Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V65903S85BGGI

Part No.:
71V65903S85BGGI
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65903S85BGGI.pdf
Description:
IC SRAM 9MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,997

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V65903S85BGGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access. It features zero bus turnaround (ZBT), flow-through outputs, burst counter, and individual byte write control. It is used in high-speed networking buffers, packet switching ASIC interfaces, and telecom line card memory subsystems requiring deterministic latency.

For engineers reviewing the 71V65903S85BGGI datasheet, 71V65903S85BGGI pinout, 71V65903S85BGGI application, or 71V65903S85BGGI equivalent, key selection criteria include ZBT timing compliance, 100 MHz burst read/write capability, industrial temperature support (–40°C to +85°C), and compatibility with JEDEC-standard 119-ball BGA (BGG) packaging.

Technical Context

The 71V65903S85BGGI implements a synchronous, clock-driven architecture where address/control registration occurs on the rising CLK edge, and data transfer occurs one cycle later. Its internal burst counter supports linear or interleaved 4-word bursts controlled by the static LBO pin, with ADV/LD determining whether to load a new external address (low) or increment the counter (high).

ZBT operation eliminates dead cycles between read and write transitions via synchronized output buffer enable and single R/W control. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, and includes asynchronous ZZ sleep mode and OE for output control - enabling low-power retention and flexible bus management in multi-SRAM systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 (9.4 Mbit); supports x18 data width only - no x36 mode in this variant
Clock Frequency 100 MHz max; enables 10 ns cycle time for sustained burst transfers
Access Time 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time packet buffering
Supply Voltages VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Operating Temperature –40°C to +85°C (industrial grade); qualified for telecom and industrial embedded environments
Burst Capability 4-word linear/interleaved burst; reduces address bus traffic and improves throughput in sequential access patterns
Byte Write Control BW1–BW2 (x18 config); enables selective 9-bit byte writes without masking logic in controller

Pinout & Package

Packaged in a JEDEC-standard 119-ball fine-pitch ball grid array (fBGA), designated BGG119 per IDT documentation. Pin pitch is 0.8 mm; package body size is 12 mm × 12 mm. This variant (71V65903S85BGGI) corresponds to the 512K × 18 configuration and uses the BG119/BGG119 footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit synchronous address bus; A0–A18 fully utilized for 512K × 18 addressing (219 = 524,288 words)
CE1, CE2, CE2 Chip Enables Three independent enables: CE1/CE2 active-low, CE2 active-high; allow hierarchical depth expansion without external logic
R/W Read/Write Control Single synchronous signal defining cycle type; eliminates need for separate RD/WR pins and simplifies controller interface
ADV/LD Advance Burst Address / Load New Address Synchronous control: low loads new external address; high increments internal burst counter - critical for burst sequencing
LBO Linear/Interleaved Burst Order Static input selecting burst sequence; ties directly to system bus protocol requirements (e.g., PCI-X vs. custom ASIC)
BW1, BW2 Individual Byte Write Enables Two active-low enables for 9-bit bytes (I/O[0:8], I/O[9:17]); supports partial writes without full-word overwrite overhead
CLK System Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge - defines maximum system bandwidth
ZZ Sleep Mode Input Asynchronous high-assertion gates internal clock and reduces ICC to ≤10 µA; retains data during low-power standby
I/O0–I/O17, I/OP1–I/OP2 Data I/O Pins 18 data bits + 2 parity bits; flow-through outputs eliminate output register delay - essential for ZBT timing compliance

Key Features

Feature Design Value
Zero Bus Turnaround (ZBT) Eliminates dead cycles between read/write transitions - enables back-to-back memory operations at full 100 MHz
Flow-Through Outputs No output register; data appears on I/O pins with fixed tCD delay - removes output timing uncertainty for timing-critical designs
4-Word Burst Counter Reduces address bus activity by 75% during sequential accesses; supported in both linear and interleaved modes
Separate VDD/VDDQ Supplies Isolates core logic noise from I/O switching noise - improves signal integrity in high-speed parallel bus implementations
Industrial Temperature Range Qualified from –40°C to +85°C - suitable for uncontrolled environments like base station cabinets and industrial PLCs
Asynchronous Sleep (ZZ) Reduces standby current to microamp level while retaining memory contents - extends uptime in battery-backed systems

Applications

Telecom Packet Buffering Network Processor Interface

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line cards before classification or forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to network processor's parallel bus.

Use Value: ZBT and 100 MHz burst capability enable sustained 1.8 Gbps (18-bit × 100 MHz) throughput without wait states.

Use Scenario: Acting as instruction/data cache for programmable network processors handling deep packet inspection.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access to microcode and packet metadata tables.

Use Value: Flow-through outputs and 7.5 ns tCD ensure pipeline-aligned reads/writes matching processor clock domain.

Industrial PLC Data Logging Medical Imaging Frame Store

Use Scenario: Capturing sensor history or motion-control trajectory data in real-time automation systems.

IC Role / Device Role / Timing Role: Non-volatile-retentive buffer holding timestamped process variables between controller polls.

Use Value: Industrial temp rating and ZZ sleep mode allow reliable operation in hot enclosures with periodic power gating.

Use Scenario: Temporary storage of uncompressed ultrasound or MRI frame data prior to compression or display rendering.

IC Role / Device Role / Timing Role: High-speed frame buffer interfacing to FPGA-based image acquisition engines.

Use Value: 512K × 18 organization matches common 16-bit pixel + 2-bit metadata formats; burst mode accelerates full-frame reads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371BV33-100AXC 512K × 18, 100 MHz, but uses QDR-II architecture with separate read/write ports; no ZBT or flow-through outputs Requires dual-port controller logic; better for simultaneous read/write; unsuitable for ZBT-constrained legacy buses Select when system needs concurrent access - not for drop-in replacement of 71V65903S85BGGI
AS7C35128PFS-100BIN 512K × 18, 100 MHz, standard sync SRAM (no ZBT); 10 ns tCD; different pinout and no burst counter Lacks burst capability and zero-turnaround - requires more address cycles and controller overhead for sequential access Use only if ZBT and burst features are unnecessary and PCB layout allows rework for non-compatible pin mapping

Compared with CY7C1371BV33-100AXC and AS7C35128PFS-100BIN, the 71V65903S85BGGI uniquely delivers ZBT timing, flow-through outputs, and integrated burst counter in a JEDEC BGG119 package - making it irreplaceable in legacy telecom and ASIC-coherent designs requiring strict cycle-deterministic behavior.

Availability

71V65903S85BGGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.

Supply support for 71V65903S85BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.

The 71V65903 belongs to IDT's ZBT SRAM product line, designed specifically for high-speed packet processing, network switching, and ASIC/FPGA co-processor memory interfaces demanding zero bus turnaround and deterministic latency.

FAQ

What memory organization does the 71V65903S85BGGI support?

The 71V65903S85BGGI is configured exclusively as 512K × 18 (9.4 Mbit), with 19 address lines (A0–A18) and 18 data bits plus two parity bits (I/O0–I/O17, I/OP1–I/OP2). Unlike the 71V65703, it does not support the 256K × 36 mode - this is a fixed x18 device per its BGG119 pinout and functional description.

Does the 71V65903S85BGGI support burst read and write operations?

Yes, the 71V65903S85BGGI supports 4-word synchronous bursts in both linear and interleaved sequences, controlled by the LBO pin. Burst initiation requires ADV/LD = HIGH after initial address load, and burst cycles execute automatically with internal counter advancement - reducing controller address bus burden significantly.

What is the purpose of the ZZ pin on the 71V65903S85BGGI?

The ZZ pin on the 71V65903S85BGGI is an asynchronous sleep mode input. When driven HIGH, it internally gates the CLK signal and reduces ICC to ≤10 µA while guaranteeing full data retention - enabling ultra-low-power standby in battery-backed or thermally constrained applications without external power sequencing.

How does the 71V65903S85BGGI achieve zero bus turnaround (ZBT)?

The 71V65903S85BGGI achieves ZBT through internally synchronized output buffer enable (eliminating external OE timing constraints) and a single R/W control pin that removes bus direction arbitration delays. Combined with flow-through outputs and deterministic 7.5 ns tCD, it enables immediate read-after-write or write-after-read transitions at 100 MHz without dead cycles.

Is the 71V65903S85BGGI compatible with commercial-grade systems?

No - the 71V65903S85BGGI is specified only for industrial temperature operation (–40°C to +85°C) and carries the 'I' suffix in its ordering code. It is not rated or tested for commercial 0°C to +70°C use; systems requiring commercial grade must select alternate variants such as the 71V65903S85BG or verify qualification data separately.

71V65903S85BGGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65903S85BGGI FAQ

1.How can I place an order for 71V65903S85BGGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65903S85BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65903S85BGGI reliable?

The price and inventory of 71V65903S85BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S85BGGI is usually 5 days.

3.What payment methods are accepted for 71V65903S85BGGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65903S85BGGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65903S85BGGI?

71V65903S85BGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65903S85BGGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65903S85BGGI?

For technical support, including 71V65903S85BGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S85BGGI requirements.

6.How does Aetrix verify that 71V65903S85BGGI is sourced from the original manufacturer or authorized distributors?

All 71V65903S85BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85BGGI meets industry standards.

7.What is the process for return or replacement of 71V65903S85BGGI?

All 71V65903S85BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85BGGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65903S85BGGI part is unused and in its original packaging.

Return procedure for 71V65903S85BGGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65903S85BGGI Tags

  • 71V65903S85BGGI
  • 71V65903S85BGGI PDF
  • 71V65903S85BGGI Datasheet
  • 71V65903S85BGGI Specifications
  • 71V65903S85BGGI Images
  • Renesas
  • Renesas 71V65903S85BGGI
  • Buy 71V65903S85BGGI
  • 71V65903S85BGGI Price
  • 71V65903S85BGGI Distributor
  • 71V65903S85BGGI Supplier
  • 71V65903S85BGGI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER