Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V65803S150BQI

Part No.:
71V65803S150BQI
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65803S150BQI.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,972

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V65803S150BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined burst read/write capability. It supports interleaved or linear 4-word bursts and operates across industrial temperature range (–40°C to +85°C), targeting high-bandwidth memory buffering in network switches and telecom line cards.

For engineers reviewing the 71V65803S150BQI datasheet, 71V65803S150BQI pinout, 71V65803S150BQI application, or 71V65803S150BQI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst counter control via ADV/LD and LBO, and support for individual byte write (BW1–BW4) in high-speed packet forwarding systems.

Technical Context

The 71V65803S150BQI implements a fully synchronous, pipelined interface with all address/control/data registers triggered on the positive clock edge. Its ZBT™ architecture eliminates dead cycles between consecutive read and write operations by overlapping bus turnaround with data transfer - enabled by internal synchronization of OE and burst counter logic.

It features three chip enables (CE1, CE2, CE2) with mixed polarity for flexible depth expansion, a static LBO input selecting linear/interleaved burst order, and asynchronous ZZ sleep mode for low-power retention. The device uses separate VDD (core) and VDDQ (I/O) supplies, each regulated at 3.3V ±5%, and supports individual byte write masking without external logic.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.4 Mbit); supports 512K × 18-bit via pin-compatible variant
Max Clock Frequency150 MHz - enables 3.8 ns clock-to-data access for real-time packet buffering
ZBT™ ArchitectureZero Bus Turnaround - eliminates idle cycles between back-to-back reads/writes, boosting effective bandwidth
Burst Capability4-word burst (linear or interleaved) - reduces address setup overhead in sequential memory access
Supply VoltagesVDD = 3.3V ±5% (core); VDDQ = 3.3V ±5% (I/O) - requires dual-rail regulation
Operating Temperature–40°C to +85°C - qualified for industrial networking and base station environments
PackageJEDEC-standard 100-pin TQFP (14 mm × 20 mm) - surface-mount compatible with standard reflow profiles

Pinout & Package

71V65803S150BQI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with exposed pad not specified. Pin functions are fully defined for the 256K × 36 configuration per datasheet revision Nov.12.21.

Pin/TerminalCircuit RoleDesign Meaning
CLKClock InputPositive-edge-triggered master clock; all synchronous registers (address, control, I/O) sample on rising edge
A0–A17Address Inputs18-bit address bus for 256K-depth addressing; latched synchronously with CLK, ADV/LD, and CE
R/WRead/Write ControlSynchronous signal determining cycle type; sampled two cycles before data transfer
ADV/LDBurst Counter ControlLoad new external address (LOW) or advance internal burst counter (HIGH); defines burst initiation and sequencing
LBOBurst Order SelectStatic input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence - no runtime switching
BW1–BW4Byte Write EnablesFour active-low signals enabling independent 9-bit byte writes; all may be tied LOW for full-word writes
CE1, CE2, CE2Chip EnablesThree enables with CE2 active-high; any false enable initiates 2-cycle deselect, tri-stating I/O after delay
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional data bus with registered inputs/outputs; supports simultaneous read/write in ZBT™ mode
ZZSleep Mode InputAsynchronous high-impedance power-down; gates internal clock and reduces ICC to <10 µA while retaining data

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates dead cycles between read/write transitions - increases sustained throughput in burst-intensive applications
Internally synchronized OERemoves need for external OE timing control; outputs automatically align with pipelined data valid window
Single R/W pinReduces control bus complexity vs. separate RD/WR signals - simplifies FPGA/CPLD interface logic
Pipelined output registersEnsures deterministic 2-cycle latency from address load to data output - critical for synchronous system timing closure
Individual byte write (BW1–BW4)Enables partial-word updates without read-modify-write - essential for header manipulation in packet processors

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly to MAC or switch fabric ASICs via synchronous parallel bus.

Use Value: ZBT™ architecture delivers continuous 150 MHz burst throughput without turnaround penalty, reducing packet queuing delay by up to 30% vs. conventional SRAM.

Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers requiring deterministic access to 36-bit-wide data paths.

IC Role / Device Role / Timing Role: Synchronous SRAM providing pipelined read/write access to ATM cell or OTUk frame headers and payloads.

Use Value: 4-word burst mode with programmable linear/interleaved order matches SONET pointer processing and payload scrambling patterns.

Baseband Processing CacheIndustrial Real-Time Controller Memory

Use Scenario: Temporary storage of FFT coefficients and channel estimation data in LTE/5G baseband units with tight DSP timing constraints.

IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory co-located with FPGA-based digital front-end logic.

Use Value: 3.8 ns clock-to-data access and separate VDD/VDDQ rails minimize timing skew and supply noise coupling into sensitive analog sections.

Use Scenario: Data logging and motion control trajectory buffering in CNC machines and PLCs operating in harsh industrial environments.

IC Role / Device Role / Timing Role: Industrial-grade SRAM serving as nonvolatile shadow RAM for servo loop parameters and encoder position history.

Use Value: –40°C to +85°C operation and ZZ sleep mode ensure reliable data retention during brownouts and thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-167AXC167 MHz max frequency; 256K × 36 organization; same TQFP-100 package; Cypress (now Infineon) ZBT™ implementationHigher speed grade but lacks LBO-controlled burst order flexibility; different AC timing parameters (tCD = 3.5 ns)Select when >150 MHz bandwidth is required and burst sequence is fixed; verify CEN/ADV/LD timing compatibility
AS7C33128PFSI-15150 MHz; 256K × 36; 100-pin TQFP; Alliance Memory ZBT™ SRAM; identical pinout and DC specsDrop-in replacement with identical timing, voltage, and functional behavior; qualified to same industrial temp rangePreferred for cost-sensitive designs where second-source assurance is required without layout or firmware changes

Compared with CY7C1362BV33-167AXC and AS7C33128PFSI-15, the 71V65803S150BQI offers unique LBO-selectable burst ordering and Renesas-specific ZBT™ implementation validated in telecom infrastructure - making it optimal for applications requiring configurable burst patterns and long-term supply continuity.

Availability

71V65803S150BQI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial real-time controller memory requiring stable component supply, extended lifecycle support, and industrial temperature qualification.

Supply support for 71V65803S150BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The 71V65803S150BQI belongs to Renesas' high-speed ZBT™ SRAM product line, engineered specifically for zero-latency memory interfacing in packet-switched networks and real-time signal processing systems.

FAQ

What is the maximum operating frequency and corresponding access time for the 71V65803S150BQI?

The 71V65803S150BQI is rated for a maximum clock frequency of 150 MHz, with a guaranteed clock-to-data access time (tCD) of 3.8 ns under industrial conditions. This specification assumes proper setup/hold timing compliance for all synchronous inputs relative to the rising CLK edge, and operation within the recommended 3.3V ±5% supply range and –40°C to +85°C ambient temperature.

Does the 71V65803S150BQI support both linear and interleaved burst modes, and how is the selection made?

Yes, the 71V65803S150BQI supports both linear and interleaved 4-word burst sequences. Selection is controlled by the static LBO (Linear Burst Order) pin: LBO = LOW selects linear order (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The LBO state must be stable before device initialization and cannot be changed dynamically during burst operation.

How does the ZBTTM feature eliminate dead cycles between read and write operations in the 71V65803S150BQI?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S150BQI eliminates dead cycles by internally synchronizing the output enable path and using pipelined address/control registers. When transitioning from a read to a write (or vice versa), the device overlaps bus direction control with the next data transfer - allowing immediate initiation of the subsequent cycle without waiting for bus stabilization. This is implemented in hardware and requires no external logic or timing adjustments.

What are the power supply requirements for the 71V65803S150BQI, and are separate core and I/O rails mandatory?

The 71V65803S150BQI requires two independent 3.3V supplies: VDD (core logic, 3.3V ±5%) and VDDQ (I/O buffers, 3.3V ±5%). These rails must be separately decoupled and may be powered from the same regulator only if its ripple and transient response meet both core logic and I/O drive requirements. The datasheet explicitly specifies distinct voltage tolerances and noise sensitivity for each rail, making separate filtering strongly recommended for signal integrity.

Can the 71V65803S150BQI be used in a 512K × 18-bit configuration, and what design changes are needed?

Yes, the 71V65803S150BQI shares the same die and timing as the 512K × 18-bit variant (71V65603S150BQI), differing only in address pin mapping and internal memory array segmentation. To use 512K × 18 mode, connect A18 as the MSB address, reduce address bus width to A0–A18 (19 bits), and route I/O[0:15] and I/OP1–I/OP2 only. The 71V65803S150BQI datasheet confirms functional equivalence and pin compatibility between these configurations in TQFP-100 package.

71V65803S150BQI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65803S150BQI FAQ

1.How can I place an order for 71V65803S150BQI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S150BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S150BQI reliable?

The price and inventory of 71V65803S150BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S150BQI is usually 5 days.

3.What payment methods are accepted for 71V65803S150BQI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S150BQI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65803S150BQI?

71V65803S150BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S150BQI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S150BQI?

For technical support, including 71V65803S150BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S150BQI requirements.

6.How does Aetrix verify that 71V65803S150BQI is sourced from the original manufacturer or authorized distributors?

All 71V65803S150BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S150BQI meets industry standards.

7.What is the process for return or replacement of 71V65803S150BQI?

All 71V65803S150BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S150BQI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S150BQI part is unused and in its original packaging.

Return procedure for 71V65803S150BQI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65803S150BQI Tags

  • 71V65803S150BQI
  • 71V65803S150BQI PDF
  • 71V65803S150BQI Datasheet
  • 71V65803S150BQI Specifications
  • 71V65803S150BQI Images
  • Renesas
  • Renesas 71V65803S150BQI
  • Buy 71V65803S150BQI
  • 71V65803S150BQI Price
  • 71V65803S150BQI Distributor
  • 71V65803S150BQI Supplier
  • 71V65803S150BQI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER