Renesas 71V65803S133BGGI8
- Part No.:
- 71V65803S133BGGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65803S133BGGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65803S133BGGI8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 133 MHz clock speed (7.5 ns cycle time), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst modes, individual byte write control (BW1–BW4), and operates across –40°C to +85°C for industrial applications in high-speed networking and packet buffering.
For engineers reviewing the 71V65803S133BGGI8 datasheet, 71V65803S133BGGI8 pinout, 71V65803S133BGGI8 application, or 71V65803S133BGGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP/BGA package compatibility, 3.3V I/O supply (VDDQ), synchronous burst counter behavior, and industrial temperature support - all critical for deterministic memory subsystem design in telecom infrastructure and real-time data path systems.
Technical Context
The 71V65803S133BGGI8 implements a fully synchronous, clock-edge-triggered interface with address/control/data registers aligned to the rising CLK edge. Its ZBT™ architecture eliminates dead cycles between read/write transitions via internally synchronized output buffer enable and pipelined output registers, enabling continuous bus utilization.
It features a 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved sequences. Three chip enables (CE1, CE2, CE2) provide flexible depth expansion, while ZZ enables asynchronous sleep mode for power reduction without data loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits); supports 512K × 18-bit configuration via pin strapping |
| Max Clock Frequency | 133 MHz (7.5 ns cycle time); enables deterministic 2-cycle latency for read/write operations |
| ZBT™ Architecture | Zero Bus Turnaround: no dead cycles between consecutive reads/writes; sustains full bus bandwidth |
| Burst Capability | 4-word burst (interleaved or linear); reduces address overhead and improves throughput in sequential access |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies isolate noise-sensitive I/O paths |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for sustained operation in base station and router environments |
| Package | 119-ball BGA (BGG119); JEDEC-compliant footprint with 0.8 mm pitch for high-density PCB layout |
Pinout & Package
71V65803S133BGGI8 is packaged in a 119-ball fine-pitch ball grid array (BGG119), JEDEC standard, with 0.8 mm pitch and 12 mm × 12 mm body size. Pin functions are defined per the 256K × 36 configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this signal |
| R/W | Read/Write Control | Synchronous command: HIGH = read, LOW = write; determines data direction two cycles later |
| ADV/LD | Burst Counter Control | LOW = load external address; HIGH = increment internal burst counter; defines burst sequence initiation |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved burst (0,2,1,3) |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for 9-bit bytes; enables partial-word writes without masking logic |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); allow multi-chip depth expansion |
| ZZ | Sleep Mode Input | Asynchronous HIGH entry into low-power sleep; clocks gated internally; data retention guaranteed |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; registered inputs/outputs eliminate external latch requirements |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3 V core supply; VDDQ = 3.3 V I/O supply; separate planes reduce switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between read/write transitions, enabling 100% bus utilization in burst-intensive traffic |
| Pipelined Outputs | Internally registered outputs remove need for external output latches and simplify timing closure |
| Individual Byte Write (BW1–BW4) | Enables selective 9-bit byte updates without full-word read-modify-write, reducing power and latency |
| Asynchronous Output Enable (OE) | Allows dynamic tri-state control of I/Os independent of clock; simplifies bus sharing in multi-master systems |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless depth expansion up to 3× without external decode logic or address remapping |
Applications
| High-Speed Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in network switches and routers before forwarding decisions. IC Role / Device Role / Timing Role: Primary burst-access SRAM providing deterministic 2-cycle latency and zero-turnaround read/write switching for line-rate packet processing. Use Value: Sustains 133 MHz bus throughput with no dead cycles, enabling full-duplex frame buffering at OC-192+ speeds. | Use Scenario: Serving as shared memory for DSPs and microcontrollers on telecom line cards handling TDM voice channels and signaling. IC Role / Device Role / Timing Role: Synchronous dual-port-like interface with pipelined outputs, allowing concurrent CPU and DSP access without arbitration logic. Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in uncooled chassis; burst mode reduces address bus loading. |
| Real-Time Data Acquisition Buffer | Industrial PLC Memory Expansion |
Use Scenario: Capturing high-speed sensor streams (e.g., motor current, vibration) in test equipment or factory automation controllers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory staging buffer interfacing with FPGA-based acquisition engines. Use Value: 4-word burst capability matches typical ADC FIFO depth requirements; ZZ sleep mode cuts standby power during idle intervals. | Use Scenario: Expanding local program/data memory for programmable logic controllers executing deterministic ladder logic scans. IC Role / Device Role / Timing Role: Deterministic SRAM replacing slower parallel flash or DRAM, with synchronous interface compatible with ARM Cortex-M7/M33 MCUs. Use Value: 3.3V I/O compatibility avoids level-shifting; industrial temp range aligns with DIN-rail enclosure thermal profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 133 MHz, 256K × 36, QDR-II architecture with separate read/write ports; higher power, different timing model | Requires dual-port controller logic; not ZBT™-compatible; used where simultaneous read/write is mandatory | Select only if true dual-port behavior is required; not drop-in for ZBT™-based designs |
| AS7C3256A-133JCIN | 133 MHz, 256K × 36, standard sync SRAM (no ZBT™); 10 ns tAA, no burst counter or ADV/LD logic | Lacks zero turnaround and burst capability; requires external address sequencing logic for burst access | Choose for cost-sensitive legacy designs where ZBT™ timing is unnecessary and full burst support is omitted |
Compared with CY7C1362BV33-133BZI and AS7C3256A-133JCIN, the 71V65803S133BGGI8 uniquely delivers ZBT™-optimized bus efficiency and integrated burst addressing - critical for minimizing latency in packet-forwarding pipelines where back-to-back read/write transitions dominate.
