Renesas 71V65903S85BG
- Part No.:
- 71V65903S85BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65903S85BG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65903S85BG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K x 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access. It implements zero bus turnaround (ZBT) architecture to eliminate dead cycles between read/write transitions, features flow-through outputs, and uses a synchronous burst counter for 4-word interleaved or linear sequences - deployed in high-speed networking packet buffers and telecom baseband subsystems.
For engineers reviewing the 71V65903S85BG datasheet, 71V65903S85BG pinout, 71V65903S85BG application, or 71V65903S85BG equivalent, key selection criteria include its 100 MHz timing compliance, 3.3V core/I/O supply tolerance (±5%), industrial temperature range (–40°C to +85°C), TQFP-100 package footprint, and support for individual byte write control (BW1–BW2) in x18 configuration.
Technical Context
The 71V65903S85BG employs a synchronous dual-register architecture: address/control signals are latched on the rising CLK edge when ADV/LD is low and chip enables are active, while data output follows one cycle later via flow-through path (no output register). Its burst counter advances on ADV/LD high, selecting sequence order via static LBO pin.
Three chip enables (CE1, CE2 active-low; CE2 active-high) enable depth expansion; CEN suspends all synchronous logic without affecting output state; ZZ enables asynchronous sleep mode with guaranteed data retention. OE is asynchronous and can be tied low for simplified read access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9.4 Mbit), x18 data bus width - matches 16-bit processor interfaces and DSP memory-mapped peripherals. |
| Max Clock Frequency | 100 MHz - enables 10 ns cycle time for real-time packet buffering in 10G Ethernet line cards. |
| Clock-to-Data Access | 7.5 ns - defines minimum latency from CLK rise to valid Q output, critical for tight-timing backplane interfaces. |
| Supply Voltage | VDD = VDDQ = 3.3 V ±5% - requires single 3.3V rail with decoupling per JEDEC TQFP layout guidelines. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade deployment in outdoor wireless infrastructure and industrial PLCs. |
| Burst Capability | 4-word linear/interleaved burst - reduces address bus toggling and controller overhead in sequential DMA transfers. |
| Write Control | Individual BW1/BW2 byte enables - supports partial writes to upper/lower 16-bit lanes without masking logic. |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per PKG100 configuration for 512K × 18 variant (document 5298 drw 02a).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit synchronous address bus; A0–A18 fully utilized for 512K × 18 addressing (219 = 524,288 words). |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high - allows flexible depth expansion with no external logic. |
| R/W | Read/Write Control | Synchronous signal sampled at CLK rise; determines cycle type (read or write) for loaded address. |
| ADV/LD | Advance Burst / Load Address | Low = load new external address; High = increment internal burst counter - controls burst sequencing timing. |
| BW1, BW2 | Byte Write Enables | Active-low enables for lower (I/O0–I/O7, I/OP1) and upper (I/O8–I/O15, I/OP2) 16-bit bytes - enables partial writes. |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge (except OE and ZZ). |
| OE | Asynchronous Output Enable | Active-low; tri-states outputs immediately - usable for bus sharing without clock synchronization. |
| ZZ | Asynchronous Sleep Mode | Active-high; gates internal CLK and reduces power to standby level while retaining memory contents. |
| I/O0–I/O15, I/OP1–I/OP2 | Data I/O Pins | 18-bit bidirectional data bus (16 data + 2 parity); registered input path, flow-through output path. |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3V core supply; VDDQ = 3.3V I/O supply (separate for noise isolation); VSS = common ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations - increases effective bus utilization by up to 30% in burst-intensive traffic. |
| Internally Synchronized OE | Removes need for external OE timing control - simplifies PCB layout and eliminates setup/hold violations on shared buses. |
| Single R/W Pin | Reduces control signal count versus separate RD/WR lines - saves FPGA I/O pins and simplifies address decoder logic. |
| 4-Word Burst Counter | Generates sequential addresses internally - cuts external address bus toggling and controller intervention during DMA bursts. |
| Three Chip Enables | Enables seamless depth expansion across multiple devices without glue logic - supports configurable memory banks up to 4M×18. |
Applications
| Telecom Packet Buffering | Industrial PLC Data Logging |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with cut-through switching. IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly to MAC controllers via 18-bit parallel bus. Use Value: 7.5 ns clock-to-data access and ZBT architecture minimize frame queuing delay, enabling sub-10 µs forwarding latency. |
Use Scenario: Cyclic acquisition of sensor data (temperature, pressure, analog inputs) in ruggedized factory-floor controllers. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM for runtime parameter storage and firmware update staging. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V supply tolerance ensure reliable operation in unconditioned enclosures. |
| Baseband Signal Processing | Test Equipment Waveform Memory |
|
Use Scenario: Real-time buffering of IQ samples between ADC/DAC and FPGA-based FFT engines in 5G NR radio units. IC Role / Device Role / Timing Role: Synchronous burst-access memory aligned to FPGA DDR clock domains using ADV/LD-controlled addressing. Use Value: 4-word interleaved burst mode matches FFT twiddle factor access patterns, reducing external memory controller complexity. |
Use Scenario: Storing calibrated waveform templates (sinusoids, pulses, modulated carriers) in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Static, deterministic-access memory mapped to microcontroller's external bus interface for glitch-free playback. Use Value: Flow-through outputs and asynchronous OE allow precise timing control over waveform output edges, critical for <100 ps jitter budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-100BZXI | 100 MHz, 512K × 18, but uses pipelined output register (not flow-through); requires OE control for output timing. | Lacks ZBT architecture - introduces 1-cycle turnaround penalty in mixed read/write streams. | Prefer 71V65903S85BG where zero-turnaround is required; choose CY7C1355BV18-100BZXI only if pipelined output timing better suits system clock domain crossing. |
| AS7C35128P-10JCN | 10 ns access, 512K × 18, but asynchronous interface - no CLK, ADV/LD, or burst counter; simpler control but no ZBT benefit. | No burst capability or synchronous timing - suitable only for non-burst, low-frequency control-plane memory. | Select 71V65903S85BG for high-speed data-path buffering; use AS7C35128P-10JCN only for legacy designs requiring pin-compatible drop-in replacement of older async SRAMs. |
Compared with CY7C1355BV18-100BZXI and AS7C35128P-10JCN, the 71V65903S85BG uniquely delivers zero bus turnaround, flow-through outputs, and programmable burst sequencing - making it optimal for real-time packet and sample buffering where deterministic latency and bus efficiency are critical.
Availability
71V65903S85BG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and test equipment applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.
Supply support for 71V65903S85BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 71V65903S85BG belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-turnaround, burst-capable buffering in high-speed data-path applications such as network switches, baseband processors, and instrumentation systems.
FAQ
What is the memory organization and total capacity of the 71V65903S85BG?
The 71V65903S85BG is organized as 512K × 18, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. This configuration provides an 18-bit data bus (16 data + 2 parity bits) and uses 19 address lines (A0–A18) to access the full memory space - optimized for 16-bit microprocessor and DSP interfaces requiring parity protection.
Does the 71V65903S85BG support burst mode, and how is burst order controlled?
Yes, the 71V65903S85BG supports 4-word burst mode using an internal synchronous counter. Burst order is selected by the LBO pin: LBO = VDD enables interleaved sequence; LBO = VSS enables linear sequence. The ADV/LD pin controls counter advancement - low loads a new address, high increments the counter - enabling efficient DMA transfers without external address generation.
What package type and pin count does the 71V65903S85BG use?
The 71V65903S85BG is supplied in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), measuring 14 mm × 20 mm with 0.5 mm lead pitch. This package is verified for the 512K × 18 configuration and includes dedicated VDD, VDDQ, and VSS pins distributed for low-noise power delivery - compatible with standard surface-mount assembly processes.
How does the 71V65903S85BG implement zero bus turnaround (ZBT)?
The 71V65903S85BG achieves ZBT by eliminating idle cycles between read and write operations through synchronized control logic and flow-through outputs. When ADV/LD and R/W change states mid-burst, the device transitions seamlessly - for example, a burst read followed immediately by a burst write incurs no dead cycles, maximizing bus bandwidth in high-throughput packet buffering applications.
Can the 71V65903S85BG operate in low-power mode, and how is it activated?
Yes, the 71V65903S85BG supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and dynamic power drops significantly while retaining all stored data. This mode is fully compliant across the industrial temperature range (–40°C to +85°C) and requires no additional sequencing - making it ideal for power-constrained telecom and portable test equipment.
71V65903S85BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65903S85BG FAQ
1.How can I place an order for 71V65903S85BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65903S85BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65903S85BG reliable?
The price and inventory of 71V65903S85BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S85BG is usually 5 days.
3.What payment methods are accepted for 71V65903S85BG?
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71V65903S85BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65903S85BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65903S85BG?
For technical support, including 71V65903S85BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S85BG requirements.
6.How does Aetrix verify that 71V65903S85BG is sourced from the original manufacturer or authorized distributors?
All 71V65903S85BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85BG meets industry standards.
7.What is the process for return or replacement of 71V65903S85BG?
All 71V65903S85BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65903S85BG part is unused and in its original packaging.
Return procedure for 71V65903S85BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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