Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V65803S133BQI

Part No.:
71V65803S133BQI
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65803S133BQI.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,696

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V65803S133BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, supporting 133 MHz operation (7.5 ns clock cycle), zero bus turnaround (ZBT) architecture, and pipelined outputs. It features 4-word burst capability (linear or interleaved), individual byte write control (BW1–BW4), and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking buffers and packet-switching ASIC/FPGA interfaces.

For engineers reviewing the 71V65803S133BQI datasheet, 71V65803S133BQI pinout, 71V65803S133BQI application, or 71V65803S133BQI equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst counter behavior under ADV/LD control, and industrial-grade thermal performance.

Technical Context

The 71V65803S133BQI implements a fully synchronous, clock-edge-triggered architecture where address, control, and data are registered on the rising edge of CLK. All operations-including load, burst, deselect, and suspend-are governed by precise timing relative to CLK, with data valid two cycles after address/control registration.

ZBT functionality eliminates dead cycles between read/write transitions via internal synchronization of output enable and burst counter logic. The device uses a static LBO input to select linear or interleaved burst order, and supports depth expansion using three chip enables (CE1, CE2, CE2) with dual-polarity logic (CE2 active-high).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.4 Mbit); supports 512K × 18-bit mode via pin configuration
Max Clock Frequency133 MHz (7.5 ns cycle time); enables real-time packet buffering in 10G Ethernet line cards
Access Timing3.8 ns clock-to-data (tCD) at 150 MHz; 71V65803S133BQI guarantees ≤7.5 ns tCD at 133 MHz
Supply VoltagesVDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Operating Temperature–40°C to +85°C (industrial grade); validated for base station and industrial control environments
Burst Capability4-word burst (linear/interleaved); reduces address bus traffic by 75% per burst sequence
Power ManagementAsynchronous ZZ sleep mode; gates internal clock and reduces ICC to <100 µA while retaining data

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLKSystem Clock InputRising-edge-triggered master timing reference; all synchronous registers align to this edge
R/WRead/Write ControlSynchronous signal defining cycle type; determines whether data bus transfers read data or accepts write data two cycles later
ADV/LDBurst Counter ControlLoads new external address (LOW) or increments internal burst counter (HIGH); defines burst initiation and sequencing
LBOBurst Order SelectStatic input selecting linear (LOW) or interleaved (HIGH) burst addressing; must remain stable during burst operation
CE1, CE2, CE2Chip Enable InputsThree-signal enable group with mixed polarity (CE2 active-high); enables depth expansion without external logic
BW1–BW4Byte Write EnablesFour independent active-low signals controlling 9-bit byte writes; allows partial-word updates without read-modify-write
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements
ZZAsynchronous Sleep ModeGates internal clock and reduces power; retains memory contents with no external refresh required

Key Features

FeatureDesign Value
ZBT™ ArchitectureEliminates bus turnaround dead cycles between consecutive reads/writes-enables continuous 133 MHz throughput without inter-cycle gaps
Pipelined OutputsInternally synchronized OE eliminates need for external OE timing control; simplifies system-level timing closure
4-Word Burst ModeSingle address initiates four sequential data transfers; reduces address bus bandwidth demand by 75% in streaming applications
Individual Byte WriteIndependent BW1–BW4 control enables 9-bit granularity writes-avoids full-word overwrites in protocol header manipulation
Three Chip EnablesCE1 (active-low), CE2 (active-low), CE2 (active-high) support flexible depth expansion with minimal glue logic

Applications

High-Speed Network BufferFPGA-Based Protocol Accelerator

Use Scenario: Line-rate packet buffering in 10G Ethernet switch fabric ASICs requiring low-latency, deterministic access.

IC Role / Device Role / Timing Role: Primary data buffer interfacing directly with SerDes MAC controllers; provides ZBT-aligned read/write handshaking.

Use Value: 133 MHz operation and zero-turnaround timing enable sustained 4.8 Gbps (36-bit × 133 MHz) throughput without pipeline stalls.

Use Scenario: Header parsing and modification engine in FPGA-based telecom gateways handling SIP/RTP streams.

IC Role / Device Role / Timing Role: Off-chip scratchpad memory for FPGA soft-core processors performing real-time packet inspection.

Use Value: Individual byte write (BW1–BW4) allows selective update of 8-bit protocol fields without corrupting adjacent payload bytes.

Industrial PLC Data LoggerAvionics Sensor Aggregation Module

Use Scenario: Cyclic data capture from analog I/O modules in ruggedized programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability buffer storing timestamped sensor samples prior to CAN FD transmission.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure data retention during brownout events.

