Renesas 71V65903S80BQ8
- Part No.:
- 71V65903S80BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65903S80BQ8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65903S80BQ8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround between read/write cycles, and flow-through outputs. It serves as high-speed buffer memory in network packet processors, telecom line cards, and FPGA co-processor interfaces requiring deterministic burst latency.
For engineers reviewing the 71V65903S80BQ8 datasheet, 71V65903S80BQ8 pinout, 71V65903S80BQ8 application, or 71V65903S80BQ8 equivalent, key selection criteria include its 100 MHz synchronous timing, interleaved/linear 4-word burst capability, individual byte write control (BW1–BW2), industrial temperature support (–40°C to +85°C), and JEDEC-standard 100-pin TQFP package with 3.3V I/O and core supply.
Technical Context
The 71V65903S80BQ8 implements a synchronous dual-edge-triggered architecture with an on-chip burst counter and flow-through output path-no output register-enabling immediate data availability one cycle after address/control sampling. Its ADV/LD pin controls either external address loading (low) or internal burst counter increment (high), while LBO selects linear or interleaved burst order.
Three chip enables (CE1, CE2 active-low; CE2 active-high) allow flexible depth expansion, and asynchronous ZZ sleep mode reduces power by gating the internal clock while retaining data. Clock Enable (CEN) suspends all synchronous operations without affecting output state, and OE remains asynchronous for direct output tri-state control independent of clock timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9.4 Mbit); supports high-bandwidth data buffering in x18 bus configurations |
| Max Clock Frequency | 100 MHz; enables 10 ns cycle time for real-time packet buffering in telecom infrastructure |
| Clock-to-Data Access | 7.5 ns; guarantees deterministic read latency critical for time-sensitive switching logic |
| Burst Capability | 4-word burst (interleaved or linear); reduces address bus overhead and improves throughput in sequential access patterns |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; compatible with standard 3.3V logic domains and eliminates level-shifting needs |
| Operating Temperature | –40°C to +85°C industrial grade; validated for deployment in uncontrolled ambient environments like base station cabinets |
| Zero Bus Turnaround | ZBT™ architecture eliminates dead cycles between read/write transitions; sustains full bandwidth during mixed-access workloads |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous 19-bit address bus; A0–A18 fully utilized for 512K × 18 addressing (219 = 524,288 words) |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 low-active, CE2 high-active) enable seamless depth expansion without external logic |
| R/W | Read/Write Control | Single synchronous signal defining cycle type; determines data direction one cycle after address load |
| ADV/LD | Advance Burst Address / Load New Address | Edge-triggered control: low = load new external address; high = increment internal burst counter |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence; high = interleaved (e.g., cache line access), low = linear (streaming) |
| BW1, BW2 | Individual Byte Write Enables | Two active-low signals controlling 9-bit byte writes (I/O[0:8], I/O[9:17]); supports partial-word updates without read-modify-write |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge; no internal clock division |
| OE | Asynchronous Output Enable | Direct tri-state control of I/O pins; can be tied low for always-enabled reads, eliminating timing-critical OE management |
| ZZ | Asynchronous Sleep Mode | Gates internal clock and reduces dynamic power; data retention guaranteed during sleep; no reinitialization required on wake |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O Pins | 18-bit bidirectional data bus + 2 parity bits; flow-through outputs deliver data one cycle after control sampling |
| VDD, VDDQ, VSS | Power/Ground | Dual 3.3V supplies: VDD (core), VDDQ (I/O); separate planes reduce noise coupling between logic and I/O paths |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations, sustaining 100% bus utilization in burst-heavy traffic flows |
| Flow-Through Outputs | Removes output register delay-data appears on I/O pins one clock cycle after control assertion, enabling tighter system timing closure |
| On-Chip Burst Counter | Generates four sequential addresses internally from a single ADV/LD pulse, reducing address bus toggling and PCB routing complexity |
| Asynchronous ZZ Sleep Mode | Reduces active power by >80% while preserving memory contents; wake latency is zero-cycle-no initialization delay |
| Individual Byte Write (BW1–BW2) | Enables precise 9-bit updates to x18 configuration without disturbing adjacent bytes, critical for protocol header manipulation |
Applications
| Network Packet Buffering | FPGA Co-Processor Interface |
|---|---|
Use Scenario: Storing ingress/egress packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency FIFO buffer between MAC and switch fabric, operating at line rate. Use Value: 7.5 ns clock-to-data access and ZBT™ architecture ensure sub-10 ns read-to-write turnaround, meeting IEEE 802.3 back-to-back frame requirements. | Use Scenario: Offloading packet classification or encryption tasks from CPU to FPGA-accelerated datapath. IC Role / Device Role / Timing Role: Shared memory interface between FPGA logic and host processor, synchronized to common 100 MHz clock domain. Use Value: Flow-through outputs and burst capability reduce handshake overhead, increasing effective bandwidth by 30% vs. registered-output SRAMs in streaming applications. |
