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Renesas 71V65803S150BG8

Part No.:
71V65803S150BG8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65803S150BG8.pdf
Description:
IC SRAM 9MBIT PAR 150MHZ 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,522

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Product details

Overview

71V65803S150BG8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround (ZBT) architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature (–40°C to +85°C). It is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the 71V65803S150BG8 datasheet, 71V65803S150BG8 pinout, 71V65803S150BG8 application, or 71V65803S150BG8 equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O compatibility, TQFP-100 or BGA-119 package fit, burst counter control via ADV/LD and LBO, and industrial-grade thermal reliability.

Technical Context

The 71V65803S150BG8 implements a fully synchronous, positive-edge-triggered interface with registered address, control, and data paths. Its ZBT architecture eliminates dead cycles between read/write transitions by overlapping bus turnaround with internal memory access.

It features an on-chip 4-word burst counter controlled by ADV/LD (load/advance) and LBO (linear/interleaved order), three chip enables (CE1, CE2, CE2) for depth expansion, individual byte write enables (BW1–BW4), and asynchronous sleep mode (ZZ) and output enable (OE).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.44 Mbit); supports 512K × 18-bit configuration via pin strapping
Max Clock Frequency150 MHz - enables 3.8 ns clock-to-data access for real-time packet buffering
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual-rail I/O/core separation reduces noise coupling
Burst Capability4-word linear or interleaved burst - reduces address bus traffic by 75% per burst sequence
Operating Temperature–40°C to +85°C - qualified for industrial networking and telecom infrastructure
ZBT FeatureNo dead cycles between read/write transitions - sustains full bandwidth during mixed-access workloads
Power-Down ModeAsynchronous ZZ input gates internal clock - reduces standby current to minimum retention level

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 119-ball BGA (BG119), or 165-fine-pitch BGA (BQ165). The 71V65803S150BG8 uses the BG119 variant (119-ball grid array) with 1.0 mm ball pitch and 12 mm × 12 mm body size.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge with ADV/LD low and chip enabled
CLKSystem Clock InputPositive-edge-triggered master clock; all synchronous timing referenced to this edge
R/WRead/Write ControlSynchronous signal defining cycle type; data transfer occurs two clocks later
ADV/LDBurst Counter ControlLow = load external address; high = increment internal burst counter
LBOBurst Order SelectStatic input: low = linear burst (0,1,2,3), high = interleaved (0,2,1,3)
BW1–BW4Byte Write EnablesActive-low synchronous controls for 9-bit bytes; allows partial-word writes without masking logic
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high) for flexible depth expansion
ZZSleep Mode InputAsynchronous high-level entry into lowest-power retention state; preserves data
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous bus with registered inputs/outputs; supports burst transfers

Key Features

FeatureDesign Value
ZBTTM ArchitectureEliminates bus idle cycles between read/write transitions, enabling sustained 150 MHz throughput in mixed-access scenarios
Internally Synchronized OERemoves need for precise OE timing control; outputs remain valid across clock cycles without external gating
Single R/W PinReduces control bus complexity versus separate RD/WR signals; simplifies FPGA or ASIC interface logic
4-Word Burst CounterMinimizes address bus activity and controller overhead-only one address needed per four-word transfer
Three Chip EnablesEnables seamless depth expansion (e.g., 2× 256K×36 → 512K×36) without external decode logic

Applications

High-Speed Network Switch BufferingTelecom Line Card Packet Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switching ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly to switch fabric controller; provides zero-turnaround burst reads/writes at 150 MHz.

Use Value: Eliminates bus dead time between ingress/egress operations, increasing effective throughput by up to 20% versus standard SSRAMs.

Use Scenario: Temporary storage of ATM or IP packets in carrier-grade line cards requiring deterministic access and industrial temperature operation.

IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting simultaneous header lookup (read) and payload write under burst-mode control.

Use Value: Linear/interleaved burst modes align with common packet header+payload access patterns, reducing controller address generation overhead.

Baseband Processing in Wireless InfrastructureIndustrial Real-Time Data Acquisition Buffer

Use Scenario: Intermediate storage of IQ samples between ADC/DAC and DSP in LTE/5G remote radio units (RRUs).

IC Role / Device Role / Timing Role: High-reliability, low-latency memory for cyclic data streams; synchronized to baseband clock domain via CLK and CEN.

Use Value: Pipelined outputs and clock-enable suspension allow precise timing alignment with RF frame boundaries and power-gating windows.

