Renesas 71V65803S150PFGI

Overview

71V65803S150PFGI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock frequency, 3.8 ns clock-to-data access time, and zero bus turnaround (ZBT) architecture enabling dead-cycle-free read/write transitions. It operates across industrial temperature (–40°C to +85°C) and is packaged in a 100-pin TQFP for high-speed networking and packet buffering applications.

For engineers reviewing the 71V65803S150PFGI datasheet, 71V65803S150PFGI pinout, 71V65803S150PFGI application, or 71V65803S150PFGI equivalent, this device delivers pipelined burst reads/writes, individual byte write control (BW1–BW4), three chip enables for depth expansion, and asynchronous sleep mode (ZZ) - all critical for low-latency memory subsystems in telecom infrastructure and FPGA-based accelerators.

Technical Context

The 71V65803S150PFGI implements a fully synchronous, positive-edge-triggered interface with registered address, data, and control inputs. Its internal burst counter supports 4-word linear or interleaved sequences controlled by the static LBO pin, and ADV/LD determines whether external addresses are loaded or the counter is advanced.

ZBT operation eliminates bus turnaround latency: a write cycle immediately followed by a read (or vice versa) proceeds without idle cycles. Output enable (OE) is asynchronous but internally synchronized via pipelined output registers, removing timing-critical OE control in high-speed designs.

Key Specifications

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per Renesas datasheet revision Nov. 12, 2021 (PKG100 configuration for 256K × 36).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with CY7C1362BV33-167AXC and AS7C33256PFSI-15, the 71V65803S150PFGI uniquely delivers zero bus turnaround and integrated burst sequencing - reducing controller overhead and improving effective bandwidth in mixed-access memory subsystems without increasing pin count or layout complexity.

Availability

71V65803S150PFGI is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, and FPGA-based accelerator memory requiring stable component supply, long-term lifecycle support, and industrial temperature compliance.

Supply support for 71V65803S150PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The 71V65803S150PFGI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-throughput, low-latency memory subsystems in telecom infrastructure, networking equipment, and real-time embedded systems.

FAQ

What is the memory organization and density of the 71V65803S150PFGI?

The 71V65803S150PFGI is organized as 256K × 36 bits, delivering 9,437,184 total bits (9.4 Mbit) of synchronous SRAM. This configuration supports 36-bit wide data paths ideal for 32-bit systems with parity or ECC overhead. The same die also supports a 512K × 18-bit variant (71V65603), but the 71V65803S150PFGI is fixed to the 256K × 36 configuration per its ordering code and pinout.

Does the 71V65803S150PFGI support true zero bus turnaround (ZBT)?

Yes, the 71V65803S150PFGI implements Renesas' licensed ZBTTM architecture, which eliminates dead cycles between consecutive read and write operations. When a write is immediately followed by a read (or vice versa), the device transitions without inserting idle cycles - confirmed by the functional truth table and timing diagrams in the official datasheet (Rev. Nov. 12, 2021).

What package type and pin count does the 71V65803S150PFGI use?

The 71V65803S150PFGI is supplied in a 100-pin plastic thin quad flatpack (TQFP), JEDEC standard PKG100, with 14 mm × 20 mm body size and 0.5 mm lead pitch. This matches the 256K × 36 pinout shown in Figure 5 of the datasheet, including dedicated I/O pins (I/O0–I/O31, I/OP1–I/OP4) and control signals (BW1–BW4, ADV/LD, LBO).

How does the burst addressing work on the 71V65803S150PFGI?

Burst addressing is controlled by the ADV/LD and LBO pins. When ADV/LD = HIGH, the internal 4-word burst counter increments; when ADV/LD = LOW, a new external address is loaded. LBO selects linear (LOW) or interleaved (HIGH) order. The 71V65803S150PFGI executes all four burst words synchronously, with data valid two clocks after each ADV/LD assertion - no external address generation logic required.

Is the 71V65803S150PFGI qualified for industrial temperature operation?

Yes, the 71V65803S150PFGI is rated for industrial temperature range (–40°C to +85°C), as specified in the "Recommended Operating Temperature and Supply Voltage" table (Table 5) and "Absolute Maximum Ratings" (Table 6) of the datasheet. This qualification applies to the PFGI suffix variant and is verified across voltage, timing, and functional parameters.