Availability
71V65803S133BGGI8 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, real-time data acquisition, and industrial PLC memory expansion requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.
Supply support for 71V65803S133BGGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S133BGGI8 belongs to Renesas' ZBT™ SRAM product line, engineered specifically for deterministic, high-throughput memory subsystems in networking equipment, baseband units, and real-time control systems demanding zero bus turnaround and burst efficiency.
FAQ
What is the memory organization and density of the 71V65803S133BGGI8?
The 71V65803S133BGGI8 is configured as 256K × 36-bit, delivering 9,437,184 bits (9 Mbit) of synchronous SRAM. It also supports a 512K × 18-bit organization via pin configuration. This dual-mode flexibility allows system designers to optimize data bus width and address decoding without changing the physical device, making the 71V65803S133BGGI8 adaptable to varying controller interface requirements.
Does the 71V65803S133BGGI8 support burst read and write operations?
Yes, the 71V65803S133BGGI8 supports 4-word burst operations in both linear and interleaved sequences, selected by the LBO pin. Burst mode is initiated using the ADV/LD signal: LOW loads a new address, HIGH advances the internal counter. Each burst cycle delivers four consecutive words with single address setup, reducing bus overhead and improving effective bandwidth - a core feature confirmed in the functional block diagram and timing tables for the 71V65803S133BGGI8.
What is the role of the ZZ pin on the 71V65803S133BGGI8?
The ZZ pin on the 71V65803S133BGGI8 is an asynchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device in its lowest power-consumption state while guaranteeing data retention. This feature is essential for power-sensitive applications such as remote radio units or battery-backed industrial controllers, where the 71V65803S133BGGI8 can enter and exit sleep mode without external reset or reinitialization.
How does the ZBTTM feature improve system performance in the 71V65803S133BGGI8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S133BGGI8 eliminates idle cycles between consecutive read and write operations by synchronizing output buffer enable internally. Unlike conventional SRAMs requiring OE control and bus turnaround delays, the 71V65803S133BGGI8 permits immediate read-after-write or write-after-read transitions - sustaining full 133 MHz bus utilization in high-throughput packet buffering and real-time control applications.
What package type and pin count does the 71V65803S133BGGI8 use?
The 71V65803S133BGGI8 uses a 119-ball fine-pitch ball grid array (BGG119) package, JEDEC-compliant with 0.8 mm pitch and 12 mm × 12 mm body size. The "BGGI8" suffix explicitly denotes this industrial-grade BGA variant. Pin assignments follow the 256K × 36 configuration, including dedicated I/O banks (I/O0–I/O31, I/OP1–I/OP4), three chip enables, and burst control signals (ADV/LD, LBO), all verified in the official Renesas pin configuration diagrams.
71V65803S133BGGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65803S133BGGI8 FAQ
1.How can I place an order for 71V65803S133BGGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S133BGGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S133BGGI8 reliable?
The price and inventory of 71V65803S133BGGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BGGI8 is usually 5 days.
3.What payment methods are accepted for 71V65803S133BGGI8?
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4.How is shipping managed for 71V65803S133BGGI8?
71V65803S133BGGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S133BGGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S133BGGI8?
For technical support, including 71V65803S133BGGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S133BGGI8 requirements.
6.How does Aetrix verify that 71V65803S133BGGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65803S133BGGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BGGI8 meets industry standards.
7.What is the process for return or replacement of 71V65803S133BGGI8?
All 71V65803S133BGGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BGGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S133BGGI8 part is unused and in its original packaging.
Return procedure for 71V65803S133BGGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S133BGGI8 Tags

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