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Renesas 71V65803S150PFG8

Part No.:
71V65803S150PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65803S150PFG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,482

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Product details

Overview

71V65803S150PFG8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking buffers, packet switching ASIC interfaces, and FPGA co-processor memory subsystems.

For engineers reviewing the 71V65803S150PFG8 datasheet, 71V65803S150PFG8 pinout, 71V65803S150PFG8 application, or 71V65803S150PFG8 equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, industrial-grade thermal operation, and support for individual byte write control via BW1–BW4.

Technical Context

The 71V65803S150PFG8 implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising edge of CLK. Its ZBT™ feature eliminates dead cycles between read/write transitions by enabling immediate bus turnaround without OE control dependency.

It integrates an on-chip burst counter controlled by ADV/LD and LBO inputs, supporting both linear and interleaved 4-word sequences. Internal synchronization of output enable removes need for external OE timing management, while three chip enables (CE1, CE2, CE2) allow flexible depth expansion and two-cycle deselect behavior.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.4 Mbit); supports 512K × 18-bit mode via configuration
Max Clock Frequency150 MHz - enables 6.67 ns cycle time for sustained high-throughput data streaming
Clock-to-Data Access3.8 ns - defines minimum latency from CLK edge to valid Q output in read cycles
Supply VoltagesVDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - requires dual regulated 3.3V rails
Operating Temperature–40°C to +85°C - qualified for industrial embedded systems with thermal cycling
Burst Capability4-word linear or interleaved burst - reduces address overhead in sequential memory access patterns
Power-Down ControlAsynchronous ZZ input - gates internal clock and reduces active power to retention level

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant (PFG8 suffix).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLKSystem Clock InputRising-edge-triggered master timing reference for all synchronous operations
R/WRead/Write ControlSynchronous signal defining load-cycle intent; data transfer occurs two clocks later
ADV/LDBurst Counter ControlLOW loads new external address; HIGH advances internal burst counter
LBOBurst Order SelectStatic input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence
BW1–BW4Byte Write EnablesActive-low synchronous controls for independent 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CE1, CE2, CE2Chip EnablesThree-input logic: CE1=LOW, CE2=LOW, CE2=HIGH selects device; any violation initiates two-cycle deselect
ZZAsynchronous Sleep ModeHIGH disables internal clock and reduces power consumption while retaining memory contents
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path with registered input/output stages

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates idle cycles between consecutive read/write operations, enabling continuous 150 MHz bus utilization
Internally Synchronized OERemoves requirement for precise OE timing control-outputs auto-enable/disable synchronized to CLK
Single R/W PinReduces control line count versus separate RD/WR signals, simplifying interface logic design
4-Word Burst CounterGenerates sequential addresses internally, cutting external address generation logic and bus bandwidth demand
Individual Byte Write (BW1–BW4)Enables partial-word updates without read-modify-write cycles, critical for protocol header manipulation

Applications

High-Speed Network Packet BufferFPGA-Based Video Frame Store

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/3 switches before classification and forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly with MAC controller and switch fabric logic.

Use Value: 150 MHz clock rate and ZBT™ architecture sustain full-line-rate packet buffering with zero turnaround penalty between burst reads and writes.

Use Scenario: Temporary storage of uncompressed 1080p video lines during real-time scaling or color-space conversion in FPGA pipelines.

IC Role / Device Role / Timing Role: Synchronous frame buffer providing pipelined, burst-aligned pixel data to FPGA processing blocks.

Use Value: 4-word burst capability matches common pixel packing (e.g., RGBA), reducing address strobes and improving throughput efficiency.

ASIC Co-Processor MemoryIndustrial Real-Time Control FIFO

Use Scenario: Offloading compute-intensive tasks (e.g., encryption, CRC calculation) from host CPU using dedicated ASIC with local memory.

IC Role / Device Role / Timing Role: Dedicated instruction/data SRAM tightly coupled to ASIC's execution unit via synchronous bus.

Use Value: Pipelined outputs and 3.8 ns clock-to-data access minimize pipeline stalls and maximize ASIC IPC under deterministic timing constraints.

Use Scenario: Holding sensor acquisition data and actuator command queues in PLC modules requiring guaranteed response within 100 µs.

IC Role / Device Role / Timing Role: Deterministic-access FIFO buffer operating at fixed 150 MHz clock with industrial temperature resilience.

