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Renesas 71V65803S150BGI8

Part No.:
71V65803S150BGI8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65803S150BGI8.pdf
Description:
IC SRAM 9MBIT PAR 150MHZ 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,908

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Product details

Overview

71V65803S150BGI8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined burst read/write capability. It operates across industrial temperature (–40°C to +85°C), supports interleaved/linear 4-word bursts, and features individual byte write control for high-throughput memory subsystems in network packet buffers and telecom switching fabric.

For engineers reviewing the 71V65803S150BGI8 datasheet, 71V65803S150BGI8 pinout, 71V65803S150BGI8 application, or 71V65803S150BGI8 equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, ZBT™-specific burst sequencing behavior, and validated alternatives for high-speed synchronous SRAM replacement in latency-critical embedded systems.

Technical Context

The 71V65803S150BGI8 implements a fully synchronous, pipelined interface with address/control registration on the rising CLK edge, two-cycle data latency, and internally synchronized output buffer enable-eliminating external OE timing constraints. Its ZBT™ architecture removes dead cycles between consecutive reads and writes by decoupling bus direction control from data transfer timing.

Burst operation is managed via ADV/LD and LBO inputs: ADV/LD loads new addresses or advances the internal counter, while LBO selects linear or interleaved 4-word sequences. Three chip enables (CE1, CE2, CE2) support depth expansion, and ZZ enables asynchronous sleep mode with guaranteed data retention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9,437,184 bits); supports 512K × 18-bit configuration via pin strapping
Clock Frequency 150 MHz maximum; enables 6.67 ns cycle time for sustained burst throughput
Access Time 3.8 ns clock-to-data (tCD); defines minimum latency from CLK rise to valid Q output
Supply Voltage VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Operating Temperature –40°C to +85°C (industrial grade); qualified for extended thermal cycling in base station hardware
Burst Capability 4-word linear or interleaved burst; reduces address bus overhead by 75% per burst sequence
Power-Down Mode ZZ input gates internal clock; reduces active current to standby level while retaining memory contents

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pin 1 marked via corner notch; top-side marking includes "71V65803S150BGI8" and date code.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled
CLK System Clock Input Rising-edge-triggered master timing reference; all synchronous registers aligned to this edge
R/W Read/Write Control Synchronous signal defining load-cycle intent; determines whether next data cycle is read or write
ADV/LD Burst Address Control LOW loads external address; HIGH advances internal burst counter-enables seamless burst chaining
LBO Burst Order Select Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); no runtime reconfiguration
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates 2-cycle deselect
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte lanes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
I/O0–I/O31, I/OP1–I/OP4 Data I/O Bus 36-bit bidirectional synchronous bus; registered input/output paths eliminate hold-time violations
OE Output Enable Asynchronous; drives I/O pins to high-Z when HIGH-no timing coordination with CLK required
ZZ Sleep Mode Input Asynchronous; gates internal clock and reduces ICC to <10 µA while preserving data integrity

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates idle cycles between read-write transitions-enables back-to-back burst transfers without bus arbitration delay
Pipelined Output Buffer Enable Internally synchronized OE removes need for external timing control-simplifies PCB layout and reduces setup/hold margin risk
4-Word Burst Counter Reduces address bus activity by 75% per burst; LBO-selectable linear/interleaved order matches cache line or packet alignment needs
Individual Byte Write Control Four independent BWx signals allow partial-word writes without read-modify-write overhead-critical for packet header updates
Three-Chip-Enable Architecture Supports seamless depth expansion across multiple devices using CE1/CE2/CE2 logic-enables scalable memory banks up to 2M×36
Industrial Temperature Range –40°C to +85°C operation with full AC/DC specifications guaranteed-qualified for outdoor telecom and industrial control environments

Applications

Network Packet Buffering Telecom Switch Fabric

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to MAC and switch fabric controllers.

Use Value: ZBT™ architecture enables continuous read-write interleaving at 150 MHz, eliminating pipeline stalls during packet ingress/egress concurrency.

Use Scenario: Implementing time-slot interchange (TSI) memory in TDM-based voice switching systems requiring deterministic access.

IC Role / Device Role / Timing Role: Synchronous dual-port SRAM acting as frame buffer with precise 125 µs frame boundary alignment.

Use Value: 3.8 ns tCD and pipelined outputs ensure sub-cycle timing margins for 8 kHz sampling rate synchronization.

Baseband Processing Memory Radar Signal Processing Buffer

Use Scenario: Serving as L1 cache or instruction/data scratchpad in FPGA-accelerated LTE/5G baseband processing units.

