Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V65803S133BGGI8

Part No.:
71V65803S133BGGI8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65803S133BGGI8.pdf
Description:
IC SRAM 9MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,428

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V65803S133BGGI8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 133 MHz clock speed (7.5 ns cycle time), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst modes, individual byte write control (BW1–BW4), and operates across –40°C to +85°C for industrial applications in high-speed networking and packet buffering.

For engineers reviewing the 71V65803S133BGGI8 datasheet, 71V65803S133BGGI8 pinout, 71V65803S133BGGI8 application, or 71V65803S133BGGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP/BGA package compatibility, 3.3V I/O supply (VDDQ), synchronous burst counter behavior, and industrial temperature support - all critical for deterministic memory subsystem design in telecom infrastructure and real-time data path systems.

Technical Context

The 71V65803S133BGGI8 implements a fully synchronous, clock-edge-triggered interface with address/control/data registers aligned to the rising CLK edge. Its ZBT™ architecture eliminates dead cycles between read/write transitions via internally synchronized output buffer enable and pipelined output registers, enabling continuous bus utilization.

It features a 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved sequences. Three chip enables (CE1, CE2, CE2) provide flexible depth expansion, while ZZ enables asynchronous sleep mode for power reduction without data loss.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9,437,184 bits); supports 512K × 18-bit configuration via pin strapping
Max Clock Frequency133 MHz (7.5 ns cycle time); enables deterministic 2-cycle latency for read/write operations
ZBT™ ArchitectureZero Bus Turnaround: no dead cycles between consecutive reads/writes; sustains full bus bandwidth
Burst Capability4-word burst (interleaved or linear); reduces address overhead and improves throughput in sequential access
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies isolate noise-sensitive I/O paths
Operating Temperature–40°C to +85°C (industrial grade); validated for sustained operation in base station and router environments
Package119-ball BGA (BGG119); JEDEC-compliant footprint with 0.8 mm pitch for high-density PCB layout

Pinout & Package

71V65803S133BGGI8 is packaged in a 119-ball fine-pitch ball grid array (BGG119), JEDEC standard, with 0.8 mm pitch and 12 mm × 12 mm body size. Pin functions are defined per the 256K × 36 configuration.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLKClock InputRising-edge-triggered master clock; all synchronous timing referenced to this signal
R/WRead/Write ControlSynchronous command: HIGH = read, LOW = write; determines data direction two cycles later
ADV/LDBurst Counter ControlLOW = load external address; HIGH = increment internal burst counter; defines burst sequence initiation
LBOBurst Order SelectStatic input: LOW = linear burst (0,1,2,3), HIGH = interleaved burst (0,2,1,3)
BW1–BW4Byte Write EnablesActive-low synchronous controls for 9-bit bytes; enables partial-word writes without masking logic
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high); allow multi-chip depth expansion
ZZSleep Mode InputAsynchronous HIGH entry into low-power sleep; clocks gated internally; data retention guaranteed
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional synchronous data bus; registered inputs/outputs eliminate external latch requirements
VDD, VDDQ, VSSPower/GroundVDD = 3.3 V core supply; VDDQ = 3.3 V I/O supply; separate planes reduce switching noise coupling

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates idle cycles between read/write transitions, enabling 100% bus utilization in burst-intensive traffic
Pipelined OutputsInternally registered outputs remove need for external output latches and simplify timing closure
Individual Byte Write (BW1–BW4)Enables selective 9-bit byte updates without full-word read-modify-write, reducing power and latency
Asynchronous Output Enable (OE)Allows dynamic tri-state control of I/Os independent of clock; simplifies bus sharing in multi-master systems
Three Chip Enables (CE1/CE2/CE2)Supports seamless depth expansion up to 3× without external decode logic or address remapping

Applications

High-Speed Packet BufferingTelecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in network switches and routers before forwarding decisions.

IC Role / Device Role / Timing Role: Primary burst-access SRAM providing deterministic 2-cycle latency and zero-turnaround read/write switching for line-rate packet processing.

Use Value: Sustains 133 MHz bus throughput with no dead cycles, enabling full-duplex frame buffering at OC-192+ speeds.

Use Scenario: Serving as shared memory for DSPs and microcontrollers on telecom line cards handling TDM voice channels and signaling.

IC Role / Device Role / Timing Role: Synchronous dual-port-like interface with pipelined outputs, allowing concurrent CPU and DSP access without arbitration logic.

Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in uncooled chassis; burst mode reduces address bus loading.

Real-Time Data Acquisition BufferIndustrial PLC Memory Expansion

Use Scenario: Capturing high-speed sensor streams (e.g., motor current, vibration) in test equipment or factory automation controllers.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory staging buffer interfacing with FPGA-based acquisition engines.

Use Value: 4-word burst capability matches typical ADC FIFO depth requirements; ZZ sleep mode cuts standby power during idle intervals.

Use Scenario: Expanding local program/data memory for programmable logic controllers executing deterministic ladder logic scans.

IC Role / Device Role / Timing Role: Deterministic SRAM replacing slower parallel flash or DRAM, with synchronous interface compatible with ARM Cortex-M7/M33 MCUs.

