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Renesas 71V65903S80PFGI8

Part No.:
71V65903S80PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65903S80PFGI8.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,617

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Product details

Overview

71V65903S80PFGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 bits (9,437,184-bit capacity), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround (ZBT) architecture, and flow-through outputs. It serves as high-speed buffer/cache memory in networking switches, packet processors, and FPGA-based data-path subsystems requiring burst read/write without dead cycles.

For engineers reviewing the 71V65903S80PFGI8 datasheet, 71V65903S80PFGI8 pinout, 71V65903S80PFGI8 application, or 71V65903S80PFGI8 equivalent, key selection criteria include its 100 MHz synchronous timing, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW2), industrial temperature range (–40°C to +85°C), and TQFP-100 packaging with 3.3V core/I/O supplies.

Technical Context

The 71V65903S80PFGI8 implements a synchronous dual-edge-triggered interface with a dedicated burst counter controlled by ADV/LD and LBO pins, enabling deterministic 4-word burst sequences either linear or interleaved. Its flow-through output architecture eliminates output registers, reducing read latency while relying on external OE for asynchronous output control.

It features three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, Clock Enable (CEN) for full-cycle suspension, and ZZ sleep mode for low-power retention. All address, control, and data-in signals are registered on the rising CLK edge, with strict setup/hold timing referenced solely to that edge.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 bits (9.4 Mbit); supports x18 configuration only - defines data bus width and address space (A0–A18).
Clock Frequency 100 MHz maximum - enables 10 ns cycle time; directly determines system throughput in burst and random-access modes.
Access Time 7.5 ns clock-to-data (tCD) - specifies minimum delay from CLK rising edge to valid output data under flow-through operation.
Burst Capability 4-word burst (interleaved or linear) - reduces address overhead; LBO pin selects sequence order statically.
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise regulation; no power sequencing needed.
Operating Temperature –40°C to +85°C (industrial grade) - validated for extended thermal environments in telecom and industrial equipment.
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly; pin-compatible with 71V65703 in same package.

Pinout & Package

71V65903S80PFGI8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm lead pitch. Pin functions are fully defined per the 512K × 18 configuration - note that A18 is used (vs. A17 in 256K × 36 variant), and BW3/BW4 are NC.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs Synchronous inputs latched on rising CLK edge when ADV/LD = LOW; define 512K-word address space.
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high); any false enable deselects device in one cycle.
R/W Read/Write Control Synchronous signal determining cycle type; sampled at rising CLK with ADV/LD = LOW to initiate load access.
ADV/LD Advance Burst / Load Address LOW loads new external address; HIGH advances internal burst counter - controls burst sequencing behavior.
LBO Linear/Interleaved Burst Order Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during operation.
BW1, BW2 Byte Write Enables Active-low synchronous controls for 9-bit bytes I/O[0:8]/I/OP1 and I/O[9:17]/I/OP2; BW3/BW4 are No Connect in x18 mode.
CLK System Clock Input Rising edge triggers all synchronous registers; all timing references (setup/hold, tCD, tCO) are defined relative to this edge.
OE Output Enable Asynchronous, active-low; tri-states outputs immediately - allows dynamic output gating without affecting internal state.
ZZ Sleep Mode Input Asynchronous, active-high; gates internal CLK and reduces power; retains memory contents with VDD applied.
I/O0–I/O17, I/OP1–I/OP2 Data I/O Pins 18-bit bidirectional data bus (16 data + 2 parity); flow-through outputs require OE control; inputs registered on CLK rise.

Key Features

Feature Design Value
ZBTTM Architecture Eliminates dead bus cycles between consecutive reads/writes - enables back-to-back burst transfers without turnaround penalty.
Internally Synchronized OE Removes need for external OE timing control; OE can be tied LOW permanently in most applications without performance loss.
Single R/W Pin Reduces control line count vs. separate RD/WR signals - simplifies ASIC/FPGA interface logic and PCB routing.
Four-Word Burst Counter Generates sequential addresses internally after initial load - cuts address bus activity by 75% during burst transfers.
Individual Byte Write (x18) Enables selective 9-bit writes via BW1/BW2 - supports partial word updates without read-modify-write overhead.
Industrial Temperature Range Validated operation from –40°C to +85°C - suitable for uncontrolled environments in base stations, routers, and motor drives.

Applications

Network Packet Buffering FPGA Co-Processor Cache

Use Scenario: High-throughput line cards in Ethernet switches buffering ingress/egress packets at 10 Gbps+ rates.

IC Role / Device Role / Timing Role: Primary burst-access SRAM providing zero-turnaround read/write for packet header parsing and forwarding tables.

Use Value: 100 MHz clock rate and 4-word burst reduce memory controller latency by >30% vs. asynchronous SRAM, improving packet processing throughput.

Use Scenario: Offloading compute-intensive tasks (e.g., CRC, encryption) from host CPU using FPGA-accelerated pipelines.

IC Role / Device Role / Timing Role: Low-latency local cache for FPGA logic blocks accessing shared instruction/data buffers.

Use Value: Flow-through outputs and single-cycle deselect enable deterministic timing closure in FPGA timing-constrained designs.

Telecom Baseband Processing Industrial Motion Controller Buffer

Use Scenario: Real-time digital signal processing in 4G/5G remote radio units handling multiple antenna streams.

IC Role / Device Role / Timing Role: Synchronous frame buffer interfacing with DSP cores and high-speed serial interfaces (JESD204B).

Use Value: 7.5 ns tCD and 3.3V I/O compatibility simplify interface to TI C66xx or Xilinx Zynq RFSoC I/O banks.

Use Scenario: Closed-loop servo control systems requiring jitter-free position/velocity data exchange between MCU and motor drivers.

IC Role / Device Role / Timing Role: Deterministic latency buffer for motion profile look-up tables and real-time feedback storage.

Use Value: Industrial temp rating and ZZ sleep mode support reliable operation in cabinet-mounted controllers with thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-100AXC 100 MHz, 512K × 18, but uses QDR-II architecture with separate read/write ports and differential clocks - no ZBT or burst counter. Requires dual-port controller logic; better for simultaneous read/write, worse for simple burst streaming. Choose for true concurrent access; avoid if ZBT timing or single-clock simplicity is required.
AS7C35128PFS-10BIN 100 MHz, 512K × 18, but asynchronous interface with 10 ns access - lacks burst, ZBT, CLK, CEN, or ADV/LD logic. No burst capability or synchronous control; higher latency per access; simpler interface but lower peak bandwidth. Choose for legacy designs or cost-sensitive non-burst applications; not drop-in compatible.

Compared with CY7C1371DV33-100AXC and AS7C35128PFS-10BIN, the 71V65903S80PFGI8 uniquely delivers zero-turnaround burst transfers with minimal control logic - critical for deterministic latency in packet buffering and real-time control where back-to-back accesses dominate.

Availability

71V65903S80PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, telecom baseband processing, and industrial motion controller buffer applications requiring stable component supply across long production lifecycles.

Supply support for 71V65903S80PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V65903S80PFGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed data-path applications demanding deterministic burst access, zero bus turnaround, and industrial-grade reliability in telecom and networking equipment.

FAQ

What is the memory organization of the 71V65903S80PFGI8?

The 71V65903S80PFGI8 is organized as 512K × 18 bits (9,437,184 total bits), meaning it has 524,288 addressable words, each 18 bits wide. This configuration uses address lines A0–A18 and supports only the x18 data bus mode - distinct from the 256K × 36 variant (71V65703) which shares the same pinout but different internal mapping. The 71V65903S80PFGI8 does not support x36 operation.

Does the 71V65903S80PFGI8 support burst read and write operations?

Yes, the 71V65903S80PFGI8 supports 4-word synchronous burst operations for both reads and writes. Burst mode is initiated by sampling ADV/LD = HIGH after an initial load cycle (ADV/LD = LOW). The sequence order - linear or interleaved - is selected by the static LBO pin. Burst transfers occur automatically without additional address inputs, reducing bus overhead and improving effective bandwidth in streaming applications.

What is the function of the ZZ pin on the 71V65903S80PFGI8?

The ZZ pin on the 71V65903S80PFGI8 is an asynchronous active-high sleep mode input. When asserted, it gates the internal clock and places the device in low-power retention mode while maintaining data integrity. VDD must remain applied; current draw drops significantly, and all outputs go high-impedance. ZZ is internally pulled to VSS if left unconnected, so external pull-down is not required unless active control is needed.

How many byte write enable signals are functional in the 71V65903S80PFGI8?

In the 71V65903S80PFGI8 (512K × 18 configuration), only BW1 and BW2 are functional - controlling 9-bit bytes I/O[0:8]/I/OP1 and I/O[9:17]/I/OP2 respectively. BW3 and BW4 are No Connect (NC) per the 512K × 18 pinout diagrams and truth tables. This differs from the 256K × 36 variant (71V65703), where all four BWx signals are active for 36-bit writes.

Is the 71V65903S80PFGI8 pin-compatible with other members of the 71V65703/65903 family?

Yes, the 71V65903S80PFGI8 is pin-compatible with the 71V65703 in the same 100-pin TQFP package - sharing identical pin assignments for power, clock, control, and I/O. However, internal functionality differs: the 71V65903S80PFGI8 uses A18 and disables BW3/BW4, while the 71V65703 uses A17 and enables all four BWx signals. PCB layout may be reused, but firmware and timing constraints must reflect the x18 organization.

71V65903S80PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65903S80PFGI8 FAQ

1.How can I place an order for 71V65903S80PFGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65903S80PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65903S80PFGI8 reliable?

The price and inventory of 71V65903S80PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S80PFGI8 is usually 5 days.

3.What payment methods are accepted for 71V65903S80PFGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65903S80PFGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65903S80PFGI8?

71V65903S80PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65903S80PFGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65903S80PFGI8?

For technical support, including 71V65903S80PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S80PFGI8 requirements.

6.How does Aetrix verify that 71V65903S80PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65903S80PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S80PFGI8 meets industry standards.

7.What is the process for return or replacement of 71V65903S80PFGI8?

All 71V65903S80PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S80PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65903S80PFGI8 part is unused and in its original packaging.

Return procedure for 71V65903S80PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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