| Telecom Line Card Memory | Industrial Real-Time Controller Cache |
Use Scenario: Buffering TDM or ATM cell payloads in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Deterministic latency buffer supporting constant-bit-rate traffic with jitter tolerance < 5 ns. Use Value: Industrial temperature rating (–40°C to +85°C) and 100 MHz stability ensure reliable operation in fanless, sealed chassis environments. | Use Scenario: Caching motion control parameters and sensor fusion data in CNC or robotics controllers. IC Role / Device Role / Timing Role: Low-jitter, interrupt-responsive scratchpad memory for deterministic real-time task execution. Use Value: Asynchronous ZZ sleep mode enables rapid power gating between motion phases, cutting standby power by 75% without compromising wake responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-100AXC | 512K × 18 QDR SRAM; differential clock inputs; 100 MHz DDR interface; no ZBT™ or flow-through outputs | Requires source-synchronous DDR timing design; suited for high-throughput, non-deterministic burst patterns | Select when system uses DDR clocking and requires double-data-rate bandwidth over single-cycle determinism |
| AS7C35128PFSIG | 512K × 18 async SRAM; no clock, no burst, no ZBT™; 15 ns access; 3.3V only | Lacks synchronous timing control; incompatible with clock-domain interfacing or burst protocols | Choose only for legacy designs where clocking is absent and latency tolerance exceeds 15 ns |
Compared with CY7C1371DV33-100AXC and AS7C35128PFSIG, the 71V65903S80BQ8 uniquely delivers deterministic 7.5 ns read latency, zero bus turnaround, and flow-through outputs-making it optimal for hard real-time systems where jitter and cycle predictability outweigh raw bandwidth.
Availability
71V65903S80BQ8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor interfaces, telecom line card memory, and industrial real-time controller cache applications requiring stable component supply across extended product lifecycles.
Supply support for 71V65903S80BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65903S80BQ8 belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for low-latency, high-throughput data buffering in packet-switched and real-time control systems where deterministic timing and bus efficiency are critical.
FAQ
What is the memory organization and total capacity of the 71V65903S80BQ8?
The 71V65903S80BQ8 is organized as 512K × 18, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. This configuration uses 19 address lines (A0–A18) and provides an 18-bit data bus plus two parity bits (I/OP1–I/OP2), making it ideal for systems requiring balanced bandwidth and error detection in telecom and networking hardware.
Does the 71V65903S80BQ8 support both linear and interleaved burst modes?
Yes, the 71V65903S80BQ8 supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear burst (sequential address increment), and LBO = HIGH selects interleaved burst (bit-reversed address pattern). This flexibility allows optimization for streaming (linear) or cache-line-aligned (interleaved) access patterns without firmware changes.
How does the ZBT™ architecture in the 71V65903S80BQ8 eliminate bus turnaround delays?
The ZBT™ architecture in the 71V65903S80BQ8 removes dead cycles between read and write operations by overlapping bus direction control with data transfer. Unlike conventional SRAMs that require idle cycles to change bus direction, the 71V65903S80BQ8 transitions instantly-enabling back-to-back reads and writes at full 100 MHz throughput without arbitration or wait states.
What is the role of the ADV/LD pin in the 71V65903S80BQ8?
The ADV/LD pin in the 71V65903S80BQ8 serves a dual function: when sampled LOW at the rising CLK edge, it loads a new external address into the internal address register; when sampled HIGH, it advances the on-chip burst counter. This single-pin control simplifies timing-critical address sequencing and enables efficient 4-word burst operations with minimal control logic.
Can the 71V65903S80BQ8 operate in low-power mode without losing data?
Yes-the 71V65903S80BQ8 supports full data retention in asynchronous sleep mode activated by driving the ZZ pin HIGH. In this state, the internal clock is gated, dynamic power drops significantly, and all stored data remains intact. The device resumes normal operation immediately upon ZZ returning LOW-no initialization or refresh is needed.
71V65903S80BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65903S80BQ8 FAQ
1.How can I place an order for 71V65903S80BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65903S80BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65903S80BQ8 reliable?
The price and inventory of 71V65903S80BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S80BQ8 is usually 5 days.
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Once your 71V65903S80BQ8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65903S80BQ8?
For technical support, including 71V65903S80BQ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S80BQ8 requirements.
6.How does Aetrix verify that 71V65903S80BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V65903S80BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S80BQ8 meets industry standards.
7.What is the process for return or replacement of 71V65903S80BQ8?
All 71V65903S80BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S80BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65903S80BQ8 part is unused and in its original packaging.
Return procedure for 71V65903S80BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65903S80BQ8 Tags

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M24C02-WMN6TP
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