput requirements. IC Role / Device Role / Timing Role: Primary data buffer providing low-latency, burst-capable storage interfaced directly to network processor's 36-bit synchronous bus. Use Value: 3.8 ns clock-to-data access and ZBT operation minimize queuing delay and maximize switch fabric utilization at 10 Gbps+ rates. | Use Scenario: Acting as instruction/data cache for RISC-based network processors executing classification and forwarding algorithms. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory supporting pipelined instruction fetch and context switching. Use Value: 150 MHz clock rate and 4-word burst mode reduce instruction fetch stalls, improving per-packet processing efficiency. |
| Telecom Line Card Memory | Industrial Real-Time Controller Buffer |
Use Scenario: Buffering ATM or SONET frame data in carrier-grade optical transport equipment operating in extended temperature environments. IC Role / Device Role / Timing Role: Industrial-temperature-rated synchronous SRAM providing deterministic access for time-critical framing logic. Use Value: –40°C to +85°C qualification and ZZ sleep mode ensure reliable operation during thermal cycling and power-conservation modes. | Use Scenario: Holding real-time sensor fusion data and control loop state variables in programmable logic controllers with deterministic response deadlines. IC Role / Device Role / Timing Role: Deterministic-access memory subsystem supporting jitter-free I/O scanning and PID computation cycles. Use Value: Fully synchronous, edge-triggered interface guarantees repeatable timing margins - essential for sub-millisecond control loop execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 133 MHz max, 256K × 36-bit, 4.5 ns tCD, Cypress (Infineon) QDR-II+ architecture with differential clocks | Requires differential CLK/CLK#, lacks ZBT - suited for QDR-optimized systems but not drop-in ZBT replacement | Select only if migrating to QDR-II+ interface and redesigning clock tree; not compatible with 71V65803S100PFG timing or control protocol |
| AS7C3256A-15JC | 15 ns async access, 32K × 8-bit, 5V TTL, no burst or ZBT - Alliance Memory AS7C series standard async SRAM | No synchronous interface, no burst, no pipelining - usable only in legacy non-burst designs with relaxed timing | Only viable for cost-sensitive, low-speed replacements where ZBT, burst, and 3.3V operation are not required |
Compared with CY7C1362BV33-133AXC and AS7C3256A-15JC, the 71V65803S100PFG uniquely delivers ZBT timing, 150 MHz synchronous operation, and industrial-temperature TQFP packaging - making it irreplaceable in high-performance packet buffering where bus turnaround latency must be eliminated.
Availability
71V65803S100PFG is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfaces, telecom line card memory, and industrial real-time controller buffer applications requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V65803S100PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65803S100PFG belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet-switching and real-time control systems demanding deterministic synchronous memory access.
FAQ
What is the maximum operating frequency of the 71V65803S100PFG?
The 71V65803S100PFG is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3V ±5% supply conditions, enabling sustained high-throughput operation in packet buffering and network processing applications where timing margin is critical.
Does the 71V65803S100PFG support both 256K × 36 and 512K × 18 configurations?
Yes, the 71V65803S100PFG supports both memory organizations. The 256K × 36-bit mode uses all 36 I/O pins (I/O0–I/O31 and I/OP1–I/OP4), while the 512K × 18-bit mode repurposes I/O16–I/O31 and I/OP3–I/OP4 as additional address bits (A18–A19), reducing data width to 18 bits. Configuration is determined by pin strapping and address decoding - no internal register setting is required.
How does the ZBTTM feature eliminate dead cycles in the 71V65803S100PFG?
The ZBTTM feature in the 71V65803S100PFG eliminates dead cycles by overlapping bus direction change with internal memory access. When transitioning between read and write operations, the device uses internal pipeline registers and burst counter logic to initiate the next access before the previous bus cycle completes - resulting in zero idle clock cycles between successive transactions, unlike conventional synchronous SRAMs that require explicit turnaround delays.
What is the function of the ADV/LD and LBO pins on the 71V65803S100PFG?
On the 71V65803S100PFG, ADV/LD is a synchronous control pin that loads a new external address when LOW (at rising CLK edge) or advances the internal 4-word burst counter when HIGH. LBO is a static input that selects burst order: LOW enables linear addressing (0,1,2,3), HIGH enables interleaved (0,2,1,3). Both are essential for implementing efficient burst-mode memory access without external address generation logic.
Can the 71V65803S100PFG operate in deep power-down mode, and how is it controlled?
Yes, the 71V65803S100PFG supports deep power-down mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated, dynamic power drops to minimum, and the device retains stored data. Power consumption falls significantly while maintaining full data integrity - ideal for energy-constrained telecom and industrial systems requiring rapid wake-up without data reload.
71V65803S100PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65803S100PFG FAQ
1.How can I place an order for 71V65803S100PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S100PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S100PFG reliable?
The price and inventory of 71V65803S100PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100PFG is usually 5 days.
3.What payment methods are accepted for 71V65803S100PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S100PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65803S100PFG?
71V65803S100PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S100PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S100PFG?
For technical support, including 71V65803S100PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100PFG requirements.
6.How does Aetrix verify that 71V65803S100PFG is sourced from the original manufacturer or authorized distributors?
All 71V65803S100PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100PFG meets industry standards.
7.What is the process for return or replacement of 71V65803S100PFG?
All 71V65803S100PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S100PFG part is unused and in its original packaging.
Return procedure for 71V65803S100PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S100PFG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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