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Renesas 71V65903S80PFG8

Part No.:
71V65903S80PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65903S80PFG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,392

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Product details

Overview

71V65903S80PFG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 bits (9,437,184-bit capacity), supporting 100 MHz operation with 7.5 ns clock-to-data access. It implements Zero Bus Turnaround for dead-cycle-free read/write transitions, features flow-through outputs, and uses a synchronous burst counter with linear/interleaved addressing via LBO pin - deployed in high-speed networking and packet buffering systems.

For engineers reviewing the 71V65903S80PFG8 datasheet, 71V65903S80PFG8 pinout, 71V65903S80PFG8 application, or 71V65903S80PFG8 equivalent, key selection criteria include its 100 MHz timing compliance, 3.3V core/I/O supply tolerance (±5%), industrial temperature range (–40°C to +85°C), TQFP-100 package, and ZBT architecture enabling seamless bus turnaround in burst-mode memory subsystems.

Technical Context

The 71V65903S80PFG8 employs a synchronous CMOS architecture with registered address/control inputs triggered on the rising CLK edge, and flow-through (unregistered) data outputs. Its internal burst counter advances on ADV/LD = HIGH, supporting four-word bursts with order selected by static LBO pin (LOW = linear, HIGH = interleaved).

It integrates three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, individual byte write controls (BW1–BW4), asynchronous OE and ZZ pins, and Clock Enable (CEN) for full synchronous suspension. All I/Os are 3.3V-compatible with VDDQ decoupling, and power-down mode retains data with ZZ = HIGH.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 bits (9.4 Mbit); supports depth expansion via CE pins
Clock Frequency 100 MHz maximum; enables 10 ns cycle time for high-throughput buffering
Access Time 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time systems
Supply Voltage VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; separate core/I/O rails reduce noise coupling
Operating Temperature –40°C to +85°C (industrial grade); validated for embedded telecom and industrial control
Burst Capability 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency
Bus Turnaround ZBT™ architecture eliminates dead cycles between reads/writes; critical for pipelined memory controllers

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, lead-free and RoHS-compliant (Pb-free, Green part per ordering info). Pinout matches PKG100 configuration for 512K × 18 variant (documented in Rev. 6.42, Figure 5298 drw 02a).

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs Synchronous 19-bit address bus; A0–A18 fully utilized for 512K × 18 addressing
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high) enable flexible depth expansion
R/W Read/Write Control Single synchronous signal defining cycle type; sampled at rising CLK with ADV/LD low
ADV/LD Advance Burst / Load Address Loads new external address when LOW; increments internal burst counter when HIGH
LBO Linear/Interleaved Burst Order Static input selecting burst sequence; LOW = linear, HIGH = interleaved (no runtime change)
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte writes; BW1–BW4 map to I/O[0:15] + I/OP1–I/OP2
I/O0–I/O15, I/OP1–I/OP2 Data I/O 18-bit bidirectional data bus (16 data + 2 parity); flow-through output path, registered input path
CLK System Clock Primary timing reference; all synchronous operations aligned to rising edge
OE Output Enable Asynchronous; tri-states outputs when HIGH; may be tied LOW for continuous read operation
ZZ Sleep Mode Asynchronous; gates internal CLK and reduces power; data retention guaranteed

Key Features

Feature Design Value
ZBTTM Architecture Eliminates bus turnaround dead cycles between consecutive reads/writes - essential for sustained burst throughput
Internally Synchronized OE Removes need for external OE timing control; simplifies interface logic and reduces PCB routing complexity
4-Word Burst Counter Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences for cache-line alignment
Individual Byte Write (BW1–BW4) Enables precise 9-bit sub-word writes without masking logic; critical for partial updates in protocol stacks
Three Chip Enables Supports seamless depth expansion across multiple devices without external decoding logic
Flow-Through Outputs Delivers data one clock cycle after access with no output register delay - minimizes read latency

Applications

Packet Buffering in Switch ASICs Line Card Memory in Telecom Routers

Use Scenario: High-speed packet buffering in Layer 2/3 switching fabric where back-to-back frame reads/writes occur at line rate.

IC Role / Device Role / Timing Role: Primary burst-access SRAM providing zero-turnaround storage for ingress/egress queues and descriptor tables.

Use Value: 7.5 ns tCD and ZBT architecture sustain 100 MHz sustained bandwidth, eliminating pipeline stalls during mixed read/write traffic.

Use Scenario: Storing forwarding tables and packet metadata in modular router line cards operating in extended temperature environments.

IC Role / Device Role / Timing Role: Industrial-grade synchronous SRAM interfaced to FPGA-based traffic managers requiring deterministic latency and burst efficiency.

Use Value: –40°C to +85°C rating and 3.3V ±5% supply tolerance ensure reliability in uncontrolled chassis thermal zones.

Real-Time Video Frame Buffers Industrial PLC Data Logging

Use Scenario: Dual-port frame buffering in HD video processing pipelines where sequential pixel block transfers dominate.

IC Role / Device Role / Timing Role: High-bandwidth memory buffer supporting 4-word interleaved bursts synchronized to pixel clock domain.

Use Value: Interleaved burst mode aligns with common video memory access patterns, improving effective bandwidth by >30% vs. linear.

Use Scenario: Cyclic data acquisition and timestamped event logging in programmable logic controllers with deterministic scan cycles.

IC Role / Device Role / Timing Role: Non-volatile-retentive buffer (via ZZ sleep mode) capturing sensor history during brown-out conditions.

Use Value: ZZ pin enables hardware-controlled low-power retention state with guaranteed data hold - extends backup time without external circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-100AXC 512K × 18, 100 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT feature Requires dual-port controller logic; lacks zero-turnaround benefit for single-bus systems Prefer when simultaneous read/write concurrency is required over bus turnaround elimination
AS7C35128PFSIG 512K × 18, 100 MHz, standard sync SRAM (no ZBT, no burst counter, no ADV/LD) Needs external address sequencing logic for multi-word access; higher controller overhead Choose for cost-sensitive designs where burst efficiency and ZBT are non-critical

Compared with CY7C1371DV33-100AXC and AS7C35128PFSIG, the 71V65903S80PFG8 uniquely delivers ZBT-enabled dead-cycle elimination and integrated burst addressing - reducing system-level timing constraints and simplifying controller design for high-throughput single-bus memory interfaces.

Availability

71V65903S80PFG8 is available at Aetrix Electronics and suitable for packet buffering, telecom line card memory, real-time video frame storage, and industrial PLC data logging requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for 71V65903S80PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V65903S80PFG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet-processing and real-time buffering applications where deterministic timing and burst efficiency are critical.

FAQ

What memory organization does the 71V65903S80PFG8 support?

The 71V65903S80PFG8 is configured as 512K × 18 bits (9,437,184 total bits), optimized for systems requiring wide data paths with moderate depth. This organization maps directly to 19 address lines (A0–A18) and supports depth expansion using its three chip enable pins (CE1, CE2, CE2). The 71V65903S80PFG8 does not support the 256K × 36 configuration - that is exclusive to the 71V65703 variant.

Does the 71V65903S80PFG8 require external OE control?

No - the 71V65903S80PFG8 features internally synchronized output enable logic, eliminating the need for precise OE timing control. The OE pin is asynchronous but can be tied LOW permanently in most applications since output drivers remain enabled during valid read cycles. This simplifies PCB layout and removes a critical timing constraint from the memory interface design.

How does the ZBTTM feature improve performance in the 71V65903S80PFG8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65903S80PFG8 removes idle cycles between consecutive read and write operations. Unlike conventional SRAMs that require bus release/reacquisition, the 71V65903S80PFG8 transitions seamlessly - enabling back-to-back burst accesses at full 100 MHz. This directly increases effective memory bandwidth in packet-forwarding and streaming applications.

What is the role of the ADV/LD and LBO pins on the 71V65903S80PFG8?

On the 71V65903S80PFG8, ADV/LD controls burst counter behavior: LOW loads a new external address, HIGH advances the internal counter. LBO selects burst order - LOW enables linear sequence (0,1,2,3), HIGH enables interleaved (0,2,3,1). Both are static inputs; LBO must remain stable during operation, and ADV/LD timing is synchronous to CLK with setup/hold requirements.

Is the 71V65903S80PFG8 compatible with industrial temperature requirements?

Yes - the 71V65903S80PFG8 is qualified for industrial temperature operation from –40°C to +85°C, with full electrical specifications guaranteed across this range. Its 3.3V ±5% supply tolerance (VDD and VDDQ), robust input thresholds, and ZZ sleep-mode data retention make it suitable for deployment in uncontrolled thermal environments such as base station line cards and factory automation controllers.

71V65903S80PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65903S80PFG8 FAQ

1.How can I place an order for 71V65903S80PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65903S80PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65903S80PFG8 reliable?

The price and inventory of 71V65903S80PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S80PFG8 is usually 5 days.

3.What payment methods are accepted for 71V65903S80PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65903S80PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65903S80PFG8?

71V65903S80PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65903S80PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65903S80PFG8?

For technical support, including 71V65903S80PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S80PFG8 requirements.

6.How does Aetrix verify that 71V65903S80PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V65903S80PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S80PFG8 meets industry standards.

7.What is the process for return or replacement of 71V65903S80PFG8?

All 71V65903S80PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S80PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65903S80PFG8 part is unused and in its original packaging.

Return procedure for 71V65903S80PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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