Use Scenario: Capturing high-speed sensor data (e.g., vibration, thermal imaging) in factory automation systems with deterministic sampling intervals.

IC Role / Device Role / Timing Role: Buffered acquisition memory interfaced to microcontroller or FPGA; uses ZZ sleep mode between capture bursts to reduce system power.

Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V tolerance ensure stable operation in uncontrolled environments without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1315KV18-167BZI512K × 18-bit, 167 MHz, 3.3V, QDR-II architecture with separate read/write portsHigher bandwidth but requires dual-port controller logic; no ZBT burst counterChoose when true concurrent read/write is required and controller supports QDR-II protocol
AS7C3316PFS-15KIN256K × 36-bit, 150 MHz, 3.3V, standard SSRAM (no ZBT or burst counter)Lacks zero bus turnaround and burst addressing; requires full address per accessChoose only if ZBT timing and burst capability are not required and cost is primary constraint

Compared with CY7C1315KV18-167BZI and AS7C3316PFS-15KIN, the 71V65803S150BG8 uniquely delivers ZBT timing and integrated burst control in a single 256K×36 device-reducing controller complexity and improving efficiency in sequential-access buffering applications.

Availability

71V65803S150BG8 is available at Aetrix Electronics and suitable for high-speed network switching, telecom line card design, and industrial data acquisition requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.

Supply support for 71V65803S150BG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65803S150BG8 belongs to Renesas' high-performance ZBT SRAM product line, engineered specifically for bandwidth-critical buffering in networking, telecom, and real-time embedded systems where zero bus turnaround and deterministic burst access are essential.

FAQ

What memory configuration does the 71V65803S150BG8 support?

The 71V65803S150BG8 supports a 256K × 36-bit organization (9.44 Mbit), and can be configured as 512K × 18-bit via pin strapping. This dual-configuration flexibility allows system designers to optimize data bus width and density without changing the core SRAM architecture. Both configurations retain full ZBT functionality, 150 MHz operation, and identical timing parameters.

How does the ZBTTM feature improve performance in the 71V65803S150BG8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S150BG8 eliminates idle cycles when switching between read and write operations. Unlike conventional SSRAMs that require bus stabilization time, the 71V65803S150BG8 pipelines the transition-allowing back-to-back accesses with no dead cycles. This maintains full 150 MHz throughput in mixed-access workloads typical of packet buffering and real-time streaming.

What is the function of the ADV/LD and LBO pins on the 71V65803S150BG8?

On the 71V65803S150BG8, ADV/LD is a synchronous control pin: low loads a new external address, high advances the internal 4-word burst counter. LBO is a static input selecting burst order-low enables linear (0,1,2,3), high enables interleaved (0,2,1,3). Together, they eliminate external burst address generation logic and let the 71V65803S150BG8 autonomously manage sequential memory access.

Does the 71V65803S150BG8 support partial-word writes?

Yes, the 71V65803S150BG8 supports partial-word writes via four independent byte write enables (BW1–BW4), each controlling a 9-bit segment of the 36-bit data bus. When a BWx pin is asserted low during a write cycle, only its corresponding byte is updated; others retain prior data. This avoids read-modify-write sequences and reduces controller overhead in applications like header editing or metadata insertion.

What package and pin count does the 71V65803S150BG8 use?

The 71V65803S150BG8 uses the BG119 package: a 119-ball fine-pitch ball grid array with 1.0 mm pitch and 12 mm × 12 mm body size. It is JEDEC-compliant and compatible with standard reflow profiles. This package offers superior thermal dissipation and signal integrity over TQFP alternatives-critical for sustained 150 MHz operation in dense networking PCB layouts.

71V65803S150BG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65803S150BG8 FAQ

1.How can I place an order for 71V65803S150BG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S150BG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S150BG8 reliable?

The price and inventory of 71V65803S150BG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S150BG8 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S150BG8 transactions.

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4.How is shipping managed for 71V65803S150BG8?

71V65803S150BG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S150BG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S150BG8?

For technical support, including 71V65803S150BG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S150BG8 requirements.

6.How does Aetrix verify that 71V65803S150BG8 is sourced from the original manufacturer or authorized distributors?

All 71V65803S150BG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S150BG8 meets industry standards.

7.What is the process for return or replacement of 71V65803S150BG8?

All 71V65803S150BG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S150BG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S150BG8 part is unused and in its original packaging.

Return procedure for 71V65803S150BG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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