Renesas 71V65803S133BQI8
- Part No.:
- 71V65803S133BQI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65803S133BQI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65803S133BQI8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, supporting 133 MHz operation (7.5 ns clock cycle), zero bus turnaround (ZBT) architecture, pipelined outputs, and 4-word burst capability. It features individual byte write control (BW1–BW4), three chip enables for depth expansion, and operates across industrial temperature (–40°C to +85°C).
For engineers reviewing the 71V65803S133BQI8 datasheet, 71V65803S133BQI8 pinout, 71V65803S133BQI8 application, or 71V65803S133BQI8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst mode sequencing (linear/interleaved via LBO), and industrial-grade thermal performance.
Technical Context
The 71V65803S133BQI8 implements a fully synchronous, clock-edge-triggered interface with address/control/data registers aligned to the rising edge of CLK. Its ZBT architecture eliminates dead cycles between read and write operations by enabling immediate bus direction reversal after completion of the current data transfer.
It integrates an on-chip burst counter controlled by ADV/LD and LBO, supporting both linear and interleaved 4-word burst sequences. Output enable (OE) remains asynchronous while all other inputs-including R/W, CEN, CE1/CE2/CE2, BWx, and ZZ-are synchronized to CLK, ensuring deterministic timing in high-speed pipelined systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports full 36-bit word or individual byte writes via BW1–BW4 |
| Maximum Clock Frequency | 133 MHz (7.5 ns cycle time); enables high-throughput memory access in telecom and networking datapaths |
| Access Timing | 3.8 ns clock-to-data (tCD) at 150 MHz; 71V65803S133BQI8 rated for 133 MHz with guaranteed tCD ≤ 7.5 ns |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for sustained operation in base station and industrial control environments |
| ZBT Architecture | Zero Bus Turnaround eliminates idle cycles between read/write transitions; improves bus utilization in burst-intensive applications |
| Burst Capability | 4-word burst (linear or interleaved); reduces address overhead and increases effective bandwidth in sequential access patterns |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout conforms to PKG100 configuration for 256K × 36 variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous inputs referenced to this edge; OE is the only asynchronous signal |
| R/W | Read/Write Control | Synchronous command input; determines cycle type (read/write) two clocks after address load |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or increments internal burst counter (HIGH); defines burst initiation and sequencing |
| LBO | Burst Order Selection | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three synchronous enables (CE1/CE2 active LOW, CE2 active HIGH); support flexible depth expansion and partial deselect |
| ZZ | Asynchronous Sleep Mode | Gates internal clock and reduces power consumption while retaining data; no clock required during sleep |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; registered inputs/outputs eliminate external latch requirements |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between reads and writes-enables continuous data flow in packet buffering and switching applications |
| Pipelined Outputs | Internally synchronized output buffer enable removes need for external OE timing control; simplifies system-level timing closure |
| 4-Word Burst Mode | Single address initiates four consecutive data transfers; reduces address bus traffic and improves effective bandwidth in cache-line fetches |
| Individual Byte Write | Independent BW1–BW4 control allows precise 9-bit byte updates without disturbing adjacent data-critical for protocol header manipulation |
| Industrial Temperature Range | Validated operation from –40°C to +85°C ensures reliability in outdoor telecom infrastructure and factory automation systems |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate throughput requirements. IC Role / Device Role / Timing Role: Primary data buffer with ZBT-enabled seamless read/write alternation during header inspection and forwarding decisions. Use Value: Eliminates bus idle cycles between packet write (ingress) and read (egress), increasing effective memory bandwidth by up to 25% vs. standard SSRAMs. | Use Scenario: Serving as context memory for lookup tables and queue management in multi-port switch ASICs. IC Role / Device Role / Timing Role: Synchronous, low-latency storage for forwarding database entries accessed via burst-mode address sequences. Use Value: 4-word burst capability matches typical CAM result widths, reducing address bus cycles and improving fabric arbitration efficiency. |
| Base Station Baseband Processing | Industrial PLC Data Logging |
Use Scenario: Temporary storage of FFT coefficients, channel estimates, and symbol buffers in LTE/NR baseband subsystems. IC Role / Device Role / Timing Role: High-speed scratchpad memory interfaced directly to DSP or FPGA fabric with deterministic 133 MHz timing. Use Value: Pipelined outputs and clock-enable (CEN) support precise synchronization with baseband clock domains and power-gating during idle frames. | Use Scenario: Reliable short-term event logging and real-time I/O state capture in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing non-volatile-equivalent data retention during microsecond-scale power interruptions. Use Value: ZZ sleep mode maintains data integrity at <100 µA while preserving fast wake-up (<100 ns), enabling robust logging during brownouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZXI | Same 256K × 36 organization, 133 MHz, TQFP-100; Cypress (Infineon) part with identical ZBT timing but different burst order control (no LBO pin-fixed linear only) | Lacks LBO-selectable interleaved burst; requires redesign of burst-address generation logic if interleaved mode is used | Select when linear-burst-only operation suffices and cross-qualification with Infineon's qualification flow is preferred |
| AS7C3256P-133JCIN | 256K × 36, 133 MHz, but non-ZBT architecture; uses conventional asynchronous OE and no burst counter; TQFP-100 compatible pinout | No zero bus turnaround-introduces 1-cycle dead time between read/write; lacks ADV/LD and burst control logic | Choose only for legacy designs where ZBT is not required and timing margin allows insertion of dead cycles |
Compared with CY7C1362BV33-133BZXI and AS7C3256P-133JCIN, the 71V65803S133BQI8 uniquely delivers selectable linear/interleaved burst modes and true ZBT operation-critical for maximizing bus efficiency in high-frequency packet processing and baseband applications where every clock cycle impacts throughput.
