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Renesas 71V65803S100PFG8

Part No.:
71V65803S100PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65803S100PFG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,600

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Product details

Overview

71V65803S100PFG8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock speed, 3.8 ns clock-to-data access, zero bus turnaround (ZBT) architecture, and pipelined outputs. It serves as high-bandwidth on-chip or system-level cache in network packet buffers, telecom line cards, and FPGA co-processor memory interfaces.

For engineers reviewing the 71V65803S100PFG8 datasheet, 71V65803S100PFG8 pinout, 71V65803S100PFG8 application, or 71V65803S100PFG8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), three chip enables for depth expansion, asynchronous ZZ sleep mode, and JEDEC-standard 100-pin TQFP packaging with industrial temperature range (–40°C to +85°C).

Technical Context

The 71V65803S100PFG8 implements a fully synchronous, positive-edge-triggered architecture with registered address, data, and control inputs. Its ZBT™ feature eliminates dead cycles between read and write operations by enabling immediate bus turnaround via internal synchronization of output enable.

It integrates a 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved sequences. All synchronous operations-including load, burst, deselect, and suspend-are timed relative to the rising edge of CLK, with CEN enabling clock gating and OE providing asynchronous output control.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant
Max Clock Frequency150 MHz - enables 3.3 ns cycle time for high-throughput streaming applications
Clock-to-Data Access3.8 ns - guarantees deterministic read latency two cycles after address load
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual-rail I/O/core separation reduces noise coupling
Operating Temperature–40°C to +85°C - qualified for industrial-grade embedded and telecom infrastructure
Burst Capability4-word linear or interleaved burst - reduces address bus traffic and improves bandwidth efficiency
Power ManagementAsynchronous ZZ input gates internal clock and reduces active power during idle periods

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant (PFG8 suffix). Pin pitch: 0.5 mm.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge with ADV/LD low and chip enabled
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high) allow flexible depth expansion without external logic
R/WRead/Write ControlSynchronous signal defining operation type; data transfer occurs two cycles later
ADV/LDBurst Address ControlLoads new external address when low; advances internal burst counter when high
LBOBurst Order SelectStatic input selecting linear (LBO = low) or interleaved (LBO = high) burst sequence
BW1–BW4Byte Write EnablesFour active-low signals controlling 9-bit byte writes; supports partial-word updates without read-modify-write
CLKSystem ClockPrimary timing reference; all synchronous registers triggered on rising edge
ZZSleep Mode InputAsynchronous high-impedance entry into lowest-power state with guaranteed data retention
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous bus with registered input/output paths and VDDQ-referenced I/O supply

Key Features

FeatureDesign Value
ZBTTM ArchitectureEliminates bus turnaround dead cycles between reads and writes, enabling continuous data flow in burst-intensive systems
Pipelined OutputsInternally synchronized OE eliminates need for external timing control of output drivers
4-Word Burst CounterReduces address bus activity by 75% per burst; configurable linear/interleaved order via LBO pin
Individual Byte WriteEnables precise 9-bit sub-word writes without disturbing adjacent bytes-critical for protocol header manipulation
Three Chip EnablesSupports seamless memory depth expansion using standard logic; no glue logic required for multi-chip configurations

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switching ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 3.8 ns read access and zero-turnaround write-read transitions.

Use Value: Enables full-line-rate packet processing at 10 Gbps+ by eliminating bus idle cycles during header rewrite and payload reordering.

Use Scenario: Serving as shared memory between DSPs and FPGA-based framer/mapper units in SONET/SDH line cards.

IC Role / Device Role / Timing Role: Synchronous SRAM with burst capability and industrial temperature rating provides reliable, jitter-free data exchange across heterogeneous processors.

Use Value: Supports 4-word interleaved bursts to match DSP memory controller patterns, reducing external bus arbitration overhead by 60%.

FPGA Co-Processor CacheIndustrial PLC Data Logging

Use Scenario: Acting as local instruction/data cache for soft-core RISC processors implemented in Xilinx or Intel FPGAs.

IC Role / Device Role / Timing Role: Pipelined ZBT SRAM interfaced directly to FPGA I/O banks with matched setup/hold timing and VDDQ decoupling.

Use Value: Delivers 150 MHz sustained bandwidth to eliminate pipeline stalls in real-time control loops running at >100 kHz update rates.

Use Scenario: Buffering sensor acquisition data in ruggedized programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Industrial-temperature-rated SRAM with ZZ sleep mode conserves power during idle intervals while retaining volatile logging data.

Use Value: Guarantees data integrity across –40°C to +85°C ambient swings and supports low-power wake-on-event operation via asynchronous ZZ control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXC133 MHz max frequency; 256K × 36 organization; Cypress QDR-II interface with separate read/write portsDesigned for true dual-port random access; lacks ZBT burst counter and ADV/LD controlSelect when simultaneous read/write concurrency is required over burst efficiency
AS7C33128PFS-15BIN150 MHz, 256K × 36, but uses standard sync SRAM interface (no ZBT or burst counter); single CE, no BWx pinsNo zero-turnaround or burst capability; simpler control logic but lower bandwidth densitySelect for cost-sensitive designs where burst and ZBT features are unused

Compared with CY7C1362BV33-133AXC and AS7C33128PFS-15BIN, the 71V65803S100PFG8 uniquely delivers ZBT™-enabled bus efficiency and programmable 4-word burst sequencing-critical for maximizing throughput in packet-processing and telecom buffering where address bus bandwidth is constrained.

Availability

71V65803S100PFG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA co-processor cache, and industrial PLC data logging requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V65803S100PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65803S100PFG8 belongs to Renesas' high-performance ZBT™ SRAM product line, engineered specifically for low-latency, high-bandwidth memory subsystems in networking, telecom, and real-time embedded systems demanding deterministic timing and zero bus turnaround.

FAQ

What is the memory organization and capacity of the 71V65803S100PFG8?

The 71V65803S100PFG8 is configured as 256K × 36 bits, delivering 9,437,184 total bits (9.4 Mbit) of synchronous SRAM. This organization supports 36-bit wide data transfers and is pin-compatible with the 512K × 18 variant (71V65603) on the same 100-pin TQFP package, allowing layout reuse across density options. The device uses a high-performance CMOS process optimized for low-latency access.

Does the 71V65803S100PFG8 support burst mode, and how is it configured?

Yes, the 71V65803S100PFG8 supports 4-word burst mode via its integrated burst counter. Burst behavior is controlled by the ADV/LD and LBO pins: ADV/LD high advances the counter, while LBO selects linear (LBO = low) or interleaved (LBO = high) addressing. The burst sequence is fully synchronous and requires no external logic-address incrementing occurs internally on each rising CLK edge during burst cycles.

What is the role of the ZZ pin on the 71V65803S100PFG8, and how does it affect power consumption?

The ZZ pin on the 71V65803S100PFG8 is an asynchronous sleep mode input. When driven high, ZZ gates the internal clock and places the device in its lowest-power state while maintaining full data retention. This feature reduces active power significantly during idle periods-critical for thermally constrained telecom and industrial applications-and resumes normal operation within one clock cycle upon ZZ deassertion.

How does the ZBTTM feature improve system performance in the 71V65803S100PFG8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S100PFG8 eliminates dead cycles between consecutive read and write operations by synchronizing output enable internally. Unlike conventional SRAMs requiring OE assertion/deassertion and bus turnaround delays, the 71V65803S100PFG8 allows immediate transition from write to read (or vice versa) on the next clock edge-increasing effective bus utilization by up to 30% in burst-heavy workloads like packet buffering.

What package and compliance specifications apply to the 71V65803S100PFG8?

The 71V65803S100PFG8 is supplied in a 100-pin plastic thin quad flatpack (TQFP) per JEDEC MO-145, with 0.5 mm pitch and 14 mm × 20 mm body size. The "PFG8" suffix denotes lead-free, RoHS-compliant construction. It meets industrial temperature requirements (–40°C to +85°C), supports green manufacturing, and is qualified for long-term reliability in mission-critical infrastructure applications.

71V65803S100PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65803S100PFG8 FAQ

1.How can I place an order for 71V65803S100PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S100PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S100PFG8 reliable?

The price and inventory of 71V65803S100PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100PFG8 is usually 5 days.

3.What payment methods are accepted for 71V65803S100PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S100PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65803S100PFG8?

71V65803S100PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S100PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S100PFG8?

For technical support, including 71V65803S100PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100PFG8 requirements.

6.How does Aetrix verify that 71V65803S100PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V65803S100PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100PFG8 meets industry standards.

7.What is the process for return or replacement of 71V65803S100PFG8?

All 71V65803S100PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S100PFG8 part is unused and in its original packaging.

Return procedure for 71V65803S100PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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