Renesas 71V65803S133BGI8
- Part No.:
- 71V65803S133BGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65803S133BGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65803S133BGI8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 133 MHz clock frequency (7.5 ns cycle time), zero bus turnaround architecture, and pipelined outputs - designed for high-bandwidth memory subsystems in network switches, packet buffers, and real-time DSP systems.
For engineers reviewing the 71V65803S133BGI8 datasheet, 71V65803S133BGI8 pinout, 71V65803S133BGI8 application, or 71V65803S133BGI8 equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and 3.3V I/O voltage tolerance with VDDQ decoupling requirements.
Technical Context
This SRAM implements a fully synchronous, clock-edge-triggered interface with dual-cycle latency: address/control registration on one clock edge and data transfer two cycles later. It integrates an on-chip 4-word burst counter with linear/interleaved sequencing controlled by the LBO pin, and supports individual byte write enables (BW1–BW4) for granular 9-bit writes.
The device uses three chip enables (CE1, CE2, CE2) with mixed polarity for flexible depth expansion, includes asynchronous OE and ZZ inputs for output control and sleep mode, and features internally synchronized output buffer enable - eliminating external OE timing management in pipelined systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant |
| Clock Frequency | 133 MHz (7.5 ns cycle time); enables sustained 532 MB/s burst throughput |
| Access Timing | 3.8 ns clock-to-data access (tCD); guarantees deterministic read latency for real-time pipelines |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); requires separate decoupling for each rail |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for extended thermal cycling in telecom infrastructure |
| Burst Capability | 4-word interleaved or linear burst; reduces address bus traffic by 75% per burst sequence |
| Zero Bus Turnaround | No dead cycles between read/write transitions; eliminates bus arbitration overhead in full-duplex memory controllers |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with 0.5 mm pitch and exposed thermal pad (GND-connected). Compatible with standard reflow profiles and automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference for all synchronous registers; no internal buffering - requires low-jitter source |
| A0–A17 | Address inputs | 18-bit row/column address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| R/W | Read/write control | Synchronous signal defining operation type for current load cycle; determines direction of next data transfer (2 cycles later) |
| ADV/LD | Address advance/load | Controls burst counter: LOW loads new external address; HIGH increments internal counter for burst continuation |
| LBO | Burst order select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence; must remain stable during operation |
| BW1–BW4 | Byte write enables | Four active-low signals enabling independent 9-bit writes to I/O[0:31] + I/OP[1:4]; all may be tied LOW for full-word writes |
| CE1, CE2, CE2 | Chip enables | Three enables with mixed polarity (CE1/CE2 active LOW, CE2 active HIGH); any false condition initiates 2-cycle deselect |
| ZZ | Sleep mode input | Asynchronous gate disabling internal clock tree; reduces standby power to <100 µA while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus with registered input/output paths; all data transfers occur two clocks after control assertion |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between consecutive reads/writes - enables continuous 133 MHz bus utilization without turnaround penalties |
| Internally synchronized OE | Removes need for precise OE timing control; outputs automatically tri-state on chip disable or write initiation |
| 4-word burst counter | Reduces external address generation burden; supports both linear and interleaved sequences for cache-line alignment |
| Individual byte write (BW1–BW4) | Enables partial 36-bit word updates without read-modify-write - critical for packet header manipulation in networking ASICs |
| Three chip enables with mixed polarity | Allows seamless depth expansion across multiple devices using shared address/control buses and independent chip selection logic |
Applications
| Network Packet Buffering | DSP Data Cache |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches with line-rate forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with ZBT™-enabled back-to-back read/write bursts. Use Value: Achieves 532 MB/s sustained bandwidth at 133 MHz, eliminating bus stalls during header rewrite and payload forwarding operations. | Use Scenario: Serving as scratchpad memory for real-time digital signal processors executing FFTs, FIR filters, and modulation algorithms. IC Role / Device Role / Timing Role: Synchronous pipelined memory providing deterministic 3.8 ns clock-to-data access for coefficient and sample storage. Use Value: Enables dual-issue instruction execution with zero-wait-state memory access, reducing total algorithm latency by up to 30% vs. asynchronous SRAM. |
| Telecom Line Card Control | Industrial PLC Data Logging |
Use Scenario: Buffering configuration tables, status registers, and protocol stack state in carrier-grade SDH/SONET line cards. IC Role / Device Role / Timing Role: Industrial-temperature SRAM interfacing directly with FPGA-based control logic via 3.3V LVTTL I/O. Use Value: Guaranteed operation from –40°C to +85°C with 3.3V ±5% supply tolerance ensures reliability in uncontrolled cabinet environments. | Use Scenario: Capturing sensor timestamps and process variables in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Burst-capable memory storing sequential 36-bit data records with minimal CPU intervention via ADV/LD-controlled auto-increment. Use Value: Reduces firmware overhead by 75% through 4-word burst writes - enabling 10 kHz logging rates on resource-constrained microcontrollers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | Same 256K × 36 organization, 133 MHz, TQFP-100, but uses QDR-II+ architecture with separate read/write ports | Requires different controller logic for dual-port operation; not ZBT™-compatible in burst sequencing or timing model | Select only if migrating to QDR-II+ interface and redesigning memory controller for true concurrent R/W |
| AS7C3256A-133JCIN | 256K × 36, 133 MHz, but asynchronous SRAM with no burst counter, no ZBT™, and no pipelined outputs | Lacks zero-turnaround and burst capability - imposes 2–3 cycle gaps between accesses and requires external address generation | Choose only for legacy designs where synchronous timing constraints are absent and cost is primary driver |
Compared with CY7C1362BV33-133BZI and AS7C3256A-133JCIN, the 71V65803S133BGI8 delivers deterministic ZBT™ timing, integrated burst sequencing, and industrial-grade reliability - making it optimal for high-throughput, low-latency memory subsystems where bus efficiency and thermal robustness are critical.
Availability
71V65803S133BGI8 is available at Aetrix Electronics and suitable for network packet buffering, DSP data caching, telecom line card control, and industrial PLC data logging requiring stable component supply across extended product lifecycles.
Supply support for 71V65803S133BGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65xx family was engineered specifically for high-speed, low-latency memory subsystems in communications equipment - emphasizing ZBT™ timing compliance, industrial temperature resilience, and pin-compatible scalability across density variants.
FAQ
What is the maximum operating frequency and corresponding cycle time for the 71V65803S133BGI8?
The 71V65803S133BGI8 is rated for 133 MHz operation, corresponding to a 7.5 ns clock cycle time. Its clock-to-data access time is specified at 3.8 ns, and all timing parameters - including setup/hold for address, control, and data - are guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. This ensures reliable operation in high-speed packet processing and real-time control applications.
Does the 71V65803S133BGI8 support both 256K × 36 and 512K × 18 configurations?
Yes, the 71V65803S133BGI8 is the 256K × 36 variant of the IDT71V65603/5803 family. The same die supports both configurations via pin strapping and internal decoding - the 71V65803S133BGI8 is configured for 256K × 36 (A0–A17 address lines, 36-bit I/O bus), while the 71V65603S133BGI8 implements 512K × 18. Both share identical timing, packaging, and ZBT™ functionality.
How does the ZBTTM feature eliminate dead cycles in the 71V65803S133BGI8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S133BGI8 allows immediate transition from a write to a read (or vice versa) without inserting idle cycles. This is achieved through internal pipeline staging and simultaneous bus direction control - the device internally manages bus release and acquisition, enabling back-to-back transactions at full 133 MHz clock rate. No external bus turnaround logic is required.
What are the voltage requirements for VDD and VDDQ on the 71V65803S133BGI8?
The 71V65803S133BGI8 requires VDD = 3.3 V ±5% (3.135 V to 3.465 V) for core logic and VDDQ = 3.3 V ±5% for I/O drivers. These rails must be independently decoupled. VDDQ may be ramped before, after, or simultaneously with VDD - no strict power sequencing is mandated, but no I/O pin voltage may exceed VDDQ during power-up.
Can the 71V65803S133BGI8 operate in low-power mode, and how is it controlled?
Yes, the 71V65803S133BGI8 supports low-power sleep mode via the asynchronous ZZ input. When ZZ is driven HIGH, the internal clock tree is gated, reducing ICC to <100 µA while maintaining full data retention. The device exits sleep mode synchronously on the next valid CLK edge after ZZ returns LOW, with no reset or initialization sequence required.
71V65803S133BGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65803S133BGI8 FAQ
1.How can I place an order for 71V65803S133BGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S133BGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S133BGI8 reliable?
The price and inventory of 71V65803S133BGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BGI8 is usually 5 days.
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71V65803S133BGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S133BGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S133BGI8?
For technical support, including 71V65803S133BGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S133BGI8 requirements.
6.How does Aetrix verify that 71V65803S133BGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65803S133BGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BGI8 meets industry standards.
7.What is the process for return or replacement of 71V65803S133BGI8?
All 71V65803S133BGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S133BGI8 part is unused and in its original packaging.
Return procedure for 71V65803S133BGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S133BGI8 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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