Availability
71V65803S133BQI8 is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and industrial PLC data logging requiring stable component supply, long-term lifecycle support, and industrial temperature assurance.
Supply support for 71V65803S133BQI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65803S133BQI8 belongs to Renesas' high-performance ZBT SRAM product line, engineered specifically for zero-latency memory interfaces in telecom infrastructure, networking equipment, and real-time industrial control systems.
FAQ
What is the memory organization and total capacity of the 71V65803S133BQI8?
The 71V65803S133BQI8 is configured as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This organization supports full 36-bit word access or granular 9-bit byte writes using BW1–BW4 enables. The device does not support the 512K × 18 configuration-only the 256K × 36 variant is implemented in the 71V65803S133BQI8 part number.
Does the 71V65803S133BQI8 support both linear and interleaved burst modes?
Yes, the 71V65803S133BQI8 supports both linear and interleaved 4-word burst sequences via the LBO (Linear Burst Order) pin. When LBO = LOW, the burst follows linear order (A0, A1, A2, A3); when LBO = HIGH, it follows interleaved order (A0, A2, A1, A3). This dual-mode capability is confirmed in the functional timing diagrams and burst sequence tables of the official Renesas datasheet.
What is the role of the ZZ pin on the 71V65803S133BQI8, and how does it affect power consumption?
The ZZ pin on the 71V65803S133BQI8 is an asynchronous sleep mode input. When asserted HIGH, ZZ gates the internal clock and places the device in its lowest-power state while maintaining full data retention. In sleep mode, core and I/O power draw drops significantly-typical standby current is under 100 µA-making the 71V65803S133BQI8 suitable for power-sensitive industrial and telecom applications requiring rapid wake-up (<100 ns).
How many chip enable signals does the 71V65803S133BQI8 have, and what are their polarities?
The 71V65803S133BQI8 has three chip enable signals: CE1 and CE2 are active LOW, while CE2 is active HIGH. All three must be asserted simultaneously (CE1 = LOW, CE2 = LOW, CE2 = HIGH) to select the device. This triple-CE architecture enables flexible depth expansion and hierarchical memory decoding without external logic, and is explicitly defined in the pin description table and truth tables of the Renesas datasheet.
Is the 71V65803S133BQI8 pin-compatible with other members of the 71V65603/71V65803 family?
No-the 71V65803S133BQI8 is not pin-compatible with the 71V65603 series or other speed grades within the same family. While sharing the same PKG100 footprint and core signal set, pin assignments differ across variants (e.g., NC pins, I/O placement, and dedicated function pins vary between 256K×36 and 512K×18 configurations). The 71V65803S133BQI8 is specifically mapped to the 256K × 36 TQFP-100 layout per Renesas' PKG100 drawing 5304 drw 02.
71V65803S133BQI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65803S133BQI8 FAQ
1.How can I place an order for 71V65803S133BQI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S133BQI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S133BQI8 reliable?
The price and inventory of 71V65803S133BQI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S133BQI8 is usually 5 days.
3.What payment methods are accepted for 71V65803S133BQI8?
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71V65803S133BQI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S133BQI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S133BQI8?
For technical support, including 71V65803S133BQI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S133BQI8 requirements.
6.How does Aetrix verify that 71V65803S133BQI8 is sourced from the original manufacturer or authorized distributors?
All 71V65803S133BQI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S133BQI8 meets industry standards.
7.What is the process for return or replacement of 71V65803S133BQI8?
All 71V65803S133BQI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S133BQI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S133BQI8 part is unused and in its original packaging.
Return procedure for 71V65803S133BQI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S133BQI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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