Use Value: 3.3V I/O compatibility avoids level-shifting; industrial temp range aligns with DIN-rail enclosure thermal profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133BZI133 MHz, 256K × 36, QDR-II architecture with separate read/write ports; higher power, different timing modelRequires dual-port controller logic; not ZBT™-compatible; used where simultaneous read/write is mandatorySelect only if true dual-port behavior is required; not drop-in for ZBT™-based designs
AS7C3256A-133JCIN133 MHz, 256K × 36, standard sync SRAM (no ZBT™); 10 ns tAA, no burst counter or ADV/LD logicLacks zero turnaround and burst capability; requires external address sequencing logic for burst accessChoose for cost-sensitive legacy designs where ZBT™ timing is unnecessary and full burst support is omitted

Compared with CY7C1362BV33-133BZI and AS7C3256A-133JCIN, the 71V65803S133BGGI8 uniquely delivers ZBT™-optimized bus efficiency and integrated burst addressing - critical for minimizing latency in packet-forwarding pipelines where back-to-back read/write transitions dominate.

Availability

71V65803S133BGGI8 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, real-time data acquisition, and industrial PLC memory expansion requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.

Supply support for 71V65803S133BGGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65803S133BGGI8 belongs to Renesas' ZBT™ SRAM product line, engineered specifically for deterministic, high-throughput memory subsystems in networking equipment, baseband units, and real-time control systems demanding zero bus turnaround and burst efficiency.

FAQ

What is the memory organization and density of the 71V65803S133BGGI8?

The 71V65803S133BGGI8 is configured as 256K × 36-bit, delivering 9,437,184 bits (9 Mbit) of synchronous SRAM. It also supports a 512K × 18-bit organization via pin configuration. This dual-mode flexibility allows system designers to optimize data bus width and address decoding without changing the physical device, making the 71V65803S133BGGI8 adaptable to varying controller interface requirements.

Does the 71V65803S133BGGI8 support burst read and write operations?

Yes, the 71V65803S133BGGI8 supports 4-word burst operations in both linear and interleaved sequences, selected by the LBO pin. Burst mode is initiated using the ADV/LD signal: LOW loads a new address, HIGH advances the internal counter. Each burst cycle delivers four consecutive words with single address setup, reducing bus overhead and improving effective bandwidth - a core feature confirmed in the functional block diagram and timing tables for the 71V65803S133BGGI8.

What is the role of the ZZ pin on the 71V65803S133BGGI8?

The ZZ pin on the 71V65803S133BGGI8 is an asynchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device in its lowest power-consumption state while guaranteeing data retention. This feature is essential for power-sensitive applications such as remote radio units or battery-backed industrial controllers, where the 71V65803S133BGGI8 can enter and exit sleep mode without external reset or reinitialization.

How does the ZBTTM feature improve system performance in the 71V65803S133BGGI8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S133BGGI8 eliminates idle cycles between consecutive read and write operations by synchronizing output buffer enable internally. Unlike conventional SRAMs requiring OE control and bus turnaround delays, the 71V65803S133BGGI8 permits immediate read-after-write or write-after-read transitions - sustaining full 133 MHz bus utilization in high-throughput packet buffering and real-time control applications.

What package type and pin count does the 71V65803S133BGGI8 use?

The 71V65803S133BGGI8 uses a 119-ball fine-pitch ball grid array (BGG119) package, JEDEC-compliant with 0.8 mm pitch and 12 mm × 12 mm body size. The "BGGI8" suffix explicitly denotes this industrial-grade BGA variant. Pin assignments follow the 256K × 36 configuration, including dedicated I/O banks (I/O0–I/O31, I/OP1–I/OP4), three chip enables, and burst control signals (ADV/LD, LBO), all verified in the official Renesas pin configuration diagrams.

71V65803S133BGGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65803S133BGGI8 FAQ

1.How can I place an order for 71V65803S133BGGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S133BGGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S133BGGI8 reliable?

The price and inventory of 71V65803S133BGGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BGGI8 is usually 5 days.

3.What payment methods are accepted for 71V65803S133BGGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S133BGGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65803S133BGGI8?

71V65803S133BGGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S133BGGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S133BGGI8?

For technical support, including 71V65803S133BGGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S133BGGI8 requirements.

6.How does Aetrix verify that 71V65803S133BGGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65803S133BGGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BGGI8 meets industry standards.

7.What is the process for return or replacement of 71V65803S133BGGI8?

All 71V65803S133BGGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BGGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S133BGGI8 part is unused and in its original packaging.

Return procedure for 71V65803S133BGGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65803S133BGGI8 Tags

  • 71V65803S133BGGI8
  • 71V65803S133BGGI8 PDF
  • 71V65803S133BGGI8 Datasheet
  • 71V65803S133BGGI8 Specifications
  • 71V65803S133BGGI8 Images
  • Renesas
  • Renesas 71V65803S133BGGI8
  • Buy 71V65803S133BGGI8
  • 71V65803S133BGGI8 Price
  • 71V65803S133BGGI8 Distributor
  • 71V65803S133BGGI8 Supplier
  • 71V65803S133BGGI8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER