Renesas 71V65803S100PFGI
- Part No.:
- 71V65803S100PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65803S100PFGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,754
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Product details
Overview
71V65803S100PFGI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock frequency, 3.8 ns clock-to-data access time, and zero bus turnaround (ZBT) architecture enabling dead-cycle-free read/write transitions. It operates across industrial temperature range (–40°C to +85°C) and supports pipelined burst reads/writes in linear or interleaved sequences for high-throughput memory subsystems in network switches and telecom line cards.
For engineers reviewing the 71V65803S100PFGI datasheet, 71V65803S100PFGI pinout, 71V65803S100PFGI application, or 71V65803S100PFGI equivalent, this page delivers verified package mapping (100-pin TQFP), confirmed ZBT timing behavior, burst counter control via ADV/LD and LBO, individual byte write (BW1–BW4), and industrial-grade power sequencing compliance - all critical for deterministic latency-critical designs.
Technical Context
The 71V65803S100PFGI implements a fully synchronous, positive-edge-triggered interface with registered address, control, and data paths. Its internal burst counter advances on ADV/LD = HIGH and loads new addresses on ADV/LD = LOW, supporting 4-word bursts with selectable linear or interleaved order via static LBO pin.
ZBT operation eliminates bus turnaround latency by allowing immediate read-after-write or write-after-read transitions without wait states. Output enable (OE) is asynchronous but internally synchronized via pipelined output registers, while clock enable (CEN) suspends all synchronous logic without affecting output state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits); supports depth/width expansion via three chip enables (CE1, CE2, CE2) |
| Clock Frequency | 150 MHz maximum; enables 6.67 ns clock period for fully pipelined system timing |
| Access Time | 3.8 ns clock-to-data (tCD); guarantees deterministic read latency two cycles after address load |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); ensures signal integrity with separate I/O rail |
| Operating Temperature | –40°C to +85°C industrial grade; validated for sustained operation in telecom and industrial control environments |
| Power Management | Asynchronous ZZ input enables sleep mode with guaranteed data retention; reduces active power during idle periods |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pin 1 marked via corner notch; top-side marking includes "71V65803S100PFGI" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Positive-edge-triggered master clock; all synchronous timing referenced to this edge |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction two cycles later |
| ADV/LD | Burst Counter Control | HIGH advances internal burst counter; LOW loads external address into register |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved burst (0,2,1,3) |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enable Inputs | Three-input logic: CE1 = L, CE2 = L, CE2 = H selects device; any violation initiates 2-cycle deselect |
| OE | Output Enable | Asynchronous, active-low; tri-states outputs immediately but not required for normal read/write operation |
| ZZ | Sleep Mode Input | Asynchronous, active-high; gates internal clock and reduces power consumption while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs aligned to CLK rising edge |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between consecutive reads and writes, enabling continuous 150 MHz throughput |
| Pipelined Output Buffer | Internally synchronized OE removes need for external timing control of output drivers, simplifying PCB layout |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences for cache-line alignment |
| Individual Byte Write | Enables precise 9-bit granularity writes without masking or full-word overwrites, reducing bus contention and power |
| Three-Chip-Enable Logic | Allows flexible depth expansion (e.g., 2× 256K×36 → 512K×36) with no external decode logic |
| Industrial Temperature Range | Validated operation from –40°C to +85°C ensures reliability in uncontrolled ambient environments like base station enclosures |
Applications
| Network Packet Buffers | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in real-time packet switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer providing deterministic 3.8 ns read access and zero-turnaround write-read transitions. Use Value: Enables full-line-rate forwarding at 10 Gbps+ by eliminating pipeline stalls during burst-mode frame buffering. |
Use Scenario: Serving as shared memory for DSP-based voice processing and protocol stack execution in carrier-grade DSLAMs. IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly to TI C6000 or ADSP-BF5xx processors via EMIF with burst-aligned addressing. Use Value: 4-word burst mode matches DSP cache line size, reducing external memory transactions by 4× and lowering average access latency. |
| High-Speed Test Equipment | Industrial PLC Data Logging |
|
Use Scenario: Capturing high-resolution waveform samples from multi-channel ADCs in automated test systems. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ZBT architecture, supporting concurrent capture (write) and analysis (read) streams. Use Value: Sustains 150 MHz write/read interleaving without arbitration logic, enabling real-time 12-bit @ 100 MSPS acquisition with post-processing. |
Use Scenario: Buffering sensor telemetry and control event logs in ruggedized programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Industrial-grade SRAM with guaranteed data retention in sleep mode (ZZ active) during brownout conditions. Use Value: Maintains critical log integrity during 100 ms power interruptions, meeting IEC 61000-4-11 immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-133AXC | 256K × 36, 133 MHz max, 4.5 ns tCD, 100-pin TQFP, Cypress (now Infineon) | Lower speed grade; lacks ZBT-specific burst control logic (uses standard synchronous burst mode) | Select when design tolerates 133 MHz clock and does not require zero-turnaround transitions between mixed read/write bursts. |
| AS7C33256P-15JCIN | 256K × 36, 150 MHz, 3.8 ns tCD, 100-pin TQFP, Alliance Memory | Pin-compatible but non-ZBT; uses conventional burst mode with fixed sequential order and no ADV/LD control | Choose for cost-sensitive industrial designs where ZBT advantage is unnecessary and legacy compatibility with AS7C family is preferred. |
Compared with CY7C1371DV33-133AXC and AS7C33256P-15JCIN, the 71V65803S100PFGI uniquely delivers true zero-bus-turnaround operation via dedicated ADV/LD and LBO controls - enabling uninterrupted 150 MHz burst streaming essential for packet buffering and real-time signal processing.
Availability
71V65803S100PFGI is available at Aetrix Electronics and suitable for network packet buffers, telecom line card memory, and high-speed test equipment requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V65803S100PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S100PFGI belongs to Renesas' high-performance ZBT™ SRAM product line, engineered specifically for latency-critical, high-throughput memory subsystems in networking, telecom, and test instrumentation where deterministic timing and bus efficiency are paramount.
FAQ
What is the maximum operating frequency and access time of the 71V65803S100PFGI?
The 71V65803S100PFGI supports a maximum clock frequency of 150 MHz with a guaranteed clock-to-data access time (tCD) of 3.8 ns. This specification is valid under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply voltage. The 3.8 ns value reflects the delay from CLK rising edge to valid data on I/O pins during a read cycle initiated two clocks earlier.
How does the ZBTTM feature eliminate dead cycles in the 71V65803S100PFGI?
The ZBTTM feature in the 71V65803S100PFGI allows immediate transition from a write cycle to a read cycle (or vice versa) without inserting idle bus cycles. This is achieved through internal pipelining and dual-phase control logic that decouples address/control registration from data transfer timing - enabling back-to-back operations at full 150 MHz rate without arbitration overhead.
What are the burst sequence options supported by the 71V65803S100PFGI and how are they selected?
The 71V65803S100PFGI supports two 4-word burst orders: linear (0,1,2,3) and interleaved (0,2,1,3). Selection is controlled by the static LBO pin: LBO = LOW configures linear mode; LBO = HIGH configures interleaved mode. The burst counter advances on ADV/LD = HIGH and loads new base addresses on ADV/LD = LOW, ensuring predictable address progression.
Can the 71V65803S100PFGI operate with different supply voltages for core and I/O rails?
Yes - the 71V65803S100PFGI requires separate 3.3 V ±5% supplies: VDD for core logic and VDDQ for I/O circuitry. This separation maintains signal integrity and noise immunity, especially important in mixed-signal systems. Both rails must be powered simultaneously during operation; VDDQ must not exceed VDD + 0.5 V per absolute maximum ratings.
What is the function of the ADV/LD pin in the 71V65803S100PFGI and how does it interact with burst operations?
The ADV/LD pin in the 71V65803S100PFGI serves dual functions: when sampled LOW at the rising CLK edge, it loads a new external address into the internal address register; when sampled HIGH, it advances the internal burst counter. This enables seamless burst initiation and continuation without external address generation logic - a key enabler of the ZBT™ architecture's efficiency.
71V65803S100PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65803S100PFGI FAQ
1.How can I place an order for 71V65803S100PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S100PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S100PFGI reliable?
The price and inventory of 71V65803S100PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S100PFGI is usually 5 days.
3.What payment methods are accepted for 71V65803S100PFGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S100PFGI transactions.
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4.How is shipping managed for 71V65803S100PFGI?
71V65803S100PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S100PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S100PFGI?
For technical support, including 71V65803S100PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S100PFGI requirements.
6.How does Aetrix verify that 71V65803S100PFGI is sourced from the original manufacturer or authorized distributors?
All 71V65803S100PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S100PFGI meets industry standards.
7.What is the process for return or replacement of 71V65803S100PFGI?
All 71V65803S100PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S100PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S100PFGI part is unused and in its original packaging.
Return procedure for 71V65803S100PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S100PFGI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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