Renesas 71V65803S133BGGI
- Part No.:
- 71V65803S133BGGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65803S133BGGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65803S133BGGI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 133 MHz clock speed (7.5 ns cycle time), zero bus turnaround architecture, and pipelined outputs - deployed in high-throughput packet buffering, network switch fabric, and real-time DSP memory subsystems.
For engineers reviewing the 71V65803S133BGGI datasheet, 71V65803S133BGGI pinout, 71V65803S133BGGI application, or 71V65803S133BGGI equivalent, key selection criteria include burst-mode timing compliance, industrial-temperature support (–40°C to +85°C), TQFP/BGA package compatibility, and ZBT™-specific control logic for dead-cycle elimination between read/write transitions.
Technical Context
The 71V65803S133BGGI implements a fully synchronous, clock-edge-triggered interface with address/control/data registers aligned to the rising edge of CLK. Its ZBT™ architecture eliminates bus turnaround latency by enabling immediate read-after-write or write-after-read transitions without idle cycles.
It supports 4-word linear or interleaved burst sequences controlled by the static LBO pin, uses three chip enables (CE1, CE2, CE2) for depth expansion, and integrates an on-chip burst counter with ADV/LD-driven address loading or incrementing - all while maintaining pipelined output registration and asynchronous OE/ZZ control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant |
| Clock Frequency | 133 MHz (7.5 ns cycle time); enables 150 MHz operation per spec, but this variant rated at 133 MHz |
| Access Time | 3.8 ns clock-to-data (tCD) - defines minimum latency from CLK edge to valid output data |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - mandates separate low-noise I/O rail design |
| Operating Temperature | –40°C to +85°C (industrial grade) - validated for extended thermal cycling in telecom infrastructure |
| Burst Capability | 4-word burst (linear or interleaved) - reduces address bus traffic by 75% per burst sequence |
| Power Management | ZZ input enables sleep mode with guaranteed data retention - cuts dynamic power during idle periods |
Pinout & Package
Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 119-ball BGA (BGG119), or 165-fine-pitch BGA (BQG165). This variant - 71V65803S133BGGI - uses the 119-ball BGA (BGG119) package with industrial temperature rating and green RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous operations referenced to this edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle direction; determines whether next data cycle is read or write |
| ADV/LD | Burst Address Control | Loads new external address (LOW) or advances internal burst counter (HIGH); critical for burst sequencing |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence - must remain stable during operation |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates 2-cycle deselect |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| OE | Output Enable | Asynchronous control; drives I/O pins to high-Z when HIGH - can be tied LOW for simplified read-only use |
| ZZ | Sleep Mode Input | Asynchronous gate for internal clock; places device in lowest-power state with full data retention |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered inputs/outputs eliminate external latch requirements |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead cycles between read/write transitions - enables continuous bus utilization in high-speed packet buffers |
| Pipelined Outputs | Internally synchronized output buffer enable removes need for external OE timing control - simplifies PCB layout |
| Single R/W Pin | Reduces control signal count versus dual R/W lines - lowers FPGA/GPU interface pin count and routing complexity |
| Individual Byte Write | Four independent BWx pins allow partial-word writes without masking logic - improves cache coherency efficiency |
| Three Chip Enables | Supports seamless depth expansion across multiple devices without external decoding logic - scales memory width transparently |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 3.8 ns tCD and zero-turnaround burst access. Use Value: Enables line-rate forwarding at 10 Gbps+ by eliminating bus idle cycles between successive frame reads/writes. | Use Scenario: Supporting real-time voice-over-IP (VoIP) processing in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Synchronous memory for echo cancellation, jitter buffering, and TDM-to-packet conversion engines. Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in uncontrolled telco cabinet environments. |
| DSP Algorithm Acceleration | Industrial PLC Data Logging |
Use Scenario: Providing scratchpad memory for FFT, FIR, and matrix operations in radar and medical imaging systems. IC Role / Device Role / Timing Role: Pipelined, burst-capable SRAM interfacing directly with TI C6000 or Analog Devices SHARC processors. Use Value: 4-word burst mode reduces address bus overhead by 75%, accelerating coefficient table lookups and windowed data access. | Use Scenario: Capturing sensor telemetry and motion-control event timestamps in factory automation controllers. IC Role / Device Role / Timing Role: Nonvolatile-buffered SRAM supporting deterministic write logging with individual byte write granularity. Use Value: BW1–BW4 enables selective update of status flags or counters without disturbing adjacent data fields - preserves data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-133BZI | 512K × 18-bit organization; same 133 MHz speed, but narrower 18-bit bus and different pinout | Requires PCB redesign for 18-bit data path; lacks ZBT™-specific ADV/LD burst control logic | Select only if system uses 18-bit bus width and does not require ZBT™ burst sequencing |
| AS7C3256B-133JCIN | 256K × 32-bit organization; no ZBT™ feature, no burst counter, asynchronous OE required | Higher latency (12 ns tAA), no zero-turnaround capability - unsuitable for real-time packet buffering | Consider only for cost-sensitive, non-real-time applications where burst and pipelining are unnecessary |
Compared with CY7C1355BV18-133BZI and AS7C3256B-133JCIN, the 71V65803S133BGGI uniquely delivers 36-bit ZBT™-optimized burst access with industrial temperature support and integrated burst counter - making it irreplaceable in telecom switch fabric and high-speed DSP memory subsystems requiring deterministic latency.