Use Value: –40°C to +85°C rating and asynchronous ZZ sleep mode ensure reliable operation in uncontrolled cabinet environments with power cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1372KV18-167BZC512K × 18-bit organization; 167 MHz max frequency; different pinout (165-ball fBGA only)Higher density but narrower data bus; requires PCB redesign and layout changeSelect when wider 18-bit interface suffices and higher clock margin is needed
AS7C3256A-15JC32K × 8-bit async SRAM; no ZBT™, no burst, no pipelining; 15 ns access, 5V tolerantLower performance, simpler interface, legacy voltage compatibilitySelect only for cost-sensitive, non-real-time applications where timing headroom is abundant

Compared with CY7C1372KV18-167BZC and AS7C3256A-15JC, the 71V65803S150PFG8 delivers optimal balance of 36-bit wide bus, ZBT™ zero-turnaround operation, and industrial TQFP packaging-enabling drop-in integration into high-speed control and communications designs without BGA rework or async timing compromises.

Availability

71V65803S150PFG8 is available at Aetrix Electronics and suitable for high-speed networking equipment, FPGA-based video processing systems, ASIC co-processor subsystems, and industrial real-time control modules requiring stable component supply across extended product lifecycles.

Supply support for 71V65803S150PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65803S150PFG8 belongs to Renesas' ZBT™ synchronous SRAM product line, engineered specifically for zero-latency bus turnaround in high-performance packet processing, baseband processing, and real-time embedded memory subsystems.

FAQ

What is the memory organization and density of the 71V65803S150PFG8?

The 71V65803S150PFG8 is configured as 256K × 36-bit, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. It also supports 512K × 18-bit operation via pin-strapping or system-level configuration. This dual-mode flexibility allows designers to optimize data bus width and address space based on system architecture requirements while maintaining identical timing and electrical characteristics for the 71V65803S150PFG8.

Does the 71V65803S150PFG8 require external output enable (OE) control?

No-the 71V65803S150PFG8 features internally synchronized output enable logic, eliminating the need for precise external OE timing. OE is asynchronous but can be tied low for continuous read operation; its state does not affect internal register timing. The 71V65803S150PFG8 automatically manages output tri-state alignment to the clock domain, simplifying interface design and removing setup/hold constraints associated with traditional OE-driven SRAMs.

How does the ZBTTM feature improve system performance in the 71V65803S150PFG8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65803S150PFG8 removes idle cycles between alternating read and write bursts. Unlike conventional synchronous SRAMs that require turnaround wait states, the 71V65803S150PFG8 allows immediate back-to-back access-e.g., a write burst can be followed directly by a read burst on the next clock edge. This sustains 100% bus utilization at 150 MHz, critical for packet buffering and real-time DSP applications where latency predictability is mandatory.

What package type and pin count does the 71V65803S150PFG8 use?

The 71V65803S150PFG8 uses a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP) package, designated PFG8. It measures 14 mm × 20 mm with 0.5 mm lead pitch, features gull-wing leads, and is lead-free/RoHS compliant. This package provides mechanical robustness, thermal performance suitable for industrial ambient conditions, and compatibility with standard surface-mount assembly processes-making it ideal for volume manufacturing of networking and control hardware using the 71V65803S150PFG8.

Can the 71V65803S150PFG8 operate in low-power mode, and how is it controlled?

Yes-the 71V65803S150PFG8 supports low-power sleep mode via the asynchronous ZZ input. When ZZ is driven HIGH, the internal clock is gated and the device enters retention mode with drastically reduced current draw while preserving stored data. This mode is fully compatible with industrial temperature operation (–40°C to +85°C) and requires no additional sequencing-making it suitable for power-gated subsystems in the 71V65803S150PFG8-based designs without compromising data integrity.

71V65803S150PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65803S150PFG8 FAQ

1.How can I place an order for 71V65803S150PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65803S150PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65803S150PFG8 reliable?

The price and inventory of 71V65803S150PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65803S150PFG8 is usually 5 days.

3.What payment methods are accepted for 71V65803S150PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65803S150PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65803S150PFG8?

71V65803S150PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65803S150PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65803S150PFG8?

For technical support, including 71V65803S150PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65803S150PFG8 requirements.

6.How does Aetrix verify that 71V65803S150PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V65803S150PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65803S150PFG8 meets industry standards.

7.What is the process for return or replacement of 71V65803S150PFG8?

All 71V65803S150PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65803S150PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65803S150PFG8 part is unused and in its original packaging.

Return procedure for 71V65803S150PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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