Renesas 71V65903S80BQG
- Part No.:
- 71V65903S80BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65903S80BQG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65903S80BQG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K x 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround (ZBT) architecture, and flow-through outputs. It serves as high-speed buffer/cache memory in networking switches, packet processors, and FPGA-based data-path systems requiring burst reads/writes without dead cycles.
For engineers reviewing the 71V65903S80BQG datasheet, 71V65903S80BQG pinout, 71V65903S80BQG application, or 71V65903S80BQG equivalent, key selection criteria include its 100 MHz timing, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW2), asynchronous ZZ sleep mode, and JEDEC-standard 165-ball fine-pitch BGA (BQG) package compatibility.
Technical Context
The 71V65903S80BQG implements a synchronous dual-edge-triggered interface with registered address/control inputs and flow-through data outputs-no output register-enabling deterministic 1-cycle latency for read data. Its on-chip burst counter advances on ADV/LD = HIGH, with LBO selecting linear or interleaved sequence.
Three chip enables (CE1, CE2 active-low; CE2 active-high) support depth expansion, while CEN suspends all synchronous operation without affecting output state. The device uses separate VDD (3.3V ±5%) and VDDQ (3.3V ±5%) supplies, and supports industrial temperature range (–40°C to +85°C) with guaranteed data retention in ZZ sleep mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K x 18 (9.4 Mbit); supports depth expansion via three CE pins |
| Clock Frequency | 100 MHz maximum; enables 10 ns cycle time for high-throughput buffering |
| Access Time | 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time systems |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic by 75% per burst initiation |
| Write Control | Individual BW1/BW2 byte enables; allows partial 18-bit word writes without masking logic |
| Power Management | Asynchronous ZZ input gates internal clock; reduces standby current to <100 µA |
| Supply Voltages | VDD = 3.3V ±5%, VDDQ = 3.3V ±5%; decoupled core/I/O rails improve noise immunity |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for telecom infrastructure deployment |
Pinout & Package
Packaged in a JEDEC-standard 165-ball fine-pitch ball grid array (fBGA), designated BQG165, with 1.0 mm ball pitch and 13 mm × 15 mm body size. Pinout optimized for signal integrity: dedicated VSS/VDDQ pairs adjacent to I/O banks, and power/ground balls distributed across all four quadrants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit synchronous address bus; A0–A17 used for 512K x 18 addressing; A18 reserved/not connected |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; enable depth expansion without external logic |
| R/W | Read/Write Control | Synchronous single-pin command; determines cycle direction at load time, not burst time |
| ADV/LD | Advance Burst / Load Address | High = increment internal burst counter; Low = load new external address into register |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3) |
| BW1, BW2 | Byte Write Enables | Active-low controls for two 9-bit bytes (I/O[0:8]/I/OP1 and I/O[9:17]/I/OP2); BW3/BW4 unused in x18 config |
| CLK | System Clock | Single-ended input; all synchronous timing referenced to rising edge; no internal PLL |
| ZZ | Sleep Mode | Asynchronous high-assertion gate; stops internal clock, retains data, draws minimal current |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus with flow-through outputs; no output register; OE not required for normal operation |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3V core supply; VDDQ = 3.3V I/O supply; multiple VSS balls ensure low-impedance return path |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between consecutive reads/writes-critical for back-to-back packet buffering |
| Flow-Through Outputs | Read data appears one clock after address load with no additional latency; simplifies timing closure in high-speed designs |
| On-Chip Burst Counter | Generates 4-word burst addresses internally-reduces external address generation logic and routing congestion |
| Separate VDD/VDDQ Supplies | Enables independent core/I/O voltage domains; improves noise isolation and supports mixed-signal SoC interfacing |
| Asynchronous ZZ Sleep | Reduces active power by >95% during idle periods while preserving memory contents-essential for thermal-constrained systems |
| Industrial Temperature Range | Qualified from –40°C to +85°C; meets GR-468 reliability standards for carrier-grade equipment |
Applications
| Networking Switch Buffer | FPGA Data Path Cache |
|---|---|
Use Scenario: High-speed packet buffering in Layer 2/3 Ethernet switches handling 10 Gbps line rates. IC Role / Device Role / Timing Role: Stores ingress/egress packet headers and metadata with sub-10 ns read/write turnaround. Use Value: ZBT architecture enables back-to-back read-write operations without bus stall, increasing switch throughput by up to 25% vs. standard SSRAMs. |
Use Scenario: Real-time caching of streaming sensor data in Xilinx Kintex Ultrascale+ FPGA-based test equipment. IC Role / Device Role / Timing Role: Acts as low-latency FIFO buffer between ADC interface and processing pipeline. Use Value: Flow-through outputs and 100 MHz clocking allow direct connection to FPGA I/O banks without timing-critical register insertion. |
| Telecom Line Card Memory | Industrial PLC Data Logger |
Use Scenario: Storing configuration tables and real-time statistics in optical transport network (OTN) line cards. IC Role / Device Role / Timing Role: Provides non-blocking access to lookup tables for ODUk frame mapping and performance monitoring. Use Value: Industrial temp rating and ZZ sleep mode ensure reliable operation in uncooled chassis with power budget constraints. |
Use Scenario: Logging high-frequency analog measurements in oil-and-gas downhole telemetry systems. IC Role / Device Role / Timing Role: Buffers sampled data before compression and transmission over RS-485 or wireless link. Use Value: Individual byte write enables selective update of status flags and timestamps without disturbing full 18-bit data words. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1354BV33-100AXC | 512K x 18, 100 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT mode | Requires dual-port controller logic; lacks zero-turnaround benefit for simple ping-pong buffers | Prefer when simultaneous read/write concurrency is required; avoid if ZBT timing simplicity is critical |
| AS7C35128P-10BIN | 512K x 18, 10 ns access, asynchronous interface-no clock, no burst counter, no flow-through | Cannot support 100 MHz system clocks; requires external address sequencing for multi-word transfers | Select only for legacy designs with no timing margin; not suitable for new high-speed data-path implementations |
Compared with CY7C1354BV33-100AXC and AS7C35128P-10BIN, the 71V65903S80BQG delivers deterministic 7.5 ns read latency with zero bus turnaround-enabling simpler controller design and higher effective bandwidth in burst-limited applications like packet switching and real-time buffering.
Availability
71V65903S80BQG is available at Aetrix Electronics and suitable for networking infrastructure, FPGA-based instrumentation, telecom line cards, and industrial data loggers requiring stable component supply across extended product lifecycles.
Supply support for 71V65903S80BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V65903S80BQG belongs to IDT's ZBT™ SRAM family, engineered specifically for zero-latency, high-bandwidth data buffering in packet-switched networks and real-time digital signal processing systems.
FAQ
What is the exact memory organization and capacity of the 71V65903S80BQG?
The 71V65903S80BQG is organized as 512K x 18, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. It uses 19 address lines (A0–A18), though only A0–A17 are functional for 512K addressing; A18 is no-connect in this configuration. This layout supports efficient depth expansion using the three chip enable pins (CE1, CE2, CE2).
Does the 71V65903S80BQG support both linear and interleaved burst modes?
Yes, the 71V65903S80BQG supports both burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, it executes linear bursts (e.g., A0, A1, A2, A3); when LBO = HIGH, it uses interleaved order (e.g., A0, A2, A1, A3). This flexibility allows optimization for sequential data streams or cache-line-aligned access patterns in the 71V65903S80BQG's target applications.
How does the ZBTTM feature eliminate dead cycles in the 71V65903S80BQG?
ZBTTM (Zero Bus Turnaround) in the 71V65903S80BQG removes the traditional bus idle period between consecutive read and write operations. By overlapping address setup for the next cycle with data transfer of the current cycle-and using internal synchronization-the 71V65903S80BQG achieves back-to-back access with no wasted clock cycles, directly improving effective bandwidth in high-throughput buffering.
What is the role of the ZZ pin on the 71V65903S80BQG, and how does it affect power consumption?
The ZZ pin on the 71V65903S80BQG is an asynchronous sleep mode input. When asserted HIGH, it gates the internal clock and places the device in ultra-low-power retention mode (<100 µA typical), while preserving all stored data. This feature is essential for power-sensitive telecom and industrial applications where the 71V65903S80BQG may idle between data bursts without losing context.
Can the 71V65903S80BQG be used with a 3.3V-only system, or does it require separate VDD and VDDQ supplies?
The 71V65903S80BQG requires both VDD (core supply) and VDDQ (I/O supply), each rated at 3.3V ±5%. While they may be tied together in cost-sensitive designs, the datasheet specifies separate decoupling and recommends independent regulation to minimize noise coupling between core logic and I/O drivers-especially critical for maintaining signal integrity at 100 MHz operation in the 71V65903S80BQG.
71V65903S80BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65903S80BQG FAQ
1.How can I place an order for 71V65903S80BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65903S80BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65903S80BQG reliable?
The price and inventory of 71V65903S80BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S80BQG is usually 5 days.
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Once your 71V65903S80BQG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65903S80BQG?
For technical support, including 71V65903S80BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S80BQG requirements.
6.How does Aetrix verify that 71V65903S80BQG is sourced from the original manufacturer or authorized distributors?
All 71V65903S80BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S80BQG meets industry standards.
7.What is the process for return or replacement of 71V65903S80BQG?
All 71V65903S80BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S80BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65903S80BQG part is unused and in its original packaging.
Return procedure for 71V65903S80BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65903S80BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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