IC Role / Device Role / Timing Role: Low-latency memory co-located with DSP/FPGA fabric for real-time FFT, channel estimation, and modulation tasks.

Use Value: 4-word burst mode aligns with 128-bit AXI bus widths, delivering 576 Mbps sustained bandwidth per device.

Use Scenario: Capturing and buffering high-speed ADC samples from phased-array radar receivers before FFT processing.

IC Role / Device Role / Timing Role: High-reliability, temperature-stable memory buffer operating in harsh environmental conditions.

Use Value: Industrial-grade –40°C to +85°C rating and ZZ sleep mode support cold-start and duty-cycled operation in airborne radar platforms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-167AXC 167 MHz max frequency; 256K × 36 organization; same TQFP-100 package; Cypress (Infineon) ZBT SRAM Higher speed but requires tighter VIH/VIL margins; lacks ZZ sleep mode-higher standby power Select when system clock exceeds 150 MHz and sleep mode is not required.
AS7C3256P-15TIN 15 ns async access; 32K × 8 organization; SOJ-54 package; Alliance Memory standard SRAM Asynchronous interface; no burst or ZBT capability; lower density and bandwidth Select only for legacy designs where synchronous timing and burst features are unused.

Compared with CY7C1362BV33-167AXC and AS7C3256P-15TIN, the 71V65803S150BGI8 uniquely balances 150 MHz ZBT™ performance, industrial temperature reliability, and low-power ZZ sleep-making it optimal for new telecom infrastructure and embedded signal processing designs where deterministic latency and thermal robustness are mandatory.

Availability

71V65803S150BGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, and baseband processing applications requiring stable component supply, long-term lifecycle support, and traceable industrial-grade sourcing.

Supply support for 71V65803S150BGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The 71V65803S150BGI8 belongs to Renesas' ZBT™ synchronous SRAM product line, engineered specifically for high-throughput, low-latency memory subsystems in networking equipment, telecom infrastructure, and real-time signal processing systems.

FAQ

What is the maximum supported clock frequency for the 71V65803S150BGI8?

The 71V65803S150BGI8 is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply voltage. The 3.8 ns clock-to-data access time (tCD) is measured under these conditions and defines the minimum latency from CLK rise to valid output data.

Does the 71V65803S150BGI8 support both 256K × 36 and 512K × 18 configurations?

Yes, the 71V65803S150BGI8 supports both memory organizations. The 256K × 36 configuration uses A0–A17 (18 address bits), while the 512K × 18 variant uses A0–A18 (19 address bits) and maps data across I/O0–I/O15 and I/OP1–I/OP2. Configuration is determined by pin strapping and address decoding-not by internal register settings-and is fixed per device revision.

How does the ZBTTM feature eliminate dead cycles in the 71V65803S150BGI8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S150BGI8 eliminates dead cycles by decoupling bus direction control from data transfer timing. Unlike conventional SRAMs that require explicit bus turnaround cycles, the 71V65803S150BGI8 allows immediate transition from a write burst to a read burst (or vice versa) without inserting idle clocks-enabling back-to-back operations at full 150 MHz throughput.

What is the function of the ADV/LD and LBO pins on the 71V65803S150BGI8?

On the 71V65803S150BGI8, ADV/LD controls burst addressing: sampled LOW at CLK rise, it loads a new external address; sampled HIGH, it advances the internal burst counter. LBO selects burst order-LOW enables linear sequence (0,1,2,3), HIGH enables interleaved (0,2,1,3). Both are static inputs and must remain stable during burst execution.

Can the 71V65803S150BGI8 operate in low-power mode, and how is it controlled?

Yes, the 71V65803S150BGI8 supports low-power operation via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and core logic enters sleep mode, reducing ICC to less than 10 µA while guaranteeing full data retention. No clock or command sequence is required-entry and exit are immediate and transparent to ongoing memory state.

71V65803S150BGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65803S150BGI8 FAQ

1.How can I place an order for 71V65803S150BGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S150BGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S150BGI8 reliable?

The price and inventory of 71V65803S150BGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S150BGI8 is usually 5 days.

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71V65803S150BGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S150BGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S150BGI8?

For technical support, including 71V65803S150BGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S150BGI8 requirements.

6.How does Aetrix verify that 71V65803S150BGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65803S150BGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S150BGI8 meets industry standards.

7.What is the process for return or replacement of 71V65803S150BGI8?

All 71V65803S150BGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S150BGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S150BGI8 part is unused and in its original packaging.

Return procedure for 71V65803S150BGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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