Renesas 71V65803S133BQI
- Part No.:
- 71V65803S133BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65803S133BQI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,696
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Product details
Overview
71V65803S133BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, supporting 133 MHz operation (7.5 ns clock cycle), zero bus turnaround (ZBT) architecture, and pipelined outputs. It features 4-word burst capability (linear or interleaved), individual byte write control (BW1–BW4), and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking buffers and packet-switching ASIC/FPGA interfaces.
For engineers reviewing the 71V65803S133BQI datasheet, 71V65803S133BQI pinout, 71V65803S133BQI application, or 71V65803S133BQI equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst counter behavior under ADV/LD control, and industrial-grade thermal performance.
Technical Context
The 71V65803S133BQI implements a fully synchronous, clock-edge-triggered architecture where address, control, and data are registered on the rising edge of CLK. All operations-including load, burst, deselect, and suspend-are governed by precise timing relative to CLK, with data valid two cycles after address/control registration.
ZBT functionality eliminates dead cycles between read/write transitions via internal synchronization of output enable and burst counter logic. The device uses a static LBO input to select linear or interleaved burst order, and supports depth expansion using three chip enables (CE1, CE2, CE2) with dual-polarity logic (CE2 active-high).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit mode via pin configuration |
| Max Clock Frequency | 133 MHz (7.5 ns cycle time); enables real-time packet buffering in 10G Ethernet line cards |
| Access Timing | 3.8 ns clock-to-data (tCD) at 150 MHz; 71V65803S133BQI guarantees ≤7.5 ns tCD at 133 MHz |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for base station and industrial control environments |
| Burst Capability | 4-word burst (linear/interleaved); reduces address bus traffic by 75% per burst sequence |
| Power Management | Asynchronous ZZ sleep mode; gates internal clock and reduces ICC to <100 µA while retaining data |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous registers align to this edge |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines whether data bus transfers read data or accepts write data two cycles later |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or increments internal burst counter (HIGH); defines burst initiation and sequencing |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) burst addressing; must remain stable during burst operation |
| CE1, CE2, CE2 | Chip Enable Inputs | Three-signal enable group with mixed polarity (CE2 active-high); enables depth expansion without external logic |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals controlling 9-bit byte writes; allows partial-word updates without read-modify-write |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements |
| ZZ | Asynchronous Sleep Mode | Gates internal clock and reduces power; retains memory contents with no external refresh required |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between consecutive reads/writes-enables continuous 133 MHz throughput without inter-cycle gaps |
| Pipelined Outputs | Internally synchronized OE eliminates need for external OE timing control; simplifies system-level timing closure |
| 4-Word Burst Mode | Single address initiates four sequential data transfers; reduces address bus bandwidth demand by 75% in streaming applications |
| Individual Byte Write | Independent BW1–BW4 control enables 9-bit granularity writes-avoids full-word overwrites in protocol header manipulation |
| Three Chip Enables | CE1 (active-low), CE2 (active-low), CE2 (active-high) support flexible depth expansion with minimal glue logic |
Applications
| High-Speed Network Buffer | FPGA-Based Protocol Accelerator |
|---|---|
Use Scenario: Line-rate packet buffering in 10G Ethernet switch fabric ASICs requiring low-latency, deterministic access. IC Role / Device Role / Timing Role: Primary data buffer interfacing directly with SerDes MAC controllers; provides ZBT-aligned read/write handshaking. Use Value: 133 MHz operation and zero-turnaround timing enable sustained 4.8 Gbps (36-bit × 133 MHz) throughput without pipeline stalls. | Use Scenario: Header parsing and modification engine in FPGA-based telecom gateways handling SIP/RTP streams. IC Role / Device Role / Timing Role: Off-chip scratchpad memory for FPGA soft-core processors performing real-time packet inspection. Use Value: Individual byte write (BW1–BW4) allows selective update of 8-bit protocol fields without corrupting adjacent payload bytes. |
| Industrial PLC Data Logger | Avionics Sensor Aggregation Module |
