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Renesas 71V65903S85BQG8

Part No.:
71V65903S85BQG8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65903S85BQG8.pdf
Description:
IC SRAM 9MBIT PARALLEL 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,897

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Product details

Overview

71V65903S85BQG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 bits (9,437,184-bit capacity), supporting 100 MHz operation with 7.5 ns clock-to-data access time. It implements zero bus turnaround (ZBT) architecture to eliminate dead cycles between read/write transitions, features flow-through outputs, and includes an on-chip burst counter for 4-word interleaved or linear bursts - used in high-speed networking packet buffers and telecom line-card memory subsystems.

For engineers reviewing the 71V65903S85BQG8 datasheet, 71V65903S85BQG8 pinout, 71V65903S85BQG8 application, or 71V65903S85BQG8 equivalent, key selection criteria include its 100 MHz synchronous interface, 3.3V core/I/O supply, industrial temperature range (–40°C to +85°C), TQFP-100 package, and support for individual byte write control via BW1–BW2 pins in x18 configuration.

Technical Context

The 71V65903S85BQG8 uses a synchronous CMOS architecture with registered address/control inputs triggered on the rising edge of CLK, while data outputs are flow-through (no output register). Its internal burst counter advances on ADV/LD = HIGH and loads new addresses on ADV/LD = LOW, with burst order selected by static LBO pin (interleaved when high, linear when low).

It supports three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, asynchronous OE and ZZ controls, and Clock Enable (CEN) to suspend operation without disrupting internal state. The device guarantees data retention in ZZ sleep mode and tri-states the I/O bus one cycle after deselection.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 (9.4 Mbit); supports x18 data width with dedicated I/O[0:15] and I/OP1–I/OP2 pins
Clock Frequency 100 MHz max; enables 10 ns cycle time for high-throughput packet buffering in switch fabric interfaces
Access Time 7.5 ns clock-to-data (tCD); defines minimum latency from CLK edge to valid output data
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies allow I/O voltage domain isolation
Operating Temperature –40°C to +85°C (industrial grade); qualified for base station and carrier-grade equipment deployment
Burst Capability 4-word burst (interleaved or linear); reduces address bus traffic and improves bandwidth efficiency in sequential accesses
Byte Write Control BW1–BW2 active-low enables per-9-bit byte write in x18 mode; allows partial word updates without read-modify-write

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant (suffix "G" in part number). Pin 1 marked by dot; top-side marking includes "71V65903S85BQG8" and date code.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs Synchronous 19-bit address bus; A0–A18 fully utilized in 512K×18 mode (A18 required)
CE1, CE2, CE2 Chip Enables Three independent enables: CE1/CE2 active-low, CE2 active-high; enable depth expansion with no external logic
R/W Read/Write Control Synchronous signal sampled at CLK rise; determines cycle type (read or write) for loaded address
ADV/LD Advance Burst / Load Address LOW loads new external address; HIGH increments internal burst counter - critical for burst sequencing
LBO Linear/Interleaved Burst Order Static input: HIGH = interleaved burst (e.g., IEEE 802.3ad), LOW = linear (sequential addressing)
BW1, BW2 Byte Write Enables Active-low per-byte controls for I/O[0:7]/I/OP1 and I/O[8:15]/I/OP2; enables granular 9-bit writes in x18 mode
CLK System Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge (tCYC = 10 ns @ 100 MHz)
OE Asynchronous Output Enable Active-low; forces I/O pins to high-Z regardless of clock state - useful for bus sharing and hot-swap
ZZ Asynchronous Sleep Mode Active-high; gates internal clock and reduces ICC to ≤10 µA while retaining memory contents
I/O0–I/O15, I/OP1–I/OP2 Data I/O Pins 18-bit bidirectional data path; flow-through outputs (no latch), registered inputs; VDDQ-referenced I/O

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates idle cycles between consecutive read/write operations - increases effective bus utilization by up to 30% in mixed-access workloads
Flow-Through Outputs Output data appears one clock cycle after address/control setup without additional latency from output registers - critical for deterministic timing in pipeline stages
On-Chip 4-Word Burst Counter Reduces external address generation logic; supports both linear and interleaved sequences via LBO pin - simplifies FPGA interface design
Individual Byte Write (x18) BW1/BW2 allow selective 9-bit writes without disturbing adjacent bytes - essential for header modification in packet processing engines
Three Chip Enables with Mixed Polarity CE1/CE2 (active-low) + CE2 (active-high) enable seamless depth expansion across multiple devices using minimal glue logic

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: Storing and forwarding Ethernet frames in Layer 2 switches with deep buffer requirements.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory for ingress/egress packet queues with burst-mode DMA access.

Use Value: 100 MHz clock rate and ZBT architecture sustain >800 MB/s sustained throughput under mixed read/write load - meeting RFC 2544 latency targets.

Use Scenario: Buffering variable-length packets in 10G/25G optical transport equipment with real-time scheduling.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as first-level packet memory with deterministic 7.5 ns tCD for timestamp alignment.

Use Value: Flow-through outputs and burst capability reduce CPU/FPGA overhead by 40% compared to discrete latch-based solutions.

Industrial PLC Backplanes Avionics Data Recorders

Use Scenario: Real-time I/O mapping and cyclic process data exchange in modular automation controllers.

IC Role / Device Role / Timing Role: Deterministic memory for cyclic buffer management in safety-critical motion control loops.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable operation during thermal transients and power-save states.

Use Scenario: High-integrity flight data recording with guaranteed retention during brownout or vibration-induced power loss.

IC Role / Device Role / Timing Role: Nonvolatile-buffered memory staging point before flash write, leveraging data retention in ZZ mode.

Use Value: Asynchronous ZZ pin enables immediate entry into ultra-low-power retention (<10 µA) without clock or software coordination.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-100AXC 512K × 18, 100 MHz, but uses QDR-II+ architecture with separate read/write ports and differential clocks Requires differential clock routing and dual-port controller logic; not drop-in compatible Select only if system already uses QDR-II+ infrastructure and requires concurrent read/write bandwidth
AS7C35128PFS-10BIN 512K × 18, 100 MHz, but lacks ZBT and burst counter; uses standard sync SRAM timing with OE-controlled outputs No zero bus turnaround or burst addressing - adds 1–2 cycle penalties between read/write transitions Choose when cost sensitivity outweighs performance needs and existing PCB layout cannot accommodate ZBT-specific timing constraints

Compared with CY7C1371DV33-100AXC and AS7C35128PFS-10BIN, the 71V65903S85BQG8 delivers deterministic ZBT timing and integrated burst control in a single TQFP-100 package - reducing FPGA resource usage and simplifying timing closure in high-speed packet-processing designs.

Availability

71V65903S85BQG8 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, industrial PLC backplanes, and avionics data recorders requiring stable component supply across extended product lifecycles.

Supply support for 71V65903S85BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), acquired by Renesas Electronics in 2019, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing infrastructure.

The 71V65903S85BQG8 belongs to IDT's ZBT™ SRAM family, designed specifically for low-latency, high-bandwidth memory subsystems in carrier-grade networking and real-time industrial control systems.

FAQ

What is the maximum operating frequency of the 71V65903S85BQG8?

The 71V65903S85BQG8 is rated for 100 MHz operation, corresponding to a 10 ns clock cycle time. This is validated across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. Its 7.5 ns clock-to-data access time ensures data validity within the first half of the subsequent cycle, enabling tight timing margins in high-speed interfaces.

Does the 71V65903S85BQG8 support burst mode in 512K × 18 configuration?

Yes, the 71V65903S85BQG8 supports 4-word burst mode in both 256K × 36 and 512K × 18 configurations. In x18 mode, burst addressing uses A0–A18 with LBO selecting interleaved or linear sequence. The internal burst counter advances on ADV/LD = HIGH, eliminating need for external address generation logic.

How does the ZBT™ architecture of the 71V65903S85BQG8 improve system performance?

The ZBT™ architecture in the 71V65903S85BQG8 eliminates dead cycles between read and write operations by allowing immediate bus direction reversal. Unlike conventional synchronous SRAMs requiring wait states, it achieves continuous data flow - increasing effective bandwidth by up to 30% in mixed-access scenarios typical of packet buffering and real-time control.

What is the function of the CE2 pin on the 71V65903S85BQG8?

The CE2 pin on the 71V65903S85BQG8 is an active-high chip enable, complementary in polarity to CE1 and CE2 (both active-low). It enables flexible depth expansion: asserting CE1 = LOW, CE2 = LOW, and CE2 = HIGH selects the device; any deviation (e.g., CE2 = LOW) deselects it - allowing hierarchical memory decoding with minimal external logic.

Can the 71V65903S85BQG8 retain data during power-down?

Yes, the 71V65903S85BQG8 retains data in Sleep Mode when the ZZ pin is driven HIGH. In this state, internal clock gating reduces ICC to ≤10 µA while maintaining full memory content integrity. Data retention is guaranteed over the full industrial temperature range and requires only VDD/VDDQ bias - no backup battery or capacitor needed.

71V65903S85BQG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65903S85BQG8 FAQ

1.How can I place an order for 71V65903S85BQG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65903S85BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65903S85BQG8 reliable?

The price and inventory of 71V65903S85BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S85BQG8 is usually 5 days.

3.What payment methods are accepted for 71V65903S85BQG8?

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4.How is shipping managed for 71V65903S85BQG8?

71V65903S85BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65903S85BQG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65903S85BQG8?

For technical support, including 71V65903S85BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S85BQG8 requirements.

6.How does Aetrix verify that 71V65903S85BQG8 is sourced from the original manufacturer or authorized distributors?

All 71V65903S85BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85BQG8 meets industry standards.

7.What is the process for return or replacement of 71V65903S85BQG8?

All 71V65903S85BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85BQG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65903S85BQG8 part is unused and in its original packaging.

Return procedure for 71V65903S85BQG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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