Availability
71V65803S133BGGI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and DSP algorithm acceleration requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.
Supply support for 71V65803S133BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65803S133BGGI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed, low-latency memory subsystems in networking equipment, base stations, and real-time signal processing platforms.
FAQ
What is the memory organization and density of the 71V65803S133BGGI?
The 71V65803S133BGGI is a 256K × 36-bit synchronous SRAM, delivering 9,437,184 bits (9.4 Mbit) of high-speed memory. It supports the 512K × 18-bit configuration via pin-compatible variants, but the 71V65803S133BGGI itself is configured exclusively as 256K × 36. This organization matches 32-bit processor data buses plus parity or ECC bits, commonly used in telecom and networking ASIC interfaces.
Does the 71V65803S133BGGI support burst mode, and how is it configured?
Yes, the 71V65803S133BGGI supports 4-word burst mode with selectable linear or interleaved sequences. Burst behavior is controlled by the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear order, LBO = HIGH selects interleaved. The ADV/LD pin loads new addresses (LOW) or advances the internal burst counter (HIGH), enabling efficient sequential access without repeated address bus transactions - a core function of the 71V65803S133BGGI's ZBT™ architecture.
What is the significance of the "S133" suffix in 71V65803S133BGGI?
The "S133" suffix in 71V65803S133BGGI denotes a 133 MHz maximum operating frequency rating (7.5 ns cycle time). This speed grade is validated across the full industrial temperature range (–40°C to +85°C) and specifies guaranteed timing parameters including tCD = 3.8 ns clock-to-data access. It distinguishes the 71V65803S133BGGI from faster variants like the S150 (150 MHz) and slower S100 (100 MHz) versions within the same family.
How does the ZBTTM feature improve system performance in the 71V65803S133BGGI?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S133BGGI eliminates mandatory idle cycles when switching between read and write operations. Unlike conventional SRAMs requiring bus release/reacquisition, the 71V65803S133BGGI allows immediate back-to-back read-after-write or write-after-read transitions - increasing effective bandwidth by up to 30% in burst-intensive applications like packet buffering and video frame stores.
What package type and environmental rating does the 71V65803S133BGGI use?
The 71V65803S133BGGI uses a 119-ball fine-pitch ball grid array (BGA) package designated "BGGI", which indicates industrial temperature grade (–40°C to +85°C) and green RoHS-compliant construction. The "I" suffix confirms industrial qualification, and the BGG package footprint is JEDEC-standardized for automated assembly and thermal reliability in dense PCB layouts typical of telecom and industrial control modules.
71V65803S133BGGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65803S133BGGI FAQ
1.How can I place an order for 71V65803S133BGGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S133BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S133BGGI reliable?
The price and inventory of 71V65803S133BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BGGI is usually 5 days.
3.What payment methods are accepted for 71V65803S133BGGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S133BGGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65803S133BGGI?
71V65803S133BGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S133BGGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S133BGGI?
For technical support, including 71V65803S133BGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S133BGGI requirements.
6.How does Aetrix verify that 71V65803S133BGGI is sourced from the original manufacturer or authorized distributors?
All 71V65803S133BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BGGI meets industry standards.
7.What is the process for return or replacement of 71V65803S133BGGI?
All 71V65803S133BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BGGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S133BGGI part is unused and in its original packaging.
Return procedure for 71V65803S133BGGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S133BGGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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