Use Scenario: Cyclic data capture from analog I/O modules in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability buffer storing timestamped sensor samples prior to CAN FD transmission. Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure data retention during brownout events. | Use Scenario: Multi-sensor fusion unit in flight control systems aggregating inertial, pressure, and temperature telemetry. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic latency for safety-critical sensor data staging before ARINC 429 encoding. Use Value: Pipelined outputs and clock-enable (CEN) support precise timing alignment with avionics master clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36-bit, 133 MHz, 3.3V; Cypress QDR-II architecture with separate read/write ports | Supports concurrent read/write; higher pin count (165 fBGA) and different burst control logic | Choose for true simultaneous access; avoid if ZBT timing or TQFP-100 footprint is mandatory |
| AS7C33256PFSI-133 | 256K × 36-bit, 133 MHz, 3.3V; Alliance Memory ZBT SRAM with identical pinout and timing | Drop-in replacement with same TQFP-100 package, identical AC/DC specs, and ZBT behavior | Preferred for second-source continuity; verified compatible in existing 71V65803S133BQI layouts |
Compared with CY7C1362BV33-133AXC and AS7C33256PFSI-133, the 71V65803S133BQI delivers identical ZBT timing and TQFP-100 mechanical compatibility, while AS7C33256PFSI-133 offers seamless drop-in substitution, and CY7C1362BV33-133AXC provides concurrent access at the cost of layout redesign.
Availability
71V65803S133BQI is available at Aetrix Electronics and suitable for high-speed network buffers, FPGA-based protocol accelerators, and industrial PLC data loggers requiring stable component supply, long-term lifecycle support, and industrial temperature compliance.
Supply support for 71V65803S133BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S133BQI belongs to Renesas' high-performance ZBT SRAM product line, engineered for deterministic, low-latency data buffering in wireline communications, test equipment, and real-time control systems.
FAQ
What is the maximum operating frequency of the 71V65803S133BQI?
The 71V65803S133BQI is rated for 133 MHz operation (7.5 ns clock cycle) across the full industrial temperature range (–40°C to +85°C). Its clock-to-data access time is guaranteed ≤7.5 ns at this frequency, enabling reliable use in 10G Ethernet and high-speed FPGA interfaces without derating.
Does the 71V65803S133BQI support both 256K × 36 and 512K × 18 configurations?
Yes, the 71V65803S133BQI supports both configurations via pin strapping and address mapping. In 256K × 36 mode, it uses A0–A17 (18 address bits); in 512K × 18 mode, it uses A0–A18 (19 address bits) and reconfigures I/O pins accordingly. The device datasheet specifies distinct pinouts and timing for each mode.
How does the ZBT™ feature eliminate dead cycles in the 71V65803S133BQI?
The ZBT™ feature in the 71V65803S133BQI removes bus turnaround latency by internally synchronizing output enable and burst counter logic. When transitioning between read and write cycles-or vice versa-the device avoids tri-state delays, allowing back-to-back accesses at full 133 MHz without idle clock cycles.
What is the function of the ADV/LD and LBO pins on the 71V65803S133BQI?
ADV/LD controls burst initiation: LOW loads a new external address; HIGH advances the internal burst counter. LBO selects burst order: LOW enables linear addressing (0,1,2,3); HIGH enables interleaved (0,2,1,3). Both are synchronous inputs critical for deterministic burst sequencing in streaming applications.
Can the 71V65803S133BQI operate with only two chip enables?
Yes-the 71V65803S133BQI requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH for selection. CE2 is active-high, while CE1 and CE2 are active-low. All three must be asserted simultaneously; omitting any one prevents memory access. This triple-enable scheme enables robust depth expansion in multi-SRAM systems.
71V65803S133BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65803S133BQI FAQ
1.How can I place an order for 71V65803S133BQI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S133BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V65803S133BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BQI is usually 5 days.
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6.How does Aetrix verify that 71V65803S133BQI is sourced from the original manufacturer or authorized distributors?
All 71V65803S133BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BQI meets industry standards.
7.What is the process for return or replacement of 71V65803S133BQI?
All 71V65803S133BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S133BQI part is unused and in its original packaging.
Return procedure for 71V65803S133BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S133BQI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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