Renesas 71V65803S150BQG
- Part No.:
- 71V65803S150BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65803S150BQG.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,164
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Product details
Overview
71V65803S150BQG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking buffers and packet-switching ASIC/FPGA interfaces.
For engineers reviewing the 71V65803S150BQG datasheet, 71V65803S150BQG pinout, 71V65803S150BQG application, or 71V65803S150BQG equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 3.3V I/O supply (VDDQ) requirements, and industrial-grade thermal stability for telecom infrastructure designs.
Technical Context
The 71V65803S150BQG implements a fully synchronous, positive-edge-triggered interface with registered address, control, and data paths. Its internal burst counter advances on ADV/LD = HIGH, while LBO selects linear or interleaved addressing - both sequences wrap after four words.
ZBT™ operation eliminates dead cycles between read/write transitions via internally synchronized output buffer enable (OE asynchronous but typically tied low) and dual-cycle pipelined data delivery: address/control sampled at cycle n, data valid at n+2. Chip enable logic uses three inputs (CE1, CE2, CE2) with two-cycle tri-state delay upon deselect.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant |
| Max Clock Frequency | 150 MHz - enables 6.67 ns cycle time for sustained burst throughput |
| Clock-to-Data Access | 3.8 ns - defines minimum latency from CLK edge to valid Q output |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation |
| Operating Temperature | –40°C to +85°C - qualified for industrial base stations and router line cards |
| Burst Capability | 4-word linear or interleaved burst - reduces address bus traffic by 75% per burst sequence |
| Power-Down Mode | ZZ input asserts sleep mode - gates internal clock and guarantees data retention at minimal current |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per Renesas datasheet revision Nov.12.21 (PKG100 configuration for 256K×36).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK with ADV/LD low and chip enabled |
| CE1, CE2, CE2 | Chip Enables | Three-input decode: CE1=L, CE2=L, CE2=H selects device; any violation initiates 2-cycle deselect |
| R/W | Read/Write Control | Synchronous signal defining load-cycle direction; determines burst type at first address load |
| ADV/LD | Burst Address Control | LOW loads external address; HIGH increments internal burst counter - enables seamless burst chaining |
| LBO | Burst Order Select | Static input: LOW = linear (0,1,2,3), HIGH = interleaved (0,2,1,3) - sets burst address mapping |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered input/output paths triggered on rising CLK edge |
| CLK | System Clock | Primary timing reference; all synchronous operations referenced to rising edge - no internal PLL |
| ZZ | Sleep Mode Input | Asynchronous high-impedance entry to low-power state; retains memory contents without clock |
| OE | Output Enable | Asynchronous control; tied low in most ZBT™ designs to eliminate OE timing constraints |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write bursts - sustains 100% bus utilization in pipeline architectures |
| Internally Synchronized OE | Removes need for precise OE timing control - simplifies PCB layout and timing closure in high-speed systems |
| 4-Word Burst Counter | Reduces external address generation overhead - cuts controller logic complexity and routing congestion |
| Individual Byte Write (BW1–BW4) | Enables partial-word updates without read-modify-write - critical for protocol header manipulation in packet buffers |
| Three-Chip-Enable Depth Expansion | Supports seamless memory depth scaling using standard CE logic - avoids custom glue logic for multi-chip stacks |
Applications
| High-Speed Network Buffer | Telecom Line Card Cache |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2 switches before forwarding decisions. IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly with MAC controllers and switch fabric ASICs. Use Value: 150 MHz clock and ZBT™ burst capability sustain full wire-rate buffering for 10 GbE traffic without stalling the data path. | Use Scenario: Holding voice-over-IP (VoIP) payload packets in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Low-latency, deterministic-access cache for real-time packet reassembly and jitter buffering. Use Value: Industrial temperature rating and 3.8 ns clock-to-data ensure reliable operation in uncooled central office environments. |
| FPGA-Based Protocol Accelerator | Industrial PLC Data Logging |
Use Scenario: Offloading TCP/IP checksum, encryption, or deep packet inspection in FPGA-accelerated edge servers. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory tightly coupled to FPGA soft-core processors or custom datapaths. Use Value: Pipelined outputs and synchronous R/W simplify FPGA timing closure - eliminates metastability risks in 150 MHz domain. | Use Scenario: Cyclic data acquisition from analog I/O modules in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile-buffered storage for sensor history during brownout events using ZZ sleep mode. Use Value: Sleep mode with guaranteed data retention at <1 µA enables battery-backed logging without external backup RAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-167BAXI | 167 MHz max frequency; 256K × 36 organization; 3.3V core/I/O; same TQFP-100 package | Higher speed grade but lacks ZBT™-specific burst sequencing logic - requires external OE management | Select when absolute maximum bandwidth is required and system can accommodate non-ZBT™ timing model |
| AS7C3256A-15TIN | 15 ns async access; 32K × 8 organization; 3.3V only; SOJ-32 package - not pin-compatible | Asynchronous interface; no burst counter or ZBT™ feature; lower density and speed | Consider only for legacy redesigns where synchronous timing constraints are relaxed and board space permits package change |
Compared with CY7C1362BV33-167BAXI and AS7C3256A-15TIN, the 71V65803S150BQG uniquely delivers zero-bus-turnaround burst efficiency in a drop-in industrial-TQFP package - enabling deterministic latency and simplified controller design for telecom and networking hardware.
Availability
71V65803S150BQG is available at Aetrix Electronics and suitable for high-speed network buffers, telecom line card caches, and FPGA-based protocol accelerators requiring stable component supply across extended product lifecycles.
Supply support for 71V65803S150BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65803S150BQG belongs to Renesas' ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-throughput packet-processing systems such as routers, switches, and baseband units.
FAQ
What is the memory organization and density of the 71V65803S150BQG?
The 71V65803S150BQG is configured as 256K × 36 bits, delivering 9,437,184 total bits (9.4 Mbit) of synchronous SRAM. This organization supports 36-bit wide data paths common in high-performance networking ASICs and FPGAs. The part shares pinout and timing with the 512K × 18 variant (71V65603), enabling flexible density selection within the same footprint.
Does the 71V65803S150BQG support burst read and write operations?
Yes, the 71V65803S150BQG supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin. Burst initiation occurs on ADV/LD = HIGH after initial address load, and each burst word appears two clocks after its corresponding address/control sampling. The ZBT™ architecture ensures no dead cycles between successive burst reads or writes.
What package type and pin count does the 71V65803S150BQG use?
The 71V65803S150BQG is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP) with 14 mm × 20 mm body size and 0.5 mm lead pitch. This package is explicitly documented for the 256K × 36 configuration in Renesas' datasheet revision Nov.12.21 and supports industrial temperature operation without derating.
How does the ZBTTM feature improve system performance in the 71V65803S150BQG?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S150BQG eliminates idle cycles when switching between read and write operations. By internally synchronizing output buffer enable and using pipelined registers, it allows back-to-back burst transfers - increasing effective bus utilization to near 100% in sustained traffic scenarios like packet buffering and streaming media processing.
What are the power supply requirements for the 71V65803S150BQG?
The 71V65803S150BQG requires two independent 3.3 V supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. Both rails must be decoupled per Renesas' layout guidelines. The ZZ pin enables sleep mode, reducing active current significantly while retaining data - critical for power-constrained telecom applications.
71V65803S150BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65803S150BQG FAQ
1.How can I place an order for 71V65803S150BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65803S150BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V65803S150BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S150BQG is usually 5 days.
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6.How does Aetrix verify that 71V65803S150BQG is sourced from the original manufacturer or authorized distributors?
All 71V65803S150BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S150BQG meets industry standards.
7.What is the process for return or replacement of 71V65803S150BQG?
All 71V65803S150BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S150BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65803S150BQG part is unused and in its original packaging.
Return procedure for 71V65803S150BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65803S150BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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