Renesas 71V65803S150BG
- Part No.:
- 71V65803S150BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65803S150BG.pdf
- Description:
- IC SRAM 9MBIT PAR 150MHZ 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65803S150BG from Renesas Electronics is a 3.3V, 9,437,184-bit (9 Mbit) synchronous ZBT™ SRAM with 256K × 36 memory configuration, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature range (–40°C to +85°C) in a 119-ball BGA package - used in high-speed network packet buffers and telecom line-card data path acceleration.
For engineers reviewing the 71V65803S150BG datasheet, 71V65803S150BG pinout, 71V65803S150BG application, or 71V65803S150BG equivalent, key selection criteria include ZBT™ bus efficiency, 3.3V I/O compatibility, synchronous burst control via ADV/LD and LBO, individual byte write (BW1–BW4), and support for depth expansion using three chip enables (CE1, CE2, CE2).
Technical Context
The 71V65803S150BG implements a fully synchronous, pipelined SRAM architecture where address/control registration occurs on the rising CLK edge, with data output valid two cycles later. Its ZBT™ feature eliminates dead cycles between read/write transitions by internally synchronizing output buffer enable - removing external OE timing constraints.
Burst operation is managed by an on-chip counter controlled by ADV/LD (load new address or increment counter) and LBO (linear vs. interleaved sequence). Write operations support full-word or per-byte granularity via BW1–BW4, and power-down is enabled asynchronously via ZZ input, guaranteeing data retention during sleep mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9,437,184 bits), configured as 36-bit wide data bus with 18-bit address space (A0–A17) |
| Max Clock Frequency | 150 MHz - enables 6.67 ns cycle time for sustained high-throughput memory access in pipeline-critical systems |
| Access Time | 3.8 ns clock-to-data - defines minimum latency from CLK rise to valid Q output under specified load conditions |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation for core and I/O domains |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded and telecom infrastructure applications |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus traffic and improves bandwidth efficiency in sequential access patterns |
| Power-Down Mode | Asynchronous ZZ input gates internal clock and reduces active current - maintains data retention with minimal standby power |
Pinout & Package
71V65803S150BG is packaged in a JEDEC-standard 119-ball fine-pitch BGA (BGG119), 12 mm × 12 mm body, 0.8 mm ball pitch. Pin functions are validated per Renesas datasheet revision Nov.12.21.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | Clock Input | Single-ended positive-edge-triggered master clock; all synchronous timing referenced to this signal |
| R/W | Read/Write Control | Synchronous command signal determining cycle type; sampled with ADV/LD to initiate load or burst operation |
| ADV/LD | Burst Address Control | Loads external address (LOW) or advances internal burst counter (HIGH); defines burst initiation and sequencing behavior |
| LBO | Burst Order Select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst address sequence |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three synchronous enables (CE1/CE2 active LOW, CE2 active HIGH) enabling depth expansion and hierarchical deselect |
| ZZ | Sleep Mode Input | Asynchronous power-down control; places device in lowest-power state while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus with registered input and output paths; supports burst read/write |
| VDD, VDDQ, VSS | Power/Ground | Dedicated 3.3 V core (VDD), 3.3 V I/O (VDDQ), and ground (VSS) pins - require local decoupling per ball group |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations - increases effective bus utilization in burst-intensive protocols like PCI-X or packet forwarding engines |
| Pipelined Output Enable | Internally synchronized OE removes need for external timing control - simplifies PCB layout and eliminates OE setup/hold violations |
| 4-Word Burst Counter | On-chip counter driven by ADV/LD and LBO - reduces address bus toggling and controller overhead for sequential memory access |
| Individual Byte Write | Four independent BWx signals allow partial-word writes without read-modify-write - critical for protocol header updates and cache line fills |
| Three Chip Enables | CE1 (LOW), CE2 (LOW), CE2 (HIGH) support flexible depth expansion and multi-chip memory banks - enables scalable capacity without external logic |
Applications
| Network Packet Buffer | Telecom Line Card |
|---|---|
Use Scenario: Storing ingress/egress Ethernet or SONET frames in real-time switching fabric with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer between MAC and switch fabric ASICs. Use Value: 150 MHz operation and ZBT™ architecture deliver sustained 5.4 Gbps (36-bit × 150 MHz) throughput with no bus turnaround penalty - reducing frame queuing delay. | Use Scenario: Supporting TDM time-slot interchange and HDLC framing in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: Synchronous burst-access memory for time-division multiplexed data reordering and protocol processing. Use Value: 4-word linear burst mode aligned with TDM frame structure enables single-address fetch of four time slots - minimizing controller cycles per frame. |
| Industrial PLC Data Cache | Avionics Data Recorder |
Use Scenario: Caching sensor fusion results and motion control commands in deterministic real-time PLCs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing deterministic access timing for safety-critical control loops. Use Value: Guaranteed 3.8 ns clock-to-data access and industrial temp rating ensure sub-microsecond response consistency across environmental extremes. | Use Scenario: Capturing high-rate flight telemetry (ARINC 429, MIL-STD-1553) with lossless buffering during transient power events. IC Role / Device Role / Timing Role: Low-power, data-retentive SRAM serving as pre-recording FIFO before flash storage commit. Use Value: Asynchronous ZZ sleep mode reduces standby current while preserving buffered data - extending backup battery life during brownouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-167AXC | 167 MHz max frequency, 256K × 36, 3.3 V, but uses QDR-II architecture with separate read/write ports - no ZBT™ zero-turnaround | Optimized for simultaneous read/write in graphics/framebuffer use - less suitable for burst-sequential telecom buffers | Select when dual-port concurrency outweighs ZBT™ bus efficiency; verify timing closure for asymmetric port routing |
| AS7C3256B-15JCN | 15 ns async access, 32K × 8 organization, 3.3 V - asynchronous interface, no burst counter, no pipelining | Used in legacy microcontroller peripherals and simple boot ROM replacement - lacks ZBT™ and burst features | Choose only for cost-sensitive, non-pipelined designs where 150 MHz sync performance is unnecessary |
Compared with CY7C1362BV33-167AXC and AS7C3256B-15JCN, the 71V65803S150BG uniquely delivers ZBT™ zero-turnaround and synchronous 4-word burst in a 256K × 36 configuration - making it optimal for high-efficiency packet buffering where bus utilization and deterministic latency dominate over raw peak bandwidth.
Availability
71V65803S150BG is available at Aetrix Electronics and suitable for network packet buffering, telecom line-card data path acceleration, industrial PLC data caching, and avionics telemetry recording requiring stable component supply and long-term industrial temperature support.
Supply support for 71V65803S150BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S150BG belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed, low-latency data buffering in networking, telecom, and real-time control systems demanding zero bus turnaround and deterministic burst access.
FAQ
What is the memory organization and total capacity of the 71V65803S150BG?
The 71V65803S150BG is organized as 256K × 36, delivering 9,437,184 bits (9 Mbit) of synchronous SRAM. It uses an 18-bit address bus (A0–A17) and a 36-bit data bus (I/O0–I/O31 plus I/OP1–I/OP4), supporting byte-wide writes via four independent BWx signals. This configuration targets high-bandwidth, word-aligned data buffering in telecom and networking hardware.
Does the 71V65803S150BG support burst read and write operations, and how is burst order controlled?
Yes, the 71V65803S150BG supports 4-word synchronous burst reads and writes. Burst order is selected via the LBO pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The ADV/LD pin controls whether a new external address is loaded (LOW) or the internal burst counter is advanced (HIGH), enabling seamless burst chaining without CPU intervention.
What is the role of the ZZ pin on the 71V65803S150BG, and does it retain data during sleep mode?
The ZZ pin on the 71V65803S150BG is an asynchronous sleep mode input. When asserted HIGH, it gates the internal clock and reduces power consumption to its minimum level while guaranteeing full data retention. This feature allows the 71V65803S150BG to maintain stored packet or control data during system idle periods or brownout conditions - critical for avionics and industrial applications requiring nonvolatile buffering without external backup power.
How does the ZBT™ (Zero Bus Turnaround) feature improve system performance in the 71V65803S150BG?
The ZBT™ feature in the 71V65803S150BG eliminates dead cycles between consecutive read and write operations by internally synchronizing output buffer enable. Unlike conventional SRAMs requiring explicit OE deassertion/reassertion, the 71V65803S150BG transitions instantly between read and write bursts - increasing effective bus utilization by up to 25% in mixed-access workloads such as packet header modification and payload streaming.
What package type and pin count does the 71V65803S150BG use, and is it RoHS-compliant?
The 71V65803S150BG uses a 119-ball fine-pitch BGA (BGG119) package with 0.8 mm ball pitch and 12 mm × 12 mm body size. It is RoHS-compliant and qualifies as a "green part" per Renesas' ordering information. The pinout matches JEDEC standard BG119 layout, and thermal/mechanical design guidelines are provided in the official datasheet revision Nov.12.21.
71V65803S150BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65803S150BG FAQ
1.How can I place an order for 71V65803S150BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S150BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65803S150BG reliable?
The price and inventory of 71V65803S150BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S150BG is usually 5 days.
3.What payment methods are accepted for 71V65803S150BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S150BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65803S150BG?
71V65803S150BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65803S150BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65803S150BG?
For technical support, including 71V65803S150BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S150BG requirements.
6.How does Aetrix verify that 71V65803S150BG is sourced from the original manufacturer or authorized distributors?
All 71V65803S150BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S150BG meets industry standards.
7.What is the process for return or replacement of 71V65803S150BG?
All 71V65803S150BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S150BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S150BG part is unused and in its original packaging.
Return procedure for 71V65803S150BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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