Use Scenario: Multi-sensor fusion unit in flight control systems aggregating inertial, pressure, and temperature telemetry.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic latency for safety-critical sensor data staging before ARINC 429 encoding.

Use Value: Pipelined outputs and clock-enable (CEN) support precise timing alignment with avionics master clock domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXC256K × 36-bit, 133 MHz, 3.3V; Cypress QDR-II architecture with separate read/write portsSupports concurrent read/write; higher pin count (165 fBGA) and different burst control logicChoose for true simultaneous access; avoid if ZBT timing or TQFP-100 footprint is mandatory
AS7C33256PFSI-133256K × 36-bit, 133 MHz, 3.3V; Alliance Memory ZBT SRAM with identical pinout and timingDrop-in replacement with same TQFP-100 package, identical AC/DC specs, and ZBT behaviorPreferred for second-source continuity; verified compatible in existing 71V65803S133BQI layouts

Compared with CY7C1362BV33-133AXC and AS7C33256PFSI-133, the 71V65803S133BQI delivers identical ZBT timing and TQFP-100 mechanical compatibility, while AS7C33256PFSI-133 offers seamless drop-in substitution, and CY7C1362BV33-133AXC provides concurrent access at the cost of layout redesign.

Availability

71V65803S133BQI is available at Aetrix Electronics and suitable for high-speed network buffers, FPGA-based protocol accelerators, and industrial PLC data loggers requiring stable component supply, long-term lifecycle support, and industrial temperature compliance.

Supply support for 71V65803S133BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65803S133BQI belongs to Renesas' high-performance ZBT SRAM product line, engineered for deterministic, low-latency data buffering in wireline communications, test equipment, and real-time control systems.

FAQ

What is the maximum operating frequency of the 71V65803S133BQI?

The 71V65803S133BQI is rated for 133 MHz operation (7.5 ns clock cycle) across the full industrial temperature range (–40°C to +85°C). Its clock-to-data access time is guaranteed ≤7.5 ns at this frequency, enabling reliable use in 10G Ethernet and high-speed FPGA interfaces without derating.

Does the 71V65803S133BQI support both 256K × 36 and 512K × 18 configurations?

Yes, the 71V65803S133BQI supports both configurations via pin strapping and address mapping. In 256K × 36 mode, it uses A0–A17 (18 address bits); in 512K × 18 mode, it uses A0–A18 (19 address bits) and reconfigures I/O pins accordingly. The device datasheet specifies distinct pinouts and timing for each mode.

How does the ZBT™ feature eliminate dead cycles in the 71V65803S133BQI?

The ZBT™ feature in the 71V65803S133BQI removes bus turnaround latency by internally synchronizing output enable and burst counter logic. When transitioning between read and write cycles-or vice versa-the device avoids tri-state delays, allowing back-to-back accesses at full 133 MHz without idle clock cycles.

What is the function of the ADV/LD and LBO pins on the 71V65803S133BQI?

ADV/LD controls burst initiation: LOW loads a new external address; HIGH advances the internal burst counter. LBO selects burst order: LOW enables linear addressing (0,1,2,3); HIGH enables interleaved (0,2,1,3). Both are synchronous inputs critical for deterministic burst sequencing in streaming applications.

Can the 71V65803S133BQI operate with only two chip enables?

Yes-the 71V65803S133BQI requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH for selection. CE2 is active-high, while CE1 and CE2 are active-low. All three must be asserted simultaneously; omitting any one prevents memory access. This triple-enable scheme enables robust depth expansion in multi-SRAM systems.

71V65803S133BQI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65803S133BQI FAQ

1.How can I place an order for 71V65803S133BQI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S133BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S133BQI reliable?

The price and inventory of 71V65803S133BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BQI is usually 5 days.

3.What payment methods are accepted for 71V65803S133BQI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S133BQI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65803S133BQI?

71V65803S133BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S133BQI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S133BQI?

For technical support, including 71V65803S133BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S133BQI requirements.

6.How does Aetrix verify that 71V65803S133BQI is sourced from the original manufacturer or authorized distributors?

All 71V65803S133BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BQI meets industry standards.

7.What is the process for return or replacement of 71V65803S133BQI?

All 71V65803S133BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BQI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S133BQI part is unused and in its original packaging.

Return procedure for 71V65803S133BQI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65803S133BQI Tags

  • 71V65803S133BQI
  • 71V65803S133BQI PDF
  • 71V65803S133BQI Datasheet
  • 71V65803S133BQI Specifications
  • 71V65803S133BQI Images
  • Renesas
  • Renesas 71V65803S133BQI
  • Buy 71V65803S133BQI
  • 71V65803S133BQI Price
  • 71V65803S133BQI Distributor
  • 71V65803S133BQI Supplier
  • 71V65803S133BQI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER