Renesas 71V65903S85BGGI
- Part No.:
- 71V65903S85BGGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65903S85BGGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,997
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V65903S85BGGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access. It features zero bus turnaround (ZBT), flow-through outputs, burst counter, and individual byte write control. It is used in high-speed networking buffers, packet switching ASIC interfaces, and telecom line card memory subsystems requiring deterministic latency.
For engineers reviewing the 71V65903S85BGGI datasheet, 71V65903S85BGGI pinout, 71V65903S85BGGI application, or 71V65903S85BGGI equivalent, key selection criteria include ZBT timing compliance, 100 MHz burst read/write capability, industrial temperature support (–40°C to +85°C), and compatibility with JEDEC-standard 119-ball BGA (BGG) packaging.
Technical Context
The 71V65903S85BGGI implements a synchronous, clock-driven architecture where address/control registration occurs on the rising CLK edge, and data transfer occurs one cycle later. Its internal burst counter supports linear or interleaved 4-word bursts controlled by the static LBO pin, with ADV/LD determining whether to load a new external address (low) or increment the counter (high).
ZBT operation eliminates dead cycles between read and write transitions via synchronized output buffer enable and single R/W control. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, and includes asynchronous ZZ sleep mode and OE for output control - enabling low-power retention and flexible bus management in multi-SRAM systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9.4 Mbit); supports x18 data width only - no x36 mode in this variant |
| Clock Frequency | 100 MHz max; enables 10 ns cycle time for sustained burst transfers |
| Access Time | 7.5 ns clock-to-data (tCD); guarantees deterministic read latency for real-time packet buffering |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for telecom and industrial embedded environments |
| Burst Capability | 4-word linear/interleaved burst; reduces address bus traffic and improves throughput in sequential access patterns |
| Byte Write Control | BW1–BW2 (x18 config); enables selective 9-bit byte writes without masking logic in controller |
Pinout & Package
Packaged in a JEDEC-standard 119-ball fine-pitch ball grid array (fBGA), designated BGG119 per IDT documentation. Pin pitch is 0.8 mm; package body size is 12 mm × 12 mm. This variant (71V65903S85BGGI) corresponds to the 512K × 18 configuration and uses the BG119/BGG119 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit synchronous address bus; A0–A18 fully utilized for 512K × 18 addressing (219 = 524,288 words) |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; allow hierarchical depth expansion without external logic |
| R/W | Read/Write Control | Single synchronous signal defining cycle type; eliminates need for separate RD/WR pins and simplifies controller interface |
| ADV/LD | Advance Burst Address / Load New Address | Synchronous control: low loads new external address; high increments internal burst counter - critical for burst sequencing |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst sequence; ties directly to system bus protocol requirements (e.g., PCI-X vs. custom ASIC) |
| BW1, BW2 | Individual Byte Write Enables | Two active-low enables for 9-bit bytes (I/O[0:8], I/O[9:17]); supports partial writes without full-word overwrite overhead |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge - defines maximum system bandwidth |
| ZZ | Sleep Mode Input | Asynchronous high-assertion gates internal clock and reduces ICC to ≤10 µA; retains data during low-power standby |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O Pins | 18 data bits + 2 parity bits; flow-through outputs eliminate output register delay - essential for ZBT timing compliance |
Key Features
| Feature | Design Value |
|---|---|
| Zero Bus Turnaround (ZBT) | Eliminates dead cycles between read/write transitions - enables back-to-back memory operations at full 100 MHz |
| Flow-Through Outputs | No output register; data appears on I/O pins with fixed tCD delay - removes output timing uncertainty for timing-critical designs |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential accesses; supported in both linear and interleaved modes |
| Separate VDD/VDDQ Supplies | Isolates core logic noise from I/O switching noise - improves signal integrity in high-speed parallel bus implementations |
| Industrial Temperature Range | Qualified from –40°C to +85°C - suitable for uncontrolled environments like base station cabinets and industrial PLCs |
| Asynchronous Sleep (ZZ) | Reduces standby current to microamp level while retaining memory contents - extends uptime in battery-backed systems |
Applications
| Telecom Packet Buffering | Network Processor Interface |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line cards before classification or forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to network processor's parallel bus. Use Value: ZBT and 100 MHz burst capability enable sustained 1.8 Gbps (18-bit × 100 MHz) throughput without wait states. |
Use Scenario: Acting as instruction/data cache for programmable network processors handling deep packet inspection. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access to microcode and packet metadata tables. Use Value: Flow-through outputs and 7.5 ns tCD ensure pipeline-aligned reads/writes matching processor clock domain. |
| Industrial PLC Data Logging | Medical Imaging Frame Store |
|
Use Scenario: Capturing sensor history or motion-control trajectory data in real-time automation systems. IC Role / Device Role / Timing Role: Non-volatile-retentive buffer holding timestamped process variables between controller polls. Use Value: Industrial temp rating and ZZ sleep mode allow reliable operation in hot enclosures with periodic power gating. |
Use Scenario: Temporary storage of uncompressed ultrasound or MRI frame data prior to compression or display rendering. IC Role / Device Role / Timing Role: High-speed frame buffer interfacing to FPGA-based image acquisition engines. Use Value: 512K × 18 organization matches common 16-bit pixel + 2-bit metadata formats; burst mode accelerates full-frame reads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-100AXC | 512K × 18, 100 MHz, but uses QDR-II architecture with separate read/write ports; no ZBT or flow-through outputs | Requires dual-port controller logic; better for simultaneous read/write; unsuitable for ZBT-constrained legacy buses | Select when system needs concurrent access - not for drop-in replacement of 71V65903S85BGGI |
| AS7C35128PFS-100BIN | 512K × 18, 100 MHz, standard sync SRAM (no ZBT); 10 ns tCD; different pinout and no burst counter | Lacks burst capability and zero-turnaround - requires more address cycles and controller overhead for sequential access | Use only if ZBT and burst features are unnecessary and PCB layout allows rework for non-compatible pin mapping |
Compared with CY7C1371BV33-100AXC and AS7C35128PFS-100BIN, the 71V65903S85BGGI uniquely delivers ZBT timing, flow-through outputs, and integrated burst counter in a JEDEC BGG119 package - making it irreplaceable in legacy telecom and ASIC-coherent designs requiring strict cycle-deterministic behavior.
Availability
71V65903S85BGGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.
Supply support for 71V65903S85BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V65903 belongs to IDT's ZBT SRAM product line, designed specifically for high-speed packet processing, network switching, and ASIC/FPGA co-processor memory interfaces demanding zero bus turnaround and deterministic latency.
FAQ
What memory organization does the 71V65903S85BGGI support?
The 71V65903S85BGGI is configured exclusively as 512K × 18 (9.4 Mbit), with 19 address lines (A0–A18) and 18 data bits plus two parity bits (I/O0–I/O17, I/OP1–I/OP2). Unlike the 71V65703, it does not support the 256K × 36 mode - this is a fixed x18 device per its BGG119 pinout and functional description.
Does the 71V65903S85BGGI support burst read and write operations?
Yes, the 71V65903S85BGGI supports 4-word synchronous bursts in both linear and interleaved sequences, controlled by the LBO pin. Burst initiation requires ADV/LD = HIGH after initial address load, and burst cycles execute automatically with internal counter advancement - reducing controller address bus burden significantly.
What is the purpose of the ZZ pin on the 71V65903S85BGGI?
The ZZ pin on the 71V65903S85BGGI is an asynchronous sleep mode input. When driven HIGH, it internally gates the CLK signal and reduces ICC to ≤10 µA while guaranteeing full data retention - enabling ultra-low-power standby in battery-backed or thermally constrained applications without external power sequencing.
How does the 71V65903S85BGGI achieve zero bus turnaround (ZBT)?
The 71V65903S85BGGI achieves ZBT through internally synchronized output buffer enable (eliminating external OE timing constraints) and a single R/W control pin that removes bus direction arbitration delays. Combined with flow-through outputs and deterministic 7.5 ns tCD, it enables immediate read-after-write or write-after-read transitions at 100 MHz without dead cycles.
Is the 71V65903S85BGGI compatible with commercial-grade systems?
No - the 71V65903S85BGGI is specified only for industrial temperature operation (–40°C to +85°C) and carries the 'I' suffix in its ordering code. It is not rated or tested for commercial 0°C to +70°C use; systems requiring commercial grade must select alternate variants such as the 71V65903S85BG or verify qualification data separately.
71V65903S85BGGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65903S85BGGI FAQ
1.How can I place an order for 71V65903S85BGGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65903S85BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65903S85BGGI reliable?
The price and inventory of 71V65903S85BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S85BGGI is usually 5 days.
3.What payment methods are accepted for 71V65903S85BGGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65903S85BGGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65903S85BGGI?
71V65903S85BGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65903S85BGGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65903S85BGGI?
For technical support, including 71V65903S85BGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S85BGGI requirements.
6.How does Aetrix verify that 71V65903S85BGGI is sourced from the original manufacturer or authorized distributors?
All 71V65903S85BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85BGGI meets industry standards.
7.What is the process for return or replacement of 71V65903S85BGGI?
All 71V65903S85BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85BGGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65903S85BGGI part is unused and in its original packaging.
Return procedure for 71V65903S85BGGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65